BSO203SP H
Parameter Symbol Conditions Unit
min. typ. max.
Thermal characteristics
Thermal resistance,
junction - soldering point
R
thJS
- - 35 K/W
Thermal resistance,
junction - ambient
R
thJA
minimal footprint,
t
p
≤10 s
- - 110
minimal footprint,
steady state
- - 150
6 cm
2
cooling area
1)
,
t
p
≤10 s
--53
6 cm
2
cooling area
1)
,
steady state
--80
Electrical characteristics, at T
j
=25 °C, unless otherwise specified
Static characteristics
Drain-source breakdown voltage
V
(BR)DSS
V
GS
=0 V, I
D
= -
0.25 mA
-20 - - V
Gate threshold voltage
V
GS(th)
V
DS
=V
GS
, I
D
= -100 µA
-0.6 -0.9 -1.2
Zero gate voltage drain current
I
DSS
V
DS
= -20 V, V
GS
=0 V,
T
j
=25 °C
- - -1 µA
V
DS
= -20 V, V
GS
=0 V,
T
j
=150 °C
- - -100
Gate-source leakage current
I
GSS
V
GS
= -12 V, V
DS
=0 V
- - -100 nA
Drain-source on-state resistance
R
DS(on)
V
GS
=2.5 V, I
D
=-7 A
-2234
mΩ
V
GS
=4.5 V, I
D
=-8.9 A
-1521
Gate resistance
R
G
- 3.3 -
Ω
Transconductance
g
fs
|V
DS
|>2|I
D
|R
DS(on)max
,
I
D
=-7.1 A
18 33 - S
3)
See figure 13 for more detailed information
Values
1)
Device on 40 mm x 40 mm x 1.5 mm epoxy PCB FR4 with 6 cm2 (one layer, 70 µm thick) copper area for drain
connection. PCB is vertical in still air.
2)
See figure 3 for more detailed information
Rev.1.31 page 2 2010-02-10
