LTC2859/LTC2861
13
285961fc
from a driver transition may exceed the hysteresis levels
on the logic and data inputs pins causing an unintended
state change. This can be avoided by maintaining normal
logic levels on the pins and by slewing inputs through
their thresholds by faster than 1V/µs when transitioning.
Good supply decoupling and proper line termination also
reduces glitches caused by driver transitions.
Cable Length vs Data Rate
For a given data rate, the maximum transmission distance
is bounded by the cable properties. A typical curve of cable
length vs data rate compliant with the RS485 standard is
shown in Figure 14. Three regions of this curve reflect
different performance limiting factors in data transmis-
sion. In the flat region of the curve, maximum distance is
determined by resistive losses in the cable. The downward
sloping region represents limits in distance and data
rate due to AC losses in the cable. The solid vertical line
represents the specified maximum data rate in the RS485
standard. The dashed lines at 250kbps and 20Mbps show
the maximum data rates of the LTC2859/LTC2861 in Low-
EMI and normal modes, respectively.
Figure 14. Cable Length vs Data Rate
(RS485 Standard Shown in Solid Lines)
applicaTions inFormaTion
285961 F14
DATA RATE (bps)
CABLE LENGTH (FT)
10k 1M 10M100k 100M
100
1k
10
10k
LOW-EMI MODE
MAX DATA RATE
RS485 MAX
DATA RATE
NORMAL
MODE MAX
DATA RATE
Multi-Node Network with End Termination Using LTC2859
Typical applicaTions
TE = 5V
TE = 5V
TE = 0V
R
D
TE = 0V
R
D
2859/61 TA04
R
D
LTC2859
R
D
LTC2859
LTC2859LTC2859
LTC2859/LTC2861
14
285961fc
packaGe DescripTion
Please refer to http://www.linear.com/designtools/packaging/ for the most recent package drawings.
3.00 ±0.10
(4 SIDES)
NOTE:
1. DRAWING TO BE MADE A JEDEC PACKAGE OUTLINE M0-229 VARIATION OF (WEED-2).
CHECK THE LTC WEBSITE DATA SHEET FOR CURRENT STATUS OF VARIATION ASSIGNMENT
2. DRAWING NOT TO SCALE
3. ALL DIMENSIONS ARE IN MILLIMETERS
4. DIMENSIONS OF EXPOSED PAD ON BOTTOM OF PACKAGE DO NOT INCLUDE
MOLD FLASH. MOLD FLASH, IF PRESENT, SHALL NOT EXCEED 0.15mm ON ANY SIDE
5. EXPOSED PAD SHALL BE SOLDER PLATED
6. SHADED AREA IS ONLY A REFERENCE FOR PIN 1 LOCATION ON THE
TOP AND BOTTOM OF PACKAGE
0.40 ±0.10
BOTTOM VIEW—EXPOSED PAD
1.65 ±0.10
(2 SIDES)
0.75 ±0.05
R = 0.125
TYP
2.38 ±0.10
(2 SIDES)
15
106
PIN 1
TOP MARK
(SEE NOTE 6)
0.200 REF
0.00 – 0.05
(DD) DFN REV C 0310
0.25 ±0.05
2.38 ±0.05
(2 SIDES)
RECOMMENDED SOLDER PAD PITCH AND DIMENSIONS
1.65 ±0.05
(2 SIDES)2.15 ±0.05
0.50
BSC
0.70 ±0.05
3.55 ±0.05
PACKAGE
OUTLINE
0.25 ±0.05
0.50 BSC
DD Package
10-Lead Plastic DFN (3mm × 3mm)
(Reference LTC DWG # 05-08-1699 Rev C)
PIN 1 NOTCH
R = 0.20 OR
0.35 × 45°
CHAMFER
LTC2859/LTC2861
15
285961fc
4.00 ±0.10
(2 SIDES)
3.00 ±0.10
(2 SIDES)
NOTE:
1. DRAWING PROPOSED TO BE A VARIATION OF VERSION
(WGED) IN JEDEC PACKAGE OUTLINE M0-229
2. DRAWING NOT TO SCALE
3. ALL DIMENSIONS ARE IN MILLIMETERS
4. DIMENSIONS OF EXPOSED PAD ON BOTTOM OF PACKAGE DO NOT INCLUDE
MOLD FLASH. MOLD FLASH, IF PRESENT, SHALL NOT EXCEED 0.15mm ON ANY SIDE
5. EXPOSED PAD SHALL BE SOLDER PLATED
6. SHADED AREA IS ONLY A REFERENCE FOR PIN 1 LOCATION
ON THE TOP AND BOTTOM OF PACKAGE
0.40 ±0.10
BOTTOM VIEW—EXPOSED PAD
1.70 ±0.10
0.75 ±0.05
R = 0.115
TYP
R = 0.05
TYP
2.50 REF
16
127
PIN 1 NOTCH
R = 0.20 OR
0.35 × 45°
CHAMFER
PIN 1
TOP MARK
(NOTE 6)
0.200 REF
0.00 – 0.05
(UE12/DE12) DFN 0806 REV D
2.50 REF
RECOMMENDED SOLDER PAD PITCH AND DIMENSIONS
APPLY SOLDER MASK TO AREAS THAT ARE NOT SOLDERED
2.20 ±0.05
0.70 ±0.05
3.60 ±0.05
PACKAGE OUTLINE
3.30 ±0.10
0.25 ±0.05
0.50 BSC
1.70 ±0.05
3.30 ±0.05
0.50 BSC
0.25 ±0.05
DE/UE Package
12-Lead Plastic DFN (4mm × 3mm)
(Reference LTC DWG # 05-08-1695 Rev D)
packaGe DescripTion
Please refer to http://www.linear.com/designtools/packaging/ for the most recent package drawings.

LTC2861CDE#TRPBF

Mfr. #:
Manufacturer:
Analog Devices Inc.
Description:
RS-485 Interface IC 5V Full-Duplex RS485 Transceiver w/ Integrated Termination & Slew Rate Control
Lifecycle:
New from this manufacturer.
Delivery:
DHL FedEx Ups TNT EMS
Payment:
T/T Paypal Visa MoneyGram Western Union