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MC74VHC257DTR2

P1-P3P4-P6P7-P8
MC74VHC257
http://onsemi.com
4
DC CHARACTERISTICS (Voltages Referenced to GND)
V
CC
T
A
= 25°C T
A
≤ 85°C –55°C ≤ T
A
≤ 125°C
Symbol Parameter Condition (V) Min Typ Max Min Max Min Max Unit
V
IH
Minimum High–Level
Input Voltage
2.0
3.0 to
5.5
1.5
V
CCX
0.7
1.5
V
CCX
0.7
1.5
V
CCX
0.7
1.5
V
CCX
0.7
V
V
IL
Maximum Low–Level
Input Voltage
2.0
3.0 to
5.5
0.5
V
CCX
0.3
0.5
V
CCX
0.3
0.5
V
CCX
0.3
V
V
OH
Maximum High–Level
Output Voltage
V
IN
= V
IH
or V
IL
I
OH
= –50 µA
2.0
3.0
4.5
1.9
2.9
4.4
2.0
3.0
4.5
1.9
2.9
4.4
1.9
2.9
4.4
V
V
IN
= V
IH
or V
IL
I
OH
= –4 mA
I
OH
= –8 mA
3.0
4.5
2.58
3.94
2.48
3.8
2.34
3.66
V
OL
Maximum Low–Level
Output Voltage
V
IN
= V
IH
or V
IL
I
OL
= 50 µA
2.0
3.0
4.5
0.0
0.0
0.0
0.1
0.1
0.1
0.1
0.1
0.1
0.1
0.1
0.1
V
V
IN
= V
IH
or V
IL
I
OH
= 4 mA
I
OH
= 8 mA
3.0
4.5
0.36
0.36
0.44
0.44
0.52
0.52
I
IN
Input Leakage Current V
IN
= 5.5 V or GND 0 to
5.5
±0.1 ±1.0 ±1.0 µA
I
OZ
Maximum 3–State
Leakage Current
V
IN
= V
IH
or V
IL
V
OUT
= V
CC
or GND
5.5 ±0.25 ±2.5 ±2.5 µA
I
CC
Maximum Quiescent
Supply Current
(per package)
V
IN
= V
CC
or GND 5.5 4.0 40.0 40.0 µA
AC ELECTRICAL CHARACTERISTICS (Input t
r
= t
f
= 3.0ns)
T
A
= 25°C T
A
= ≤ 85°C –55°C ≤ T
A
≤ 125°C
Symbol Parameter Test Conditions
Min Typ Max Min Max Min Max
Unit
t
PLH
,
t
PHL
Maximum Propagation
Delay
ABtY
V
CC
= 3.3 ± 0.3V C
L
= 15pF
C
L
= 50pF
5.8
8.3
9.3
12.8
1.0
1.0
11.0
14.5
1.0
1.0
11.0
14.5
ns
PHL
y
A or B to Y
V
CC
= 5.0 ± 0.5V C
L
= 15pF
C
L
= 50pF
3.6
5.1
5.9
7.9
1.0
1.0
7.0
9.0
1.0
1.0
7.0
9.0
t
PLH
,
t
PHL
Maximum Propagation
Delay
St Y
V
CC
= 3.3 ± 0.3V C
L
= 15pF
C
L
= 50pF
7.0
9.5
11.0
14.5
1.0
1.0
13.0
16.5
1.0
1.0
13.0
16.5
ns
PHL
y
S to Y
V
CC
= 5.0 ± 0.5V C
L
= 15pF
C
L
= 50pF
4.0
5.5
6.8
8.8
1.0
1.0
8.0
10.0
1.0
1.0
8.0
10.0
t
PZL
,
t
PZH
Maximum Output Enable
Time
OE tY
V
CC
= 3.3 ± 0.3V C
L
= 15pF
R
L
= 1 k C
L
= 50pF
6.7
9.2
10.5
14.0
1.0
1.0
12.5
16.0
1.0
1.0
12.5
16.0
ns
PZH
OE to Y
V
CC
= 5.0 ± 0.5V C
L
= 15pF
R
L
= 1 k C
L
= 50pF
3.6
5.1
6.8
8.8
1.0
1.0
8.0
10.0
1.0
1.0
8.0
10.0
t
PLZ
,
t
PHZ
Maximum Output Disable
Time
OE tY
V
CC
= 3.3 ± 0.3V C
L
= 50pF
R
L
= 1 k
12.0 15.0 1.0 16.0 1.0 17.5
ns
PHZ
OE to Y
V
CC
= 5.0 ± 0.5V C
L
= 50pF
R
L
= 1 k
5.7 13.0 1.0 14.0 1.0 15.0
C
IN
Maximum Input
Capacitance
4 10 10 10 pF
Typical @ 25°C, V
CC
= 5.0V
C
PD
Power Dissipation Capacitance (Note 6.)
20
pF
6. C
PD
is defined as the value of the internal equivalent capacitance which is calculated from the operating current consumption without load.
Average operating current can be obtained by the equation: I
CC(OPR
)
= C
PD
V
CC
f
in
+ I
CC
. C
PD
is used to determine the no–load dynamic
power consumption; P
D
= C
PD
V
CC
2
f
in
+ I
CC
V
CC
.
MC74VHC257
http://onsemi.com
5
NOISE CHARACTERISTICS (Input t
r
= t
f
= 3.0ns, C
L
= 50pF, V
CC
= 5.0V)
T
A
= 25°C
Symbol Characteristic
Typ Max
Unit
V
OLP
Quiet Output Maximum Dynamic V
OL
0.3 0.8 V
V
OLV
Quiet Output Minimum Dynamic V
OL
– 0.3 – 0.8 V
V
IHD
Minimum High Level Dynamic Input Voltage 3.5 V
V
ILD
Maximum Low Level Dynamic Input Voltage 1.5 V
A, B or S
Figure 5. Switching Waveform Figure 6. Switching Waveform
Figure 7. Test Circuit
V
CC
GND
Y
t
PHL
t
PLH
50%
50% V
CC
Figure 8. Test Circuit
INPUT
*Includes all probe and jig capacitance
OUTPUT
TEST POINT
C
L
*
1 kΩ
CONNECT TO V
CC
WHEN
TESTING t
PLZ
AND t
PZL.
CONNECT TO GND WHEN
TESTING t
PHZ
AND t
PZH.
DEVICE
UNDER
TEST
Figure 9. Input Equivalent Circuit
*Includes all probe and jig capacitance
C
L
*
TEST POINT
DEVICE
UNDER
TEST
OUTPUT
50%
50% V
CC
50% V
CC
V
CC
GND
HIGH
IMPEDANCE
V
OL
+ 0.3V
V
OH
- 0.3V
Y
Y
OE
t
PZL
t
PLZ
t
PZH
t
PHZ
HIGH
IMPEDANCE
MC74VHC257
http://onsemi.com
6
PACKAGE DIMENSIONS
NOTES:
1. DIMENSIONING AND TOLERANCING PER ANSI
Y14.5M, 1982.
2. CONTROLLING DIMENSION: MILLIMETER.
3. DIMENSIONS A AND B DO NOT INCLUDE
MOLD PROTRUSION.
4. MAXIMUM MOLD PROTRUSION 0.15 (0.006)
PER SIDE.
5. DIMENSION D DOES NOT INCLUDE DAMBAR
PROTRUSION. ALLOWABLE DAMBAR
PROTRUSION SHALL BE 0.127 (0.005) TOTAL
IN EXCESS OF THE D DIMENSION AT
MAXIMUM MATERIAL CONDITION.
18
16 9
SEATING
PLANE
F
J
M
R
X 45
G
8 PLP
–B–
–A–
M
0.25 (0.010) B
S
–T–
D
K
C
16 PL
S
B
M
0.25 (0.010) A
S
T
DIM MIN MAX MIN MAX
INCHESMILLIMETERS
A 9.80 10.00 0.386 0.393
B 3.80 4.00 0.150 0.157
C 1.35 1.75 0.054 0.068
D 0.35 0.49 0.014 0.019
F 0.40 1.25 0.016 0.049
G 1.27 BSC 0.050 BSC
J 0.19 0.25 0.008 0.009
K 0.10 0.25 0.004 0.009
M 0 7 0 7
P 5.80 6.20 0.229 0.244
R 0.25 0.50 0.010 0.019

