Spec No. JELF243C-0014AA-01 P.11/14
MURATA MFG.CO., LTD
Reference Only
10.7 Marking for Outside package (corrugated paper box)
Customer name, Purchasing order number, Customer part number, MURATA part number,
RoHS Marking (∗2) ,Quantity, etc ･･･
10.8 Specification of Outer Case
Outer Case Dimensions
(mm)
Standard Reel Quantity
in Outer Case (Reel)
W D H
186 186 93 5(8mm-wide / paper tape)
10(4mm-wide / plastic tape)
∗ Above Outer Case size is typical. It depends on a quantity of an order.
11. ！ Caution
Limitation of Applications
Please contact us before using our products for the applications listed below which require especially
high reliability for the prevention of defects which might directly cause damage to the third party's life,
body or property.
(1) Aircraft equipment (6) Transportation equipment (vehicles, trains, ships, etc.)
(2) Aerospace equipment
(7) Traffic signal equipment
(3) Undersea equipment (8) Disaster prevention / crime prevention equipment
(4) Power plant control equipment (9) Data-processing equipment
(5) Medical equipment (10) Applications of similar complexity and /or reliability
requirements to the applications listed in the above
12. Notice
Products can only be soldered with reflow.
This product is designed for solder mounting.
Please consult us in advance for applying other mounting method such as conductive adhesive.
12.1 Land pattern designing
a 0.16~0.20
b 0.40~0.56
c 0.20~0.23
(in mm)
12.2 Flux, Solder
・ Use rosin-based flux.
Don’t use highly acidic flux with halide content exceeding 0.2(wt)% (chlorine conversion value).
Don’t use water-soluble flux.
・ Use Sn-3.0Ag-0.5Cu solder.
・ Standard thickness of solder paste : 50μm to 80μm.
12.3 Reflow soldering conditions
・ Pre-heating should be in such a way that the temperature difference between solder and
product surface is limited to 150°C max. Cooling into solvent after soldering also should be
in such a way that the temperature difference is limited to 100°C max.
Insufficient pre-heating may cause cracks on the product, resulting in the deterioration of
products quality.
・ Standard soldering profile and the limit soldering profile is as follows.
The excessive limit soldering conditions may cause leaching of the electrode and / or resulting
in the deterioration of product quality.
W
D
Label
H
Solder resist
ａ
ｂ
Chip Coil
Land
c
