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power.pulseelectronics.com
P824. C (11/17)
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SMT Power Inductor
High Current Molded Power Inductor - PA4547.XXXNLT Series
PA4547.XXXNLT
Mechanical
SUGGESTED PAD LAYOUT
FINAL LAYOUT
Series A B C D E L G H
PA4547.XXXNLT 3.5±0.3 3.2±0.2 1.3±0.2 0.7±0.2 1.2±0.2 4.1 1.9 1.45
All Dimensions in mm.
TAPE & REEL INFO
P
W
K
0
1
A
G
Direction of tape
Marking
Marking
SURFACE MOUNTING TYPE, REEL/TAPE LIST
REEL SIZE (mm) TAPE SIZE (mm) QTY
A G P
1
W K
0
PCS/REEL
PA4547.XXXNLT Ø330 12.4 8 12 1.8 3000
1. Actual temperature of the component during system operation (ambient plus
temperature rise) must be within the standard operating range.
2. The saturation current is the current at which the initial inductance drops ap-
proximately 30% at the stated ambient temperature. This current is determined by
placing the compnent in the specified ambient environment and applying a short
duration pulse current (to eliminate self-heating eect) to the component.
3. The rated current is the DC current required to raise the component temperature by
approximately 40˚C. Take note that the components’ performanc varies depending
on the system condition. It is suggested that the component be tested at the system
level, to verify the temperature rise of the component during system operation.
4. The part temperature (ambient+temp rise) should not exceed 125�C under worst
case operating conditions. Circuit design, PCB trace size and thickness, airflow and
other cooling provisions all aect the part temperature. Part temperature should be
verified in the end application.
Notes:
E
XXX
L
G
H