Enhanced Product ADA4930-1-EP
Rev. B | Page 7 of 12
ABSOLUTE MAXIMUM RATINGS
Table 7.
Parameter Rating
Supply Voltage 5.5 V
Storage Temperature Range −65°C to +125°C
Operating Temperature Range −55°C to +105°C
Lead Temperature (Soldering, 10 sec) 300°C
Junction Temperature 150°C
Stresses at or above those listed under Absolute Maximum
Ratings may cause permanent damage to the product. This is a
stress rating only; functional operation of the product at these
or any other conditions above those indicated in the operational
section of this specification is not implied. Operation beyond
the maximum operating conditions for extended periods may
affect product reliability.
THERMAL RESISTANCE
θ
JA
is specified for the device (including exposed pad) soldered
to a high thermal conductivity 2s2p circuit board, as described
in EIA/JESD51-7.The θ
JA
for the 16-Lead LFCSP(exposed pad)
package is 81.6 °C/W.
MAXIMUM POWER DISSIPATION
The maximum safe power dissipation in the ADA4930-1-EP package
is limited by the associated rise in junction temperature (T
J
) on the
die. At approximately 150°C, which is the glass transition
temperature, the plastic changes its properties. Even temporarily
exceeding this temperature limit can change the stresses that the
package exerts on the die, permanently shifting the parametric
performance of the ADA4930-1-EP. Exceeding a junction
temperature of 150°C for an extended period can result in
changes in the silicon devices, potentially causing failure.
The power dissipated in the package (P
D
) is the sum of the
quiescent power dissipation and the power dissipated in the
package due to the load drive. The quiescent power is the voltage
between the supply pins (V
S
) times the quiescent current (I
S
).
The power dissipated due to the load drive depends on the
particular application. The power due to load drive is calculated
by multiplying the load current by the associated voltage drop
across the device. RMS voltages and currents must be used in
these calculations.
Airflow increases heat dissipation, effectively reducing θ
JA
. In
addition, more metal directly in contact with the package leads/
exposed pad from metal traces, through holes, ground, and
power planes reduces θ
JA
.
Figure 3 shows the maximum safe power dissipation vs. the
ambient temperature for the ADA4930-1-EP single 16-lead
LFCSP (81.6°C/W) on a JEDEC standard 4-layer board.
3.0
0.0
–55 –35 –15 5 25 45 1058565
MAXIMUM POWER DISSIPATION (W)
AMBIENT TEMPERATURE (°C)
10371-004
0.5
1.0
1.5
2.0
2.5
T
J
= 150°C
16-LEAD LFCSP
Figure 3. Maximum Power Dissipation vs. Ambient Temperature,
4-Layer Board
ESD CAUTION
