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LTC2939IMS#PBF

P1-P3P4-P6P7-P9P10-P12P13-P15P16-P18P19-P20
LTC2938/LTC2939
16
293839ff
TYPICAL APPLICATIONS
Supply and Temperature Monitor (Mode 1, 5V, 3.3V, 28V, –5.2V, 12V, 100°C)
Buffered V
REF
to Power High Current Circuits
V
REF
V6
LTC2939
*PANASONIC ERTJOEV474J
293839 TA04
121k
1%
467k 1%
RBIAS
93.1k
1%
R1
93.1k
1%
R2
9.53k
1%
RNTC*
470k
12V
28V
–5.2V
100k
1%
10k
1%
100k
1%
C
RT
47nF
V
PG
GND CRT CWT
V3
V5
V4
2150k 1%
5110k 1%
RHYST
280k
1%
5V
0.1μF
3.3V
0.1μF
V1
V2
WDO
WDI
RST
SYSTEM
LOGIC
V
REF
LTC2939
293839 TAO5
2150k 1%
5V
0.1μF
3.3V
2.5V
1.8V
12V
100k
1%
100k
1%
C
RT
47nF
C
WT
47nF
0.1μF
WDI
WDO
RST
V
PG
GND CRT
5V
CWT
V1
V2
V3
V4
V5
V6
124k 1%
1.2V
1.210V
±10mA
MICROPROCESSOR
R1
59k
1%
R2
40.2k
1%
–
+
LT1809
LTC2938/LTC2939
17
293839ff
PACKAGE DESCRIPTION
4.00 p0.10
(2 SIDES)
3.00 p0.10
(2 SIDES)
NOTE:
1. DRAWING PROPOSED TO BE A VARIATION OF VERSION
(WGED) IN JEDEC PACKAGE OUTLINE M0-229
2. DRAWING NOT TO SCALE
3. ALL DIMENSIONS ARE IN MILLIMETERS
4. DIMENSIONS OF EXPOSED PAD ON BOTTOM OF PACKAGE DO NOT INCLUDE
MOLD FLASH. MOLD FLASH, IF PRESENT, SHALL NOT EXCEED 0.15mm ON ANY SIDE
5. EXPOSED PAD SHALL BE SOLDER PLATED
6. SHADED AREA IS ONLY A REFERENCE FOR PIN 1 LOCATION
ON THE TOP AND BOTTOM OF PACKAGE
0.40 p 0.10
BOTTOM VIEW—EXPOSED PAD
1.70 p 0.10
0.75 p0.05
R = 0.115
TYP
R = 0.05
TYP
2.50 REF
16
127
PIN 1 NOTCH
R = 0.20 OR
0.35 s 45o
CHAMFER
PIN 1
TOP MARK
(NOTE 6)
0.200 REF
0.00 – 0.05
(UE12/DE12) DFN 0806 REV D
2.50 REF
RECOMMENDED SOLDER PAD PITCH AND DIMENSIONS
APPLY SOLDER MASK TO AREAS THAT ARE NOT SOLDERED
2.20 p0.05
0.70 p0.05
3.60 p0.05
PACKAGE OUTLINE
3.30 p0.10
0.25 p 0.05
0.50 BSC
1.70 p 0.05
3.30 p0.05
0.50 BSC
0.25 p 0.05
UE/DE Package
12-Lead Plastic DFN (4mm × 3mm)
(Reference LTC DWG # 05-08-1695)
LTC2938/LTC2939
18
293839ff
PACKAGE DESCRIPTION
MSOP (MS12) 1107 REV Ø
0.53 p 0.152
(.021 p .006)
SEATING
PLANE
0.18
(.007)
1.10
(.043)
MAX
0.22 – 0.38
(.009 – .015)
TYP
0.86
(.034)
REF
0.650
(.0256)
BSC
12 11 10 9 8 7
NOTE:
1. DIMENSIONS IN MILLIMETER/(INCH)
2. DRAWING NOT TO SCALE
3. DIMENSION DOES NOT INCLUDE MOLD FLASH, PROTRUSIONS OR GATE BURRS.
MOLD FLASH, PROTRUSIONS OR GATE BURRS SHALL NOT EXCEED 0.152mm (.006") PER SIDE
4. DIMENSION DOES NOT INCLUDE INTERLEAD FLASH OR PROTRUSIONS.
INTERLEAD FLASH OR PROTRUSIONS SHALL NOT EXCEED 0.152mm (.006") PER SIDE
5. LEAD COPLANARITY (BOTTOM OF LEADS AFTER FORMING) SHALL BE 0.102mm (.004") MAX
0.254
(.010)
0
o – 6o TYP
DETAIL “A”
DETAIL “A”
GAUGE PLANE
5.23
(.206)
MIN
3.20 – 3.45
(.126 – .136)
0.889 p 0.127
(.035 p .005)
RECOMMENDED SOLDER PAD LAYOUT
0.42 p 0.038
(.0165 p .0015)
TYP
0.65
(.0256)
BSC
4.039 p 0.102
(.159 p .004)
(NOTE 3)
0.1016 p 0.0508
(.004 p .002)
123456
3.00 p 0.102
(.118 p .004)
(NOTE 4)
0.406 p 0.076
(.016 p .003)
REF
4.90 p 0.152
(.193 p .006)
MS Package
12-Lead Plastic MSOP
(Reference LTC DWG # 05-08-1668 Rev Ø)
P1-P3P4-P6P7-P9P10-P12P13-P15P16-P18P19-P20

LTC2939IMS#PBF

Mfr. #:
Buy LTC2939IMS#PBF
Manufacturer:
Analog Devices Inc.
Description:
Supervisory Circuits Configurable Six Supply Monitor with Watchdog Timer
Lifecycle:
New from this manufacturer.
Delivery:
DHL FedEx Ups TNT EMS
Payment:
T/T Paypal Visa MoneyGram Western Union

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