A3909GLYTR-T

Dual Full Bridge Motor Driver
A3909
7
Allegro MicroSystems, LLC
115 Northeast Cutoff
Worcester, Massachusetts 01615-0036 U.S.A.
1.508.853.5000; www.allegromicro.com
Application Information
Configuration for parallel operation with 1.8 A output current capability
Input Output Pin Structures
OUT4
OUT
A3909
1
OUT2
IN1
1
2
3
4
5
10
9
8
7
6
IN2
VBB
Load
System
Controller
Supply
DC Motor
IN3
PAD
(LY package)
IN4
GND
OUT3
GND
OUT1
OUT2
OUT3
OUT4
IN1
IN4
IN2
IN3
50 kΩ
V
BB
V
BB
21V
6.5 V
VBB
50 kΩ
21 V
LY package board via layout for thermal dissipationLN package board
Dual Full Bridge Motor Driver
A3909
8
Allegro MicroSystems, LLC
115 Northeast Cutoff
Worcester, Massachusetts 01615-0036 U.S.A.
1.508.853.5000; www.allegromicro.com
Package LN, 10-Pin SSOP
Terminal #1 mark area
A
1.55 ±0.20
1.00
BSC
21
10
A
C
C
0.21 ±0.04
1.05 (REF)
0.25
0.10
0° to 8°
4.90 ±0.20
3.90 ±0.10 6.00 ±0.20
4.95
2
1
10
0.65
1.00
2.25
0.45
0.30
1.27
0.40
For Reference Only; not for tooling use
Dimensions in millimeters
Dimensions exclusive of mold flash, gate burrs, and dambar protrusions
Exact case and lead configuration at supplier discretion within limits shown
Branded Face
PCB Layout Reference View
Reference land pattern layout. All pads a minimum of 0.20 mm from all
adjacent pads; adjust as necessary to meet application process
requirements and PCB layout tolerances; when mounting on a multilayer
PCB, thermal vias near the pin lands can improve thermal dissipation
(reference EIA/JEDEC Standard JESD51-7)
B
N = Device part number
= Supplier emblem
Y = Last two digits of year of manufacture
W = Week of manufacture
L = Lot number
NNNNNNN
LLLL
1
YYWW
Standard Branding Reference View
B
Branding scale and appearance at supplier discretion
Dual Full Bridge Motor Driver
A3909
9
Allegro MicroSystems, LLC
115 Northeast Cutoff
Worcester, Massachusetts 01615-0036 U.S.A.
1.508.853.5000; www.allegromicro.com
Package LY, 10-Pin MSOP
With Exposed Thermal Pad
Terminal #1 mark area
A
Gauge Plane
Seating Plane
0.86 ±0.05
SEATING
PLANE
0.50
REF
0.25
21
10
21
10
A
B
C
C
0.53 ±0.10
0.15 ±0.05
0.05
0.15
0° to 6°
3.00 ±0.10
3.00 ±0.10 4.88 ±0.20 1.73 4.60
1.98
1.98 MIN
1.73
21
10
1
0.30
0.50
1.65
0.27
0.18
For Reference Only; not for tooling use (reference JEDEC MO-187BA-T)
Dimensions in millimeters
Dimensions exclusive of mold flash, gate burrs, and dambar protrusions
Exact case and lead configuration at supplier discretion within limits shown
B
Exposed thermal pad (bottom surface)
Reference land pattern layout (reference IPC7351 SOP50P490X110-11M)
All pads a minimum of 0.20 mm from all adjacent pads; adjust as necessary
to meet application process requirements and PCB layout tolerances; when
mounting on a multilayer PCB, thermal vias at the exposed thermal pad land
can improve thermal dissipation (reference EIA/JEDEC Standard JESD51-5)

A3909GLYTR-T

Mfr. #:
Manufacturer:
Description:
IC MOTOR DRIVER PAR 10MSOP
Lifecycle:
New from this manufacturer.
Delivery:
DHL FedEx Ups TNT EMS
Payment:
T/T Paypal Visa MoneyGram Western Union

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