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LPS331APTR

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This is information on a product in full production.
March 2012 Doc ID 022112 Rev 7 1/36
36
LPS331AP
MEMS pressure sensor: 260-1260 mbar absolute digital output
barometer
Datasheet − production data
Features
■ 260 to 1260 mbar absolute pressure range
■ High-resolution mode: 0.020 mbar RMS
■ Low power consumption:
– Low resolution mode: 5.5
µA
– High resolution mode: 30
µA
■ High overpressure capability: 20x full scale
■ Embedded temperature compensation
■ Embedded 24-bit ADC
■ Selectable ODR from 1 Hz to 25 Hz
■ SPI and I
2
C interfaces
■ Supply voltage: 1.71 to 3.6 V
■ High shock survivability: 10,000 g
■ Small and thin package
■ ECOPACK
®
lead-free compliant
Applications
■ Indoor and outdoor navigation
■ Enhanced GPS for dead-reckoning
■ Altimeter and barometer for portable devices
■ Weather station equipment
■ Sport watches
Description
The LPS331AP is an ultra compact absolute
piezoresistive pressure sensor. It includes a
monolithic sensing element and an IC interface
able to take the information from the sensing
element and to provide a digital signal to the
external world.
The sensing element consists of a suspended
membrane realized inside a single mono-silicon
substrate. It is capable to detecting pressure and
is manufactured using a dedicated process
developed by ST, called VENSENS.
The VENSENS process allows to build a mono-
silicon membrane above an air cavity with
controlled gap and defined pressure. The
membrane is very small compared to the
traditionally built silicon micromachined
membranes. Membrane breakage is prevented by
an intrinsic mechanical stopper.
The IC interface is manufactured using a standard
CMOS process that allows a high level of
integration to design a dedicated circuit which is
trimmed to better match the sensing element
characteristics.
The LPS331AP is available in a small holed cap
land grid array (HCLGA) package and it is
guaranteed to operate over a temperature range
extending from -40 °C to +85 °C. The package is
holed to allow external pressure to reach the
sensing element.
HCLGA-16L
(3 x 3 x 1 mm)
Table 1. Device summary
Order codes Temperature range [°C] Package Packing
LPS331APY
-40 to +85 HCLGA-16L
Tray
LPS331APTR Tape and reel
www.st.com
Contents LPS331AP
2/36 Doc ID 022112 Rev 7
Contents
1 Block diagram and pin description . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3
1.1 LPS331AP block diagram . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3
1.2 Pin description . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3
2 Mechanical and electrical specifications . . . . . . . . . . . . . . . . . . . . . . . . 5
2.1 Mechanical characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 5
2.2 Electrical characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 6
2.3 Absolute maximum ratings . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 7
3 Functionality . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 8
3.1 Sensing element . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 8
3.2 IC interface . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 8
3.3 Factory calibration . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 8
4 Application hints . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 9
4.1 Soldering information . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 9
5 Digital interfaces . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 10
5.1 I2C serial interface . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 10
5.2 I2C serial interface . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 10
5.2.1 I2C operation . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 11
5.3 SPI bus interface . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 12
5.3.1 SPI read . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 13
5.3.2 SPI write . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 14
5.3.3 SPI read in 3-wires mode . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 15
6 Register mapping . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 16
7 Register description . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 17
8 Package mechanical section . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 32
9 Revision history . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 35
LPS331AP Block diagram and pin description
Doc ID 022112 Rev 7 3/36
1 Block diagram and pin description
1.1 LPS331AP block diagram
Figure 1. LPS331AP block diagram
1.2 Pin description
Figure 2. Pin connection
AM08736V1
p
I
2
C
CS
SPI
SCL/SPC
SDA/SDO/ SDI
SA0/SDO
Sensing
element
Temperature
sensor
Sensor bias
Voltage and
current bias
Clock and timing
DSP for temperature
compensation
ADC
+ digital filter
Low noise
analog front end
MUX
Vup
Rs
Rs
Rs
Rs
Vdown
Vout
AM08737V1
13 1
5
9
Pin 1 indicator
Bottom view
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LPS331APTR

Mfr. #:
Buy LPS331APTR
Manufacturer:
STMicroelectronics
Description:
IC PRESSURE SENSOR PIEZO 16HCLGA
Lifecycle:
New from this manufacturer.
Delivery:
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