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ST75C176B - ST75C176C
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Figure 16. Receiver low level output voltage
vs temperature
Figure 17. Differential driver output voltage vs
temperature
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Package mechanical data ST75C176B - ST75C176C
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6 Package mechanical data
In order to meet environmental requirements, ST offers these devices in ECOPACK®
packages. These packages have a lead-free second level interconnect. The category of
second level interconnect is marked on the package and on the inner box label, in
compliance with JEDEC Standard JESD97. The maximum ratings related to soldering
conditions are also marked on the inner box label. ECOPACK is an ST trademark.
ECOPACK specifications are available at: www.st.com
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ST75C176B - ST75C176C
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DIM.
mm. inch
MIN. TYP MAX. MIN. TYP. MAX.
A 3.3 0.130
a1 0.7 0.028
B 1.39 1.65 0.055 0.065
B1 0.91 1.04 0.036 0.041
b 0.5 0.020
b1 0.38 0.5 0.015 0.020
D 9.8 0.386
E 8.8 0.346
e 2.54 0.100
e3 7.62 0.300
e4 7.62 0.300
F 7.1 0.280
I 4.8 0.189
L 3.3 0.130
Z 0.44 1.6 0.017 0.063
Plastic DIP-8 MECHANICAL DATA
P001F

ST75C176CDR

Mfr. #:
Manufacturer:
STMicroelectronics
Description:
IC TXRX RS422/485 2.5MBPS 8SO
Lifecycle:
New from this manufacturer.
Delivery:
DHL FedEx Ups TNT EMS
Payment:
T/T Paypal Visa MoneyGram Western Union

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