NLSV4T240EDTR2G

NLSV4T240E
http://onsemi.com
7
APPLICATIONS INFORMATION
Figure 5. Typical TriState Output
(C
L
= 50 pF, R
L
= 2 kW, R
pullup
= 50 kW, test circuit shown in Figure 3)
Figure 6. Typical TriState Output
(C
L
= 50 pF, R
L
= R, R
Pullup
= 2 kW, test circuit shown in Figure 3)
Typical tristate output waveforms of the NLSX4T240E
are shown in Figures 5 and 6. The shape of the output
waveform during a tristate condition corresponding to the
disable time (t
PHZ
, t
pLZ
) depends on the configuration of the
pullup circuit. Figure 5 shows a smooth monotonically
increasing exponentially waveform because a 2 kW
resistance is connected between the output and ground.
Figure 6 shows that the output may have a ‘shelf’ or a short
duration where the slope of the waveform is equal to zero if
no load resistance is connected to ground. The
NLSX4T240E was created from the NLSX4T240 to
minimize the ‘shelf’ of the waveform during the disable
time.
NLSV4T240E
http://onsemi.com
8
PACKAGE DIMENSIONS
UQFN12 1.7x2.0, 0.4P
CASE 523AE01
ISSUE A
A
b
A1
0.05
C
SEATING
PLANE
NOTE 3
NOTES:
1. DIMENSIONING AND TOLERANCING PER ASME
Y14.5M, 1994.
2. CONTROLLING DIMENSION: MILLIMETERS
3. DIMENSION b APPLIES TO PLATED TERMINAL
AND IS MEASURED BETWEEN 0.15 AND 0.30 MM
FROM TERMINAL TIP.
4. MOLD FLASH ALLOWED ON TERMINALS
ALONG EDGE OF PACKAGE. FLASH 0.03
MAX ON BOTTOM SURFACE OF
TERMINALS.
5. DETAIL A SHOWS OPTIONAL
CONSTRUCTION FOR TERMINALS.
DIM MIN MAX
MILLIMETERS
A
A1
0.40 BSC
0.45 0.55
b
D
0.45 0.55
E
e
L
0.00 0.05
PIN 1 REFERENCE
D A
E
B
0.10 C
2X
0.10 C
2X
0.05 C
C
K
75
1
11
12X
e
L12X
2.00 BSC
0.15 0.25
12X
A3
DETAIL B
8X
L2
DETAIL B
OPTIONAL
CONSTRUCTION
0.15 REF
L2
K
0.127 REF
A3
1.70 BSC
TOP VIEW
SIDE VIEW
BOTTOM VIEW
NOTE 5
L1
DETAIL A
DETAIL A
BAC
C
M
0.10
M
0.05
0.32
11X
2.30
0.69
0.40
DIMENSIONS: MILLIMETERS
MOUNTING FOOTPRINT
1
SOLDERMASK DEFINED
0.00 0.03L1
0.22
2.00
PITCH
12X
0.20 ----
*For additional information on our PbFree strategy and soldering
details, please download the ON Semiconductor Soldering and
Mounting Techniques Reference Manual, SOLDERRM/D.
NLSV4T240E
http://onsemi.com
9
PACKAGE DIMENSIONS
SOIC14
D SUFFIX
CASE 751A03
ISSUE J
NOTES:
1. DIMENSIONING AND TOLERANCING PER
ANSI Y14.5M, 1982.
2. CONTROLLING DIMENSION: MILLIMETER.
3. DIMENSIONS A AND B DO NOT INCLUDE
MOLD PROTRUSION.
4. MAXIMUM MOLD PROTRUSION 0.15 (0.006)
PER SIDE.
5. DIMENSION D DOES NOT INCLUDE
DAMBAR PROTRUSION. ALLOWABLE
DAMBAR PROTRUSION SHALL BE 0.127
(0.005) TOTAL IN EXCESS OF THE D
DIMENSION AT MAXIMUM MATERIAL
CONDITION.
A
B
G
P
7 PL
14
8
7
1
M
0.25 (0.010) B
M
S
B
M
0.25 (0.010) A
S
T
T
F
R
X 45
SEATING
PLANE
D 14 PL
K
C
J
M
_
DIM MIN MAX MIN MAX
INCHESMILLIMETERS
A 8.55 8.75 0.337 0.344
B 3.80 4.00 0.150 0.157
C 1.35 1.75 0.054 0.068
D 0.35 0.49 0.014 0.019
F 0.40 1.25 0.016 0.049
G 1.27 BSC 0.050 BSC
J 0.19 0.25 0.008 0.009
K 0.10 0.25 0.004 0.009
M 0 7 0 7
P 5.80 6.20 0.228 0.244
R 0.25 0.50 0.010 0.019
__ __
7.04
14X
0.58
14X
1.52
1.27
DIMENSIONS: MILLIMETERS
1
PITCH
SOLDERING FOOTPRINT
7X

NLSV4T240EDTR2G

Mfr. #:
Manufacturer:
ON Semiconductor
Description:
Translation - Voltage Levels 4BIT INVERTING TRANSLATOR
Lifecycle:
New from this manufacturer.
Delivery:
DHL FedEx Ups TNT EMS
Payment:
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