Data Sheet HMC129ALC4
Rev. 0 | Page 5 of 16
PIN CONFIGURATION AND FUNCTION DESCRIPTIONS
Figure 2. Pin Configuration
Table 4. Pin Function Descriptions
Pin No. Mnemonic Description
1, 5, 6, 7, 11 to 14,
18 to 24
NIC Not Internally Connected. These pins can be connected to RF/dc ground. Performance is not affected.
2, 4, 8, 10, 15, 17 GND Ground. These pins and package bottom must be connect to RF/dc ground.
3 RF Radio Frequency Port. This pin is ac-coupled and matched to 50 Ω.
9 IF
Intermediate Frequency Port. This pin is dc-coupled. For applications not requiring operation to dc, dc
block this port externally using a series capacitor of a value chosen to pass the necessary IF frequency
range. For operation to dc, this pin must not source/sink more than 6 mA of current or die malfunction
and possible die failure may result.
16 LO Local Oscillator Port. This pin is dc-coupled and matched to 50 Ω.
EPAD Exposed Pad. The exposed pad must be connected to RF/dc ground.
INTERFACE SCHEMATICS
Figure 3. GND Interface Schematic
Figure 4. LO Interface Schematic
Figure 5. IF Interface Schematic
Figure 6. RF Interface Schematic
13
1
3
4
2
7
NIC
GND
RF
GND
5
6
NIC
NIC
NIC
PACKAGE
BASE
GND
14
NIC
15
GND
16
LO
17
GND
18
NIC
NIC
8
GND
9
IF
10
GND
11
NIC
12
19
NIC
NIC
20
NIC
21
NIC
22
NIC
23
NIC
24
NIC
13882-002
HMC129ALC4
TOP VIEW
(Not to Scale)
NOTES
1. NIC = NOT INTERNALLY CONNECTED. THESE
PINS CAN BE CONNECTED TO RF/DC
GROUND. PERFORMANCE IS NOT AFFECTED.
. EXPOSED PAD. THE EXPOSED PAD MUST B
CONNECTED TO RF/DC GROUND.
GND
13882-003
LO
13882-004
I
13882-005
RF
13882-006
