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MLX90242LUA-GAA-000-RE

P1-P3P4-P6P7-P9P10-P10
MLX90242
Linear Hall Effect Sensor
3901090242 Page 7 of 10 Data Sheet
Rev. 027 Feb/12
8. Standard information regarding manufacturability of Melexis
products with different soldering processes
Our products are classified and qualified regarding soldering technology, solderability and moisture
sensitivity level according to following test methods:
Reflow Soldering SMD’s (Surface Mount Devices)
• IPC/JEDEC J-STD-020
Moisture/Reflow Sensitivity Classification for Nonhermetic Solid State Surface Mount Devices
(classification reflow profiles according to table 5-2)
• EIA/JEDEC JESD22-A113
Preconditioning of Nonhermetic Surface Mount Devices Prior to Reliability Testing
(reflow profiles according to table 2)
Wave Soldering SMD’s (Surface Mount Devices) and THD’s (Through Hole Devices)
• EN60749-20
Resistance of plastic- encapsulated SMD’s to combined effect of moisture and soldering heat
• EIA/JEDEC JESD22-B106 and EN60749-15
Resistance to soldering temperature for through-hole mounted devices
Iron Soldering THD’s (Through Hole Devices)
• EN60749-15
Resistance to soldering temperature for through-hole mounted devices
Solderability SMD’s (Surface Mount Devices) and THD’s (Through Hole Devices)
• EIA/JEDEC JESD22-B102 and EN60749-21
Solderability
For all soldering technologies deviating from above mentioned standard conditions (regarding peak
temperature, temperature gradient, temperature profile etc) additional classification and qualification tests
have to be agreed upon with Melexis.
The application of Wave Soldering for SMD’s is allowed only after consulting Melexis regarding assurance
of adhesive strength between device and board.
Melexis is contributing to global environmental conservation by promoting
lead free
solutions. For more
information on qualifications of
RoHS
compliant products (RoHS = European directive on the Restriction
Of the use of certain Hazardous Substances) please visit the quality page on our website:
http://www.melexis.com/quality.aspx
9. ESD Precautions
Electronic semiconductor products are sensitive to Electro Static Discharge (ESD).
Always observe Electro Static Discharge control procedures whenever handling semiconductor products.
MLX90242
Linear Hall Effect Sensor
3901090242 Page 8 of 10 Data Sheet
Rev. 027 Feb/12
10. Package Information
10.1. UA Package
42GA
2053
1 2 3
*
All Dimensions in millimeters
1.95 +/- 0.15
0.45
0.41
Marked
Surface
1.52+/-0.15
UA Hall Plate / Chip Location
1.60
1.40
45
o
Typical
4.30
3.90
2.64
2.34
0.84
0.63
3.20
2.80
1.75
1.55
0.48
0.43
0.20
0.00
0.41
0.35
1.30
1.24
2.57
2.51
0.38
Typical
(see note 3)
Min. 9.0
0.41
0.35
UA Package Dimensions
Hall Plate dimension:
0.150x0.150
Max 5
o
Max 5
o
Typ 5
o
0.7 Max
NOTES:
1.) Controlling dimension: mm
2.) Leads must be free of flash and
plating voids
3.) Leads must not arc toward
the rear of package
4.) Package dimensions exclude
molding flash
5.) Tolerance is 0.254mm unless
otherwise specified
PINOUT:
Pin 1 V
DD
Pin 2 GND (Vss)
Pin 3 Output
Front side marking
Part Number MLX90242 (2 digits)
42 GA
Die Version (2 digits)
Last Lot Number Digit (1 digit)
Week Date Code (2 digits)
Year Date Code (1 digit)
Y WW 3
MLX90242
Linear Hall Effect Sensor
3901090242 Page 9 of 10 Data Sheet
Rev. 027 Feb/12
10.2. TSOT Package (RoHS compliant)
2.75 BSC
1.60 BSC
2.90 BSC
0.30
0.45
0.95 BSC
see note 2
see note 3
TOP
VIEW
1.90 BSC
0.88
+0.02
-
0.03
1.10 MAX
0.075
+0.025
-
0.050
0.50 BSC
SEATING
PLANE
SIDE
VIEW
SEATING
PLANE
0.575 REF.
0.40
+/
-
0.10
B
B’
see note 5
12
° REF. TYP.
0.10
R. MIN.
0.20
4°
+/-4
0.10
R. MIN.
END
VIEW
0.127
+0.023
-
0.007
0.15
0.20
WITH
PLATING
~
BASE
METAL
SECTION
B
-
B’
0.35
+0.05
-
0.10
0.30
0.45
see note 6
1
2
3
Hall plate location
1.417±0.15
0.889±0.15
TOP
VIEW
0.275±0.06
END
VIEW
Notes
:
1. All dimensions are in millimeters
2. Outermost plastic extreme width does not include mold flash or protrusions. Mold flash and protrusions shall not
exceed 0.15mm per side.
3. Outermost plastic extreme length does not include mold flash or protrusions. Mold flash and protrusions shall not exceed 0
.25mm per side.
4. The lead width dimension does not include dambar protrusion. Allowable dambar protrusion shall be 0.07mm total in excess of the lead
width dimension at maximum material condition.
5. Dimension is the length of terminal for soldering to a substrate.
6. Dimension on SECTION B-B’ are apply to the flat section of the lead between 0.08mm and 0.15mm from the lead tip.
7. Formed lead shall be planar with respect to one another with 0.076mm at seating plane.
Top Side Marking:
42XXX: 3 last digits of lotnumber (XXX)
Bottom
Side Marking:
YYWW : Year (YY)
-
Week (WW)
42XXX
P1-P3P4-P6P7-P9P10-P10

MLX90242LUA-GAA-000-RE

Mfr. #:
Buy MLX90242LUA-GAA-000-RE
Manufacturer:
Melexis
Description:
Board Mount Hall Effect / Magnetic Sensors Linear Hall ICs - Fixed Programmed (Ratiometric analog output)
Lifecycle:
New from this manufacturer.
Delivery:
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