17/19
XC6801
Series
● SOT-25 Power Dissipation
Board Mount (Tj max = 125℃)
Ambient Temperature（℃） Power Dissipation Pd（mW） Thermal Resistance (℃/W)
25 600
166.67
85 240
Pd-Ta特性グラフ
0
100
200
300
400
500
600
700
25 45 65 85 105 125
周辺温度Ta（℃）
許容損失Pd（mW）
■PACKAGING INFORMATION (Continued)
Power dissipation data for the SOT-25 is shown in this page.
The value of power dissipation varies with the mount board conditions.
Please use this data as one of reference data taken in the described condition.
1. Measurement Condition (Reference data)
Condition: Mount on a board
Ambient: Natural convection
Soldering: Lead (Pb) free
Board: Dimensions 40 x 40 mm (1600 mm
2
in one side)
Copper (Cu) traces occupy 50% of the board area
In top and back faces
Package heat-sink is tied to the copper traces
(Board of SOT-26 is used.)
Material: Glass Epoxy (FR-4)
Thickness: 1.6 mm
Through-hole: 4 x 0.8 Diameter
Evaluation Board (Unit: mm)
2. Power Dissipation vs. Ambient Temperature
Pd vs. Ta
Ambient Temperature Ta (℃)
Power Dissipation Pd (mW)
