Profile feature Sn-Pb eutectic assembly Pb-free assembly
Preheat and soak
- Temperature min T
smin
100 °C 150 °C
- Temperature max T
smax
150 °C 200 °C
- Time t
smin
to t
smax
60 ... 120 s 60 ... 120 s
Average ramp-up rate T
smax
to T
p
3 °C/ s max. 3 °C/ s max.
Liquidous temperature T
L
183 °C 217 °C
Time at liquidous t
L
40 ... 150 s 40 ... 150 s
Peak package body temperature T
p
215 °C ... 260 °C
1)
235 °C ... 260 °C
Time above (T
P
5 °C) t
p
10 ... 40 s 10 ... 40 s
Average ramp-down rate T
p
to T
smax
6 °C/ s max. 6 °C/ s max.
Time 25 °C to peak temperature max. 8 minutes max. 8 minutes
1) Depending on package thickness.
Notes: All temperatures refer to topside of the package, measured on the package body
surface.
Number of reflow cycles: 3
Iron soldering should be avoided, hot air methods are recommended for repair
purposes.
Solder joint profiles for silver/nickel/tin terminations
Temperature measurement B57863S
Miniature sensors with bendable wires S863
Page 10 of 21Please read Cautions and warnings and
Important notes at the end of this document.
1.3.4 Recommended geometry of solder pads
Recommended maximum dimensions (mm)
Case size
inch/mm
A B C
0402/1005 0.6 0.6 1.7
0603/1608 1.0 1.0 3.0
0805/2012 1.3 1.2 3.4
1206/3216 1.8 1.2 4.5
2 Conductive adhesion
An alternative to soldering for silver-palladium terminated components is the gluing of thermistors
with conductive adhesives. The benefit of this method is that it involves no thermal stress. The
adhesives used must be chemically inert.
3 Clamp contacting
Pressure contacting by means of clamps is particularly suitable for applications involving frequent
switching and high turn-on powers.
4 Robustness of terminations (leaded types)
The leads meet the requirements of IEC 60068-2-21. They may not be bent closer than 4 mm
from the solder joint on the thermistor body or from the point at which they leave the feed-
throughs. During bending, any mechanical stress at the outlet of the leads must be removed. The
bending radius should be at least 0.75 mm.
Temperature measurement B57863S
Miniature sensors with bendable wires S863
Page 11 of 21Please read Cautions and warnings and
Important notes at the end of this document.
Tensile strength: Test Ua1:
Value of applied force for Ua1 test:
Diameter (d) of
corresponding round leads
Force with tolerance of ±10%
∅ ≤ 0.25 mm 1.0 N
0.25 < ∅ ≤ 0.35 mm 2.5 N
0.35 < ∅ ≤ 0.50 mm 5.0 N
0.50 < ∅ ≤ 0.80 mm 10.0 N
Bending strength: Test Ub:
Two 90°-bends in opposite directions
Value of applied force for Ub test:
Diameter (d) of
corresponding round leads
Force with tolerance of ±10%
∅ ≤ 0.25 mm 0.5 N
0.25 < ∅ ≤ 0.35 mm 1.25 N
0.35 < ∅ ≤ 0.50 mm 2.5 N
0.50 < ∅ ≤ 0.80 mm 5 N
Torsional strength: Test Uc: severity 2
The lead is bent by 90° at a distance of 6 to 6.5 mm from the thermistor body.
The bending radius of the leads should be approx. 0.75 mm. Two torsions of
180° each (severity 2).
When subjecting leads to mechanical stress, the following should be observed:
Tensile stress on leads
During mounting and operation tensile forces on the leads are to be avoided.
Bending of leads
Bending of the leads directly on the thermistor body is not permissible.
A lead may be bent at a minimum distance of twice the wire's diameter +4 mm from the solder
joint on the thermistor body. During bending the wire must be mechanically relieved at its outlet.
The bending radius should be at least 0.75 mm.
Temperature measurement B57863S
Miniature sensors with bendable wires S863
Page 12 of 21Please read Cautions and warnings and
Important notes at the end of this document.

B57863S0103G040

Mfr. #:
Manufacturer:
EPCOS / TDK
Description:
NTC Thermistors 10k 3988
Lifecycle:
New from this manufacturer.
Delivery:
DHL FedEx Ups TNT EMS
Payment:
T/T Paypal Visa MoneyGram Western Union