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NB2309AC1DT

P1-P3P4-P6P7-P9P10-P10
NB2309A
http://onsemi.com
4
Table 3. MAXIMUM RATINGS
Parameter Min