ADG1608/ADG1609 Data Sheet
Rev. A | Page 16 of 20
V
OUT
50Ω
NETWORK
ANALYZER
R
L
50Ω
S
D
50Ω
OFF ISOLATION = 20 log
V
OUT
V
S
V
S
V
DD
V
SS
0.1µF
V
DD
0.1µF
V
SS
GND
08318-014
Figure 32. Off Isolation
V
OUT
50Ω
NETWORK
ANALYZER
R
L
50Ω
S
D
INSERTION LOSS = 20 log
V
OUT
WITH SWITCH
V
OUT
WITHOUT SWITCH
V
S
V
DD
V
SS
0.1µF
V
DD
0.1µF
V
SS
GND
08318-016
Figure 33. Bandwidth
CHANNEL-TO-CHANNEL CROSSTALK = 20 log
V
OUT
GND
S1
D
S2
V
OUT
NETWORK
ANALYZER
R
L
50Ω
R
50Ω
V
S
V
S
V
DD
V
SS
0.1µF
V
DD
0.1µF
V
SS
08318-015
Figure 34. Channel-to-Channel Crosstalk
V
OUT
R
S
AUDIO PRECISION
R
L
10kΩ
IN
V
IN
S
D
V
S
V p-p
V
DD
V
SS
0.1µF
V
DD
0.1µF
V
SS
GND
08318-017
Figure 35. THD + Noise
Data Sheet ADG1608/ADG1609
Rev. A | Page 17 of 20
TERMINOLOGY
I
DD
The positive supply current.
I
SS
The negative supply current.
V
D
(V
S
)
The analog voltage on Terminal D and Terminal S.
R
ON
The ohmic resistance between Terminal D and Terminal S.
R
FLAT(ON)
Flatness that is defined as the difference between the maximum
and minimum value of on resistance measured over the specified
analog signal range.
I
S
(Off)
The source leakage current with the switch off.
I
D
(Off)
The drain leakage current with the switch off.
I
D
, I
S
(On)
The channel leakage current with the switch on.
V
INL
The maximum input voltage for Logic 0.
V
INH
The minimum input voltage for Logic 1.
I
INL
(I
INH
)
The input current of the digital input.
C
S
(Off)
The off switch source capacitance, which is measured with
reference to ground.
C
D
(Off)
The off switch drain capacitance, which is measured with
reference to ground.
C
D
, C
S
(On)
The on switch capacitance, which is measured with reference to
ground.
C
IN
The digital input capacitance.
t
TRANSITION
The delay time between the 50% and 90% points of the digital
input and switch on condition when switching from one address
state to another.
t
ON
(EN)
The delay between applying the digital control input and the
output switching on.
t
OFF
(EN)
The delay between applying the digital control input and the
output switching off.
Charge Injection
A measure of the glitch impulse transferred from the digital
input to the analog output during switching.
Off Isolation
A measure of unwanted signal coupling through an off switch.
Crosstalk
A measure of unwanted signal that is coupled through from one
channel to another as a result of parasitic capacitance.
Bandwidth
The frequency at which the output is attenuated by 3 dB.
On Response
The frequency response of the on switch.
Insertion Loss
The loss due to the on resistance of the switch.
Total Harmonic Distortion + Noise (THD + N)
The ratio of the harmonic amplitude plus noise of the signal to
the fundamental.
AC Power Supply Rejection Ratio (ACPSRR)
The ratio of the amplitude of signal on the output to the amplitude
of the modulation. This is a measure of the ability of the part to
avoid coupling noise and spurious signals that appear on the supply
voltage pin to the output of the switch. The dc voltage on the device
is modulated by a sine wave of 0.62 V p-p.
ADG1608/ADG1609 Data Sheet
Rev. A | Page 18 of 20
OUTLINE DIMENSIONS
16
9
81
PIN 1
SEATING
PLANE
4.50
4.40
4.30
6.40
BSC
5.10
5.00
4.90
0.65
BSC
0.15
0.05
1.20
MAX
0.20
0.09
0.75
0.60
0.45
0.30
0.19
COPLANARITY
0.10
COMPLIANT TO JEDEC STANDARDS MO-153-AB
Figure 36. 16-Lead Thin Shrink Small Outline Package [TSSOP]
(RU-16)
Dimensions shown in millimeters
3.10
3.00 SQ
2.90
0.30
0.23
0.18
1.75
1.60 SQ
1.45
08-16-2010-E
1
0.50
BSC
BOTTOM VIEWTOP VIEW
16
5
8
9
12
13
4
EXPOSED
PAD
P
I
N
1
I
N
D
I
C
A
T
O
R
0.50
0.40
0.30
SEATING
PLANE
0.05 MAX
0.02 NOM
0.20 REF
0.25 MIN
COPLANARITY
0.08
PIN 1
INDI
C
ATOR
FOR PROPER CONNECTION OF
THE EXPOSED PAD, REFER TO
THE PIN CONFIGURATION AND
FUNCTION DESCRIPTIONS
SECTION OF THIS DATA SHEET.
0.80
0.75
0.70
COMPLIANT
TO
JEDEC STANDARDS MO-220-WEED-6.
Figure 37. 16-Lead Lead Frame Chip Scale Package [LFCSP_WQ]
3 mm x 3 mm Body, Very Very Thin Quad
(CP-16-22)
Dimensions shown in millimeters
ORDERING GUIDE
Model
1
Temperature Range Package Description
Package
Option Branding
ADG1608BRUZ −40°C to +125°C 16-Lead Thin Shrink Small Outline Package [TSSOP] RU-16
ADG1608BRUZ-REEL7 −40°C to +125°C 16-Lead Thin Shrink Small Outline Package [TSSOP] RU-16
ADG1608BCPZ-REEL7 −40°C to +125°C 16-Lead Lead Frame Chip Scale Package [LFCSP_WQ] CP-16-22 S38
ADG1609BRUZ −40°C to +125°C 16-Lead Thin Shrink Small Outline Package [TSSOP] RU-16
ADG1609BRUZ-REEL7 −40°C to +125°C 16-Lead Thin Shrink Small Outline Package [TSSOP] RU-16
ADG1609BCPZ-REEL7 −40°C to +125°C 16-Lead Lead Frame Chip Scale Package [LFCSP_WQ] CP-16-22 S39
1
Z = RoHS Compliant Part.

ADG1608BRUZ-REEL7

Mfr. #:
Manufacturer:
Analog Devices Inc.
Description:
Multiplexer Switch ICs 8:1 40MHz 4.4 Ohm CMOS
Lifecycle:
New from this manufacturer.
Delivery:
DHL FedEx Ups TNT EMS
Payment:
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