Preliminary Data Sheet PN10589EJ02V0DS
13
PS9552,PS9552L1,PS9552L2,PS9552L3
NOTES ON HANDLING
1. Recommended soldering conditions
(1) Infrared reflow soldering
Peak reflow temperature 260°C or below (package surface temperature)
Time of peak reflow temperature 10 seconds or less
Time of temperature higher than 220°C 60 seconds or less
Time to preheat temperature from 120 to 180°C 120±30 s
Number of reflows Three
Flux Rosin flux containing small amount of chlorine (The flux with a
maximum chlorine content of 0.2 Wt% is recommended.)
120±30 s
(preheating)
220˚C
180˚C
Package Surface Temperature T (˚C)
Time (s)
Recommended Temperature Profile of Infrared Reflow
(heating)
to 10 s
to 60 s
260˚C MAX.
120˚C
(2) Wave soldering
• Temperature 260°C or below (molten solder temperature)
Time 10 seconds or less
• Preheating conditions 120°C or below (package surface temperature)
Number of times One (Allowed to be dipped in solder including plastic mold portion.)
Flux Rosin flux containing small amount of chlorine (The flux with a maximum chlorine
content of 0.2 Wt% is recommended.)
(3) Soldering by Soldering Iron
Peak Temperature (lead part temperature) 350°C or below
Time (each pins) 3 seconds or less
Flux Rosin flux containing small amount of chlorine (The flux with a
maximum chlorine content of 0.2 Wt% is recommended.)
(a) Soldering of leads should be made at the point 1.5 to 2.0 mm from the root of the lead
(b) Please be sure that the temperature of the package would not be heated over 100°C
Preliminary Data Sheet PN10589EJ02V0DS
14
PS9552,PS9552L1,PS9552L2,PS9552L3
(4) Cautions
• Fluxes
Avoid removing the residual flux with freon-based and chlorine-based cleaning solvent.
2. Cautions regarding noise
Be aware that when voltage is applied suddenly between the photocoupler’s input and output or between
collector-emitters at startup, the output transistor may enter the on state, even if the voltage is within the absolute
maximum ratings.
USAGE CAUTIONS
1. This product is weak for static electricity by designed with high-speed integrated circuit so protect against static
electricity when handling.
2. By-pass capacitor of more than 0.1
μ
F is used between VCC and GND near device. Also, ensure that the
distance between the leads of the photocoupler and capacitor is no more than 10 mm.
3. In the layout of the board, be sure that the IGBT collector and emitter patterns are not close to this product’s
input. If they are allocated close to the input and the transient currents may be combined, the transient current
on the IGBT side may unexpectedly be input into the LED input of this product, causing malfunctions and
degradation in characteristics (When it is necessary to allocate patterns close to the input, design the input drive
circuit so that the LED has reverse bias in the off state to prevent the LED lighting in the off state).
4. Avoid storage at a high temperature and high humidity.
<R>
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Preliminary Data Sheet PN10589EJ02V0DS
15
PS9552,PS9552L1,PS9552L2,PS9552L3
The information in this document is current as of June, 2007. The information is subject to change
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PS9552L3-V-E3-AX

Mfr. #:
Manufacturer:
Renesas Electronics
Description:
Logic Output Optocouplers HI-SPD OPTOCPLR 8-PIN DIP
Lifecycle:
New from this manufacturer.
Delivery:
DHL FedEx Ups TNT EMS
Payment:
T/T Paypal Visa MoneyGram Western Union

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