© Semiconductor Components Industries, LLC, 2013
November, 2017 − Rev. 4
1 Publication Order Number:
ESD9C3.3S/D
ESD9C3.3ST5G SERIES
ESD Protection Diode
Micro−Packaged Diodes for ESD Protection
The ESD9C3.3ST5G Series is designed to protect voltage sensitive
components from ESD. Excellent clamping capability, low leakage, and
fast response time make these parts ideal for ESD protection on designs
where board space is at a premium. Because of its small size, it is suited
for use in cellular phones, portable devices, digital cameras, power
supplies and many other portable applications.
Specification Features:
• Low Capacitance 6.2 pF − 13 pF
• Low Clamping Voltage
• Small Body Outline Dimensions:
0.039″ x 0.024″ (1.0 mm x 0.60 mm)
• Low Body Height: 0.016″ (0.40 mm) Max
• Stand−off Voltage: 3.3 V, 5 V
• Low Leakage
• Response Time < 1 ns
• ESD Rating of Class 3 (> 16 kV) per Human Body Model
• IEC61000−4−2 Level 4 ESD Protection
• AEC−Q101 Qualified and PPAP Capable
• These are Pb−Free Devices
Mechanical Characteristics:
CASE:
Void-free, transfer-molded, thermosetting plastic
Epoxy Meets UL 94 V−0
LEAD FINISH: 100% Matte Sn (Tin)
MOUNTING POSITION: Any
QUALIFIED MAX REFLOW TEMPERATURE: 260°C
Device Meets MSL 1 Requirements
MAXIMUM RATINGS
Rating Symbol Value Unit
IEC 61000−4−2 (ESD) Contact
Air
±8.0
±15
kV
Total Power Dissipation on FR−5 Board
(Note 1) @ T
A
= 25°C
⎪P
D
150
mW
Junction and Storage Temperature
Range
T
J
, T
stg
−55 to +150 °C
Lead Solder Temperature − Maximum
(10 Second Duration)
T
L
260 °C
Stresses exceeding those listed in the Maximum Ratings table may damage the
device. If any of these limits are exceeded, device functionality should not be
assumed, damage may occur and reliability may be affected.
1. FR−5 = 1.0 x 0.75 x 0.62 in.
See Application Note AND8308/D for further description of survivability specs.
Device Package Shipping
†
ORDERING INFORMATION
ESD9CxxST5G SOD−923
(Pb−Free)
8000/Tape & Reel
MARKING
DIAGRAM
See specific marking information in the device marking
column of the table on page 2 of this data sheet.
DEVICE MARKING INFORMATION
www.onsemi.com
†For information on tape and reel specifications,
including part orientation and tape sizes, please
refer to our Tape and Reel Packaging Specifications
Brochure, BRD8011/D.
SOD−923
CASE 514AB
X = Specific Device Code
M = Date Code
12
PIN 1. CATHODE
2. ANODE
X M