SOIC–16
D SUFFIX
CASE 751B–05
ISSUE J
DIM MIN MAX MIN MAX
INCHESMILLIMETERS
A 4.90 5.10 0.193 0.200
B 4.30 4.50 0.169 0.177
C --- 1.20 --- 0.047
D 0.05 0.15 0.002 0.006
F 0.50 0.75 0.020 0.030
G 0.65 BSC 0.026 BSC
H 0.18 0.28 0.007 0.011
J 0.09 0.20 0.004 0.008
J1 0.09 0.16 0.004 0.006
K 0.19 0.30 0.007 0.012
K1 0.19 0.25 0.007 0.010
L 6.40 BSC 0.252 BSC
M 0 8 0 8
NOTES:
1. DIMENSIONING AND TOLERANCING PER ANSI
Y14.5M, 1982.
2. CONTROLLING DIMENSION: MILLIMETER.
3. DIMENSION A DOES NOT INCLUDE MOLD FLASH.
PROTRUSIONS OR GATE BURRS. MOLD FLASH
OR GATE BURRS SHALL NOT EXCEED 0.15
(0.006) PER SIDE.
4. DIMENSION B DOES NOT INCLUDE INTERLEAD
FLASH OR PROTRUSION. INTERLEAD FLASH OR
PROTRUSION SHALL NOT EXCEED
0.25 (0.010) PER SIDE.
5. DIMENSION K DOES NOT INCLUDE DAMBAR
PROTRUSION. ALLOWABLE DAMBAR
PROTRUSION SHALL BE 0.08 (0.003) TOTAL IN
EXCESS OF THE K DIMENSION AT MAXIMUM
MATERIAL CONDITION.
6. TERMINAL NUMBERS ARE SHOWN FOR
REFERENCE ONLY.
7. DIMENSION A AND B ARE TO BE DETERMINED
AT DATUM PLANE -W-.

SECTION N–N
SEATING
PLANE
IDENT.
PIN 1
1
8
16
9
DETAIL E
J
J1
B
C
D
A
K
K1
H
G
DETAIL E
F
M
L
2X L/2
–U–
S
U0.15 (0.006) T
S
U0.15 (0.006) T
S
U
M
0.10 (0.004) V
S
T
0.10 (0.004)
–T–
–V–
–W–
0.25 (0.010)
16X REFK
N
N
TSSOP–16
DT SUFFIX
CASE 948F–01
ISSUE O
P1-P3P4-P6P7-P8

MC74VHC257DTR2

Mfr. #:
Buy MC74VHC257DTR2
Manufacturer:
ON Semiconductor
Description:
Encoders, Decoders, Multiplexers & Demultiplexers 2-5.5V Quad 3-State
Lifecycle:
New from this manufacturer.
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