SI4804CDY-T1-E3

Vishay Siliconix
Si4804CDY
New Product
Document Number: 68924
S-82485-Rev. A, 13-Oct-08
www.vishay.com
1
Dual N-Channel 30-V (D-S) MOSFET
FEATURES
Halogen-free
•TrenchFET
®
Power MOSFET
100 % R
g
Tested
100 % UIS Tested
APPLICATIONS
DC/DC
Notebook System Power
Notes:
a. Based on T
C
= 25 °C.
b. Surface Mounted on 1" x 1" FR4 board.
c. t = 10 s.
d. Maximum under Steady State conditions is 120 °C/W.
PRODUCT SUMMARY
V
DS
(V) R
DS(on)
(Ω)
I
D
(A)
a
Q
g
(Typ.)
30
0.022 at V
GS
= 10 V
8
7
0.027 at V
GS
= 4.5 V
7.9
S
1
G
1
D
2
D
1
D
1
S
2
G
2
D
2
SO-8
5
6
7
8
Top View
2
3
4
1
Ordering Information: Si4804CDY-T1-GE3 (Lead (Pb)-free and Halogen-free)
N-
C
hannel M
OS
FET
G
1
D
1
S
1
N-
C
hannel M
OS
FET
G
2
D
2
S
2
ABSOLUTE MAXIMUM RATINGS T
A
= 25 °C, unless otherwise noted
Parameter Symbol Limit Unit
Drain-Source Voltage
V
DS
30
V
Gate-Source Voltage
V
GS
± 20
Continuous Drain Current (T
J
= 150 °C)
T
C
= 25 °C
I
D
8.0
A
T
C
= 70 °C
7.1
T
A
= 25 °C
7.1
b, c
T
A
= 70 °C
5.5
b, c
Pulsed Drain Current (10 µs Pulse Width)
I
DM
30
Source-Drain Current Diode Current
T
C
= 25 °C
I
S
2.4
T
A
= 25 °C
1.8
b, c
Pulsed Source-Drain Current
I
SM
30
Single Pulse Avalanche Current
L = 0.1 mH
I
AS
10
Single Pulse Avalanche Energy
E
AS
5
mJ
Maximum Power Dissipation
T
C
= 25 °C
P
D
3.1
W
T
C
= 70 °C
2
T
A
= 25 °C
2
b, c
T
A
= 70 °C
1.28
b, c
Operating Junction and Storage Temperature Range
T
J
, T
stg
- 55 to 150
°C
THERMAL RESISTANCE RATINGS
Parameter Symbol Typical Maximum Unit
Maximum Junction-to-Ambient
b, d
t 10 s
R
thJA
49 62.5
°C/W
Maximum Junction-to-Foot (Drain) Steady State
R
thJF
32 40
RoHS
COMPLIANT
www.vishay.com
2
Document Number: 68924
S-82485-Rev. A, 13-Oct-08
Vishay Siliconix
Si4804CDY
New Product
Notes:
a. Guaranteed by design, not subject to production testing.
b. Pulse test; pulse width 300 µs, duty cycle 2 %
Stresses beyond those listed under “Absolute Maximum Ratings” may cause permanent damage to the device. These are stress ratings only, and functional operation
of the device at these or any other conditions beyond those indicated in the operational sections of the specifications is not implied. Exposure to absolute maximum
rating conditions for extended periods may affect device reliability.
SPECIFICATIONS T
J
= 25 °C, unless otherwise noted
Parameter Symbol Test Conditions Min. Typ. Max. Unit
Static
Drain-Source Breakdown Voltage
V
DS
V
GS
= 0 V, I
D
= 250 µA
30 V
V
DS
Temperature Coefficient ΔV
DS
/T
J
I
D
= 250 µA
31
mV/°C
V
GS(th)
Temperature Coefficient ΔV
GS(th)
/T
J
- 5.1
Gate Threshold Voltage
V
GS(th)
V
DS
= V
GS
, I
D
= 250 µA
1.2 2.4 V
Gate Body Leakage
I
GSS
V
DS
= 0 V, V
GS
= ± 20 V
100 nA
Zero Gate Voltage Drain Current
I
DSS
V
DS
= 30 V, V
GS
= 0 V
1
