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There are 4 types of faults, and each fault has a
direct and indirect effect on the Enable/Fault pin
and the internal fault flag. In a typical application
where there are multiple MP5003 chips in a
system, the enable/fault lines are typically
connected together.
UNDER VOLTAGE LOCK OUT OPERATION
If the supply (input) is below the UVLO threshold,
the output is disabled, and the fault line is driven
low.
When the supply goes above the UVLO
threshold, the output is enabled and the
Enable/fault pin is released. When the
Enable/fault pin is released it will be pulled high
by a 25uA current source. No external pull up
resistor is required. In addition, the pull up
voltage is limited to 5 volts.
Table 3—Fault Function Influence in Application
Fault description Internal action
Effect on Fault
Pin
Effect on
Flag
Effect on secondary Part
Short/over current Limit current none none none
Under Voltage Output is turned off
Internally drives
Enable/Fault pin to
Logic low
Flag is
reset
Secondary part output is
disabled, and fault flag is
reset.
Over Voltage Limit output voltage None None None
Thermal Shutdown
Shutdown part. The
part retries to start
up automatically
Internally drives
Enable/Fault pin
to low level, and
after part cools
down, Enable/Fault
pin will be pulled
high
Flag is Set
at thermal
shut down,
and is set
to high
after auto
start up.
Secondary part output is
disabled when thermal
shut down, and is enabled
after MP5003 auto start up.
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THERMAL PROTECTION
The MP5003 only considers a thermal overload
to be a fault. Under a fault condition the MP5003
will have two actions:
1) Turn off the output power device.
2) Drive the enable/fault pin to the low level.
The power device will remain off until the die
temperature drops below the hysteresis level.
When the die cools down below the thermal
hysteresis level, the MP5003 will restart in the
start up mode and the fault line will be pulled high
through a 25uA pull up current. If the cause of
the fault has been removed, the output will ramp
up in a controlled fashion with the ramp rate
controlled by the dv/dt function. If the cause of
the fault is still present, the excess power
dissipation will heat up the part. When the die
temperature reaches the thermal shutdown
temperature, the output will be turned off and the
enable/fault pin will be driven to the low level.
This cycle will repeat until the cause of the fault is
removed.
Output Voltage
UVLO Threshold
Input Voltage
Output Short (Cause of Fault)
Die Temperature
Thermal Shutdown Temp
Thermal Hysteresis
Fault/Enable Pin
Output Current
Normal operating current
Current Limit
T0
T1
T4
T2
T3
T5
T6
T7
Figure 3Thermal Protection in Short Condition
The drawing above shows the initial start up
sequence and the occurrence of a short at the
output.
At time T0 the input voltage begins to rise. At T1
the input voltage rises above the UVLO threshold
and the part starts up. The output current ramps
up and settles in at the normal operating current
level until time T2. There is a very small
temperature heating of the die in normal
operation.
At time T2 the output is shorted. This brings the
output very close to ground. The output current
increases to the current limit level and is held
there by the MP5003. Because of the large
current and the large voltage across the power
device, the die will begin to heat up.
At time T3 the die temperature is at the thermal
shutdown level and the part will turn the power
device off. The enable/fault pin is driven to the
low level. Once the power device is off, the die
temperature will begin to drop.
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At time T4 the part has cooled down below the
thermal hysteresis level. The enable pin goes
high and the part turns on again. But the short is
still present, causing the die temperature to
increase. At time T5 the power device turns off
and the Enable/Fault pin is driven to the low
level, again. The temperature begins to fall.
The cycle between times T3, T4 and T5 could
repeat indefinitely, but at time T6 the short is
removed. At time T7 the die temperature is below
the thermal hysteresis level and the part turns on
once again. This time there is no short, so the
output starts in normal operation and the die
temperature cools down to the normal operating
range.
PCB LAYOUT
PCB layout is very important to achieve stable
operation. Please follow these guidelines and
take below figure for reference.
Place Rlimit close to Ilimit pin, Cdv/dt close to
dv/dt pin and input cap close to VIN (Exposed
Pad). Keep the N/C pin float. Put vias in thermal
pad and ensure enough copper area near VIN
and VOUT to achieve better thermal
performance.
C2
C4
R
LIMIT Cdv/dt
Top Layer Bottom Layer
Figure 4—PCB Layout

MP5003EQ-LF-Z

Mfr. #:
Manufacturer:
Monolithic Power Systems (MPS)
Description:
Hot Swap Voltage Controllers 3.3V 1A-5A Prog Current Limit Switch
Lifecycle:
New from this manufacturer.
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