Data Sheet AD8613/AD8617/AD8619
Rev. H | Page 13 of 16
Figure 39. 14-Lead Standard Small Outline Package [SOIC_N]
Narrow Body (R-14)
Dimensions shown in millimeters and (inches)
Figure 40. 14-Lead Thin Shrink Small Outline Package [TSSOP]
(RU-14)
Dimensions shown in millimeters
CONTROLLING DIMENSIONS ARE IN MILLIMETERS; INCH DIMENSIONS
(IN PARENTHESES) ARE ROUNDED-OFF MILLIMETER EQUIVALENTS FOR
REFERENCE ONLY AND ARE NOT APPROPRIATE FOR USE IN DESIGN.
COMPLIANT TO JEDEC STANDARDS MS-012-AB
060606-A
14
8
7
1
6.20 (0.2441)
5.80 (0.2283)
4.00 (0.1575)
3.80 (0.1496)
8.75 (0.3445)
8.55 (0.3366)
1.27 (0.0500)
BSC
SEATING
PLANE
0.25 (0.0098)
0.10 (0.0039)
0.51 (0.0201)
0.31 (0.0122)
1.75 (0.0689)
1.35 (0.0531)
0.50 (0.0197)
0.25 (0.0098)
1.27 (0.0500)
0.40 (0.0157)
0.25 (0.0098)
0.17 (0.0067)
COPLANARITY
0.10
45°
COMPLIANT TO JEDEC STANDARDS MO-153-AB-1
061908-A
4.50
4.40
4.30
14
8
7
1
6.40
BSC
PIN 1
5.10
5.00
4.90
0.65 BSC
0.15
0.05
0.30
0.19
1.20
MAX
1.05
1.00
0.80
0.20
0.09
0.75
0.60
0.45
COPLANARITY
0.10
SEATING
PLANE
AD8613/AD8617/AD8619 Data Sheet
Rev. H | Page 14 of 16
Figure 41. 5-Lead Thin Shrink Small Outline Transistor Package [SC70]
(KS-5)
Dimensions shown in millimeters
Figure 42. 5-Lead Thin Small Outline Transistor Package [TSOT-23]
(UJ-5)
Dimensions shown in millimeters
COMPLIANT TO JEDEC STANDARDS MO-203-AA
1.00
0.90
0.70
0.46
0.36
0.26
2.20
2.00
1.80
2.40
2.10
1.80
1.35
1.25
1.15
072809-A
0.10 MAX
1.10
0.80
0.40
0.10
0.22
0.08
312
45
0.65 BSC
COPLANARITY
0.10
SEATING
PLANE
0.30
0.15
100708-A
*
COMPLIANT TO JEDEC STANDARDS MO-193-AB WITH
THE EXCEPTION OF PACKAGE HEIGHT AND THICKNESS.
1.60 BSC
2.80 BSC
1.90
BSC
0.95 BSC
0.20
0.08
0.60
0.45
0.30
0.50
0.30
0.10 MAX
*
1.00 MAX
*
0.90 MAX
0.70 MIN
2.90 BSC
54
123
SEATING
PLANE
Data Sheet AD8613/AD8617/AD8619
Rev. H | Page 15 of 16
Figure 43. 8-Lead Lead Frame Chip Scale Package [LFCSP]
3 mm × 3 mm Body and 0.75 mm Package Height
(CP-8-21)
Dimensions shown in millimeters
ORDERING GUIDE
Model
1, 2
Temperature Range Package Description Package Option Branding
AD8613AKSZ-R2 −40°C to +125°C 5-Lead SC70 KS-5 A0Y
AD8613AKSZ-REEL −40°C to +125°C 5-Lead SC70 KS-5 A0Y
AD8613AKSZ-REEL7 −40°C to +125°C 5-Lead SC70 KS-5 A0Y
AD8613AUJZ-R2 −40°C to +125°C 5-Lead TSOT-23 UJ-5 A0Y
AD8613AUJZ-REEL −40°C to +125°C 5-Lead TSOT-23 UJ-5 A0Y
AD8613AUJZ-REEL7 −40°C to +125°C 5-Lead TSOT-23 UJ-5 A0Y
AD8617ACPZ-R2 −40°C to +125°C 8-Lead LFCSP CP-8-21 A0T
AD8617ACPZ-R7 −40°C to +125°C 8-Lead LFCSP CP-8-21 A0T
AD8617ARMZ −40°C to +125°C 8-Lead MSOP RM-8 A0T
AD8617ARMZ-REEL −40°C to +125°C 8-Lead MSOP RM-8 A0T
AD8617ARZ −40°C to +125°C 8-Lead SOIC_N R-8
AD8617ARZ-REEL −40°C to +125°C 8-Lead SOIC_N R-8
AD8617ARZ-REEL7 −40°C to +125°C 8-Lead SOIC_N R-8
AD8617WARMZ-REEL −40°C to +125°C 8-Lead MSOP RM-8 A23
AD8617WARZ-RL −40°C to +125°C 8-Lead SOIC_N R-8
AD8617WARZ-R7 −40°C to +125°C 8-Lead SOIC_N R-8
AD8619ARUZ −40°C to +125°C 14-Lead TSSOP RU-14
AD8619ARUZ-REEL −40°C to +125°C 14-Lead TSSOP RU-14
AD8619ARZ −40°C to +125°C 14-Lead SOIC_N R-14
AD8619ARZ-REEL7 −40°C to +125°C 14-Lead SOIC_N R-14
AD8619WARZ-RL −40°C to +125°C 14-Lead SOIC_N R-14
AD8619WARZ-R7 −40°C to +125°C 14-Lead SOIC_N R-14
AD8619WARUZ-R7 −40°C to +125°C 14-Lead TSSOP RU-14
AD8619WARUZ-RL −40°C to +125°C 14-Lead TSSOP RU-14
1
Z = RoHS Compliant Part.
2
W = Qualified for Automotive Applications.
2.54
2.44
2.34
0.50
0.40
0.30
TOP VIEW
8
1
5
4
0.30
0.25
0.20
BOTTOM VIEW
PIN 1 INDEX
AREA
SEATING
PLANE
0.80
0.75
0.70
1.70
1.60
1.50
0.203 REF
0.20 MIN
0.05 MAX
0.02 NOM
0.50 BSC
EXPOSED
PAD
P
I
N
1
I
N
D
I
C
A
T
O
R
(
R
0
.
2
0
)
FOR PROPER CONNECTION OF
THE EXPOSED PAD, REFER TO
THE PIN CONFIGURATION AND
FUNCTION DESCRIPTIONS
SECTION OF THIS DATA SHEET.
12-03-2013-A
PKG-004371
3.10
3.00 SQ
2.90

AD8617ARZ-REEL

Mfr. #:
Manufacturer:
Analog Devices Inc.
Description:
Precision Amplifiers Micropwr Low Noise CMOS RRIO Dual
Lifecycle:
New from this manufacturer.
Delivery:
DHL FedEx Ups TNT EMS
Payment:
T/T Paypal Visa MoneyGram Western Union