µA
V
DS
= 30 V, V
GS
= 0 V, T
J
= 55 °C
10
On-State Drain Current
b
I
D(on)
V
DS
= 5 V, V
GS
= 10 V
20 A
Drain-Source On-State Resistance
b
R
DS(on)
V
GS
= 10 V, I
D
= 7.5 A
0.018 0.022
Ω
V
GS
= 4.5 V, I
D
= 6.5 A
0.022 0.027
Forward Transconductance
b
g
fs
V
DS
= 15 V, I
D
= 7.5 A
20 S
Dynamic
a
Input Capacitance
C
iss
N-Channel
V
DS
= 15 V, V
GS
= 0 V, f = 1 MHz
865
pFOutput Capacitance
C
oss
131
Reverse Transfer Capacitance
C
rss
66
Total Gate Charge
Q
g
V
DS
= 15 V, V
GS
= 10 V, I
D
= 7.5 A
15.4 23
nC
N-Channel
V
DS
= 15 V, V
GS
= 4.5 V, I
D
= 7.5 A
7 10.5
Gate-Source Charge
Q
gs
2.3
Gate-Drain Charge
Q
gd
2.2
Gate Resistance
R
g
f = 1 MHz 0.4 1.9 3.8 Ω
Tur n - O n D e l ay Time
t
d(on)
N-Channel
V
DD
= 15 V, R
L
= 3 Ω
I
D
5 A, V
GEN
= 10 V, R
g
= 1 Ω
918
ns
Rise Time
t
r
12 24
Turn-Off Delay Time
t
d(off)
17 34
Fall Time
t
f
918
Tur n - O n D e l ay Time
t
d(on)
N-Channel
V
DD
= 15 V, R
L
= 3 Ω
I
D
5 A, V
GEN
= 4.5 V, R
g
= 1 Ω
17 34
Rise Time
t
r
13 26
Turn-Off Delay Time
t
d(off)
19 35
Fall Time
t
f
918
Drain-Source Body Diode Characteristics
Continuous Source-Drain Diode Current
I
S
T
C
= 25 °C
2.4
A
Pulse Diode Forward Current
a
I
SM
30
Body Diode Voltage
V
SD
I
S
= 1.8 A
0.77 1.1 V
Body Diode Reverse Recovery Time
t
rr
N-Channel
I
F
= 5 A, dI/dt = 100 A/µs, T
J
= 25 °C
16 32 ns
Body Diode Reverse Recovery Charge
Q
rr
816nC
Reverse Recovery Fall Time
t
a
10
ns
Reverse Recovery Rise Time
t
b
6
Document Number: 68924
S-82485-Rev. A, 13-Oct-08
www.vishay.com
3
Vishay Siliconix
Si4804CDY
New Product
TYPICAL CHARACTERISTICS 25 °C, unless otherwise noted
Output Characteristics
On-Resistance vs. Drain Current
Gate Charge
0
6
12
18
24
30
0.0 0.5 1.0 1.5 2.0 2.5
V
DS
- Drain-to-Source Voltage (V)
I
D
- Drain Current (A)
V
GS
=10thru 4 V
V
GS
=3V
0.016
0.018
0.020
0.022
0.024
0.026
061218 24 30
R
DS(on)
- On-Resistance (Ω)
I
D
- Drain Current (A)
V
GS
=10V
V
GS
=4.5V
0
2
4
6
8
10
0.0 3.2 6.4 9.6 12.8 16.0
I
D
=7.5A
V
GS
- Gate-to-Source Voltage (V)
Q
g
- Total Gate Charge (nC)
V
DS
=15V
V
DS
=10V
V
DS
= 20 V
Transfer Characteristics
Capacitance
On-Resistance vs. Junction Temperature
0
1
2
3
4
5
012345
V
GS
- Gate-to-Source Voltage (V)
I
D
- Drain Current (A)
T
C
= - 55 °C
T
C
= 25 °C
T
C
= 125 °C
C
rss
0
220
440
660
880
1100
0 6 12 18 24 30
C
iss
V
DS
- Drain-to-Source Voltage (V)
C - Capacitance (pF)
C
oss
0.6
0.8
1.0
1.2
1.4
1.6
1.8
- 50 - 25 0 25 50 75 100 125 150
T
J
- Junction Temperature (°C)
(Normalized)
- On-Resistance
R
DS(on)
V
GS
=10 V
I
D
= 7.5 A
V
GS
=4.5V

SI4804CDY-T1-E3

Mfr. #:
Manufacturer:
Vishay
Description:
MOSFET 2N-CH 30V 8A 8SO
Lifecycle:
New from this manufacturer.
Delivery:
DHL FedEx Ups TNT EMS
Payment:
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