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MT18HTF25672FDZ-667H1N8

P1-P3P4-P6P7-P9P10-P11
Table 14: Serial Presence-Detect EEPROM AC Operating Conditions (Continued)
Parameter/Condition Symbol Min Max Units Notes
WRITE cycle time
t
WRC – 10 ms 4
Notes:
1. To avoid spurious start and stop conditions, a minimum delay is placed between SCL = 1
and the falling or rising edge of SDA.
2. This parameter is sampled.
3. For a restart condition, or following a WRITE cycle.
4. The SPD EEPROM WRITE cycle time (
t
WRC) is the time from a valid stop condition of a
write sequence to the end of the EEPROM internal ERASE/PROGRAM cycle. During the
WRITE cycle, the EEPROM bus interface circuit is disabled, SDA remains HIGH due to
pull-up resistance, and the EEPROM does not respond to its slave address.
1GB, 2GB (x72, DR) 240-Pin DDR2 SDRAM FBDIMM
Serial Presence-Detect
PDF: 09005aef83d4d75e
htf18c128_256x72fdz.pdf - Rev. C 4/14 EN
10
Micron Technology, Inc. reserves the right to change products or specifications without notice.
© 2009 Micron Technology, Inc. All rights reserved.
Module Dimensions
Figure 4: 240-Pin DDR2 FBDIMM
30.5 (1.201)
30.2 (1.189)
Pin 1
17.3 (0.681)
TYP
2.60 (0.102) D
(2X)
5.2 (0.205)
TYP
5.0 (0.197) TYP
123.0 (4.843)
TYP
1.0 (0.039)
TYP
0.80 (0.031)
TYP
1.5 (0.059) R
(4X)
0.75 (0.03) R
Pin 120
Front view
133.50 (5.256)
133.20 (5.244)
67.0 (2.638)
TYP
51.0 (2.01)
TYP
9.5 (0.374)
TYP
Back view
Pin 240
Pin 121
1.25 (0.0492)
TYP
66.68 (2.63) TYP
0.595 (0.0234) R
2.0 (0.079)
TYP
3.9 (0.153)
TYP
(x2)
120° (2X)
2.18 (0.086) TYP
74.68 (2.94)
TYP
3.05 (0.120) TYP
66.68 (2.63)
TYP
24.95 (0.982)
TYP
Detail A
Detail A
1.19 (0.047)
1.06 (0.042)
1.06 (0.042)
45° x 0.18 (0.0071)
0.5 (0.02) R
(4X)
0.75 (0.030) R 8X
9.9 (0.39)
TYP
(X4)
Front view with heat spreader
Back view with heat spreader
3.1 (0.122) TYP
5.48 (0.216)
TYP
U1
U20
U2 U3 U4
U5
U6 U7
U8
U9
U10 U11
U12
U13
U14
U15
U16
U17 U18 U19
U20
U1 U2 U3 U4
U5
U6 U7
U8
U9
U10 U11
U12
U13
U14
U15
U16
U17 U18 U19
1.37 (0.054)
1.17 (0.046)
5.1 (0.201)
MAX
7.68 (0.302)
MAX*
1.37 (0.054)
1.17 (0.046)
*Including clip radius
7.92 (0.312) MAX
Notes:
1. All dimensions are in millimeters (inches); MAX/MIN or typical (TYP) where noted.
2. The dimensional diagram is for reference only. Refer to the JEDEC MO document for ad-
ditional design dimensions.
8000 S. Federal Way, P.O. Box 6, Boise, ID 83707-0006, Tel: 208-368-3900
www.micron.com/productsupport Customer Comment Line: 800-932-4992
Micron and the Micron logo are trademarks of Micron Technology, Inc.
All other trademarks are the property of their respective owners.
This data sheet contains minimum and maximum limits specified over the power supply and temperature range set forth herein.
Although considered final, these specifications are subject to change, as further product development and data characterization some-
times occur.
1GB, 2GB (x72, DR) 240-Pin DDR2 SDRAM FBDIMM
Module Dimensions
PDF: 09005aef83d4d75e
htf18c128_256x72fdz.pdf - Rev. C 4/14 EN
11
Micron Technology, Inc. reserves the right to change products or specifications without notice.
© 2009 Micron Technology, Inc. All rights reserved.
P1-P3P4-P6P7-P9P10-P11

MT18HTF25672FDZ-667H1N8

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Manufacturer:
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Description:
MODULE DDR2 SDRAM 2GB 240FBDIMM
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