BUK7608-55A All information provided in this document is subject to legal disclaimers. © NXP B.V. 2010. All rights reserved.
Product data sheet Rev. 03 — 14 June 2010 6 of 14
NXP Semiconductors
BUK7608-55A
N-channel TrenchMOS standard level FET
6. Characteristics
Table 6. Characteristics
Symbol Parameter Conditions Min Typ Max Unit
Static characteristics
V
(BR)DSS
drain-source breakdown
voltage
I
D
= 0.25 mA; V
GS
=0V; T
j
= -55 °C 50 - - V
I
D
= 0.25 mA; V
GS
=0V; T
j
=25°C 55--V
V
GS(th)
gate-source threshold
voltage
I
D
=1mA; V
DS
=V
GS
; T
j
=17C;
see Figure 10
1--V
I
D
=1mA; V
DS
=V
GS
; T
j
=2C;
see Figure 10
234V
I
D
=1mA; V
DS
=V
GS
; T
j
=-5C;
see Figure 10
--4.4V
I
DSS
drain leakage current V
DS
=55V; V
GS
=0V; T
j
= 175 °C - - 500 µA
V
DS
=55V; V
GS
=0V; T
j
= 25 °C - 0.05 10 µA
I
GSS
gate leakage current V
DS
=0V; V
GS
=20V; T
j
= 25 °C - 2 100 nA
V
DS
=0V; V
GS
=-20V; T
j
= 25 °C - 2 100 nA
R
DSon
drain-source on-state
resistance
V
GS
=10V; I
D
=25A; T
j
=17C;
see Figure 11; see Figure 12
--16m
V
GS
=10V; I
D
=25A; T
j
=2C;
see Figure 11
; see Figure 12
-6.88m
Dynamic characteristics
Q
G(tot)
total gate charge I
D
=25A; V
DS
=44V; V
GS
=0V;
T
j
= 25 °C; see Figure 13
-76-nC
Q
GS
gate-source charge - 16 - nC
Q
GD
gate-drain charge - 35 - nC
C
iss
input capacitance V
GS
=0V; V
DS
=25V; f=1MHz;
T
j
= 25 °C; see Figure 14
- 3264 4352 pF
C
oss
output capacitance - 719 863 pF
C
rss
reverse transfer capacitance - 390 533 pF
t
d(on)
turn-on delay time V
DS
=30V; R
L
=1.2; V
GS
=5V;
R
G(ext)
=10; T
j
=2C
-24-ns
t
r
rise time - 94 - ns
t
d(off)
turn-off delay time - 100 - ns
t
f
fall time - 80 - ns
L
D
internal drain inductance from upper edge of drain mounting
base to centre of die ; T
j
=2C
-2.5-nH
from drain lead 6 mm from package to
centre of die ; T
j
=2C
-4.5-nH
L
S
internal source inductance from source lead to source bond pad ;
T
j
=2C
-7.5-nH
Source-drain diode
V
SD
source-drain voltage I
S
=25A; V
GS
=0V; T
j
=2C;
see Figure 15
- 0.85 1.2 V
t
rr
reverse recovery time I
S
=75A; dI
S
/dt = -100 A/µs;
V
GS
=-10V; V
DS
=30V; T
j
=2C
-65-ns
Q
r
recovered charge - 170 - nC
BUK7608-55A All information provided in this document is subject to legal disclaimers. © NXP B.V. 2010. All rights reserved.
Product data sheet Rev. 03 — 14 June 2010 7 of 14
NXP Semiconductors
BUK7608-55A
N-channel TrenchMOS standard level FET
Fig 5. Output characteristics: drain current as a
function of drain-source voltage; typical values
Fig 6. Drain-source on-state resistance as a function
of gate-source voltage; typical values
Fig 7. Sub-threshold drain current as a function of
gate-source voltage
Fig 8. Forward transconductance as a function of
drain current; typical values
03nh45
160
140
120
100
80
60
40
20
0
I
D
(A)
0246810
V
DS
(V)
5.0 V
6.0 V
6.5 V
7.0 V
18 V
8.0 V
10 V
V
GS
= 4.5 V
5.5 V
03nh44
6
8
10
12
14
5101520
V
GS
(V)
R
DSon
(mΩ)
03aa35
V
GS
(V)
0642
10
4
10
5
10
2
10
3
10
1
I
D
(A)
10
6
min typ max
03nh42
0
20
40
60
0 20 40 60 80 100
I
D
(A)
g
fs
(S)
BUK7608-55A All information provided in this document is subject to legal disclaimers. © NXP B.V. 2010. All rights reserved.
Product data sheet Rev. 03 — 14 June 2010 8 of 14
NXP Semiconductors
BUK7608-55A
N-channel TrenchMOS standard level FET
Fig 9. Transfer characteristics: drain current as a
function of gate-source voltage; typical values
Fig 10. Gate-source threshold voltage as a function of
junction temperature
Fig 11. Drain-source on-state resistance as a function
of drain current; typical values
Fig 12. Normalized drain-source on-state resistance
factor as a function of junction temperature
03nh43
0
20
40
60
80
100
02468
V
GS
(V)
I
D
(A)
T
j
= 175 °C T
j
= 25 °C
T
j
(°C)
60 180120060
03aa32
2
3
1
4
5
V
GS(th)
(V)
0
max
typ
min
03nh46
5
10
15
20
25
0 20 40 60 80 100 120
I
D
(A)
R
DSon
(mΩ)
V
GS
= 5.5 (V)
6
6.5
7.5
10
9
7
03ne89
0
0.5
1
1.5
2
-60 0 60 120 180
T
j
(
°
C)
a

BUK7608-55A,118

Mfr. #:
Manufacturer:
Nexperia
Description:
MOSFET TAPE13 PWR-MOS
Lifecycle:
New from this manufacturer.
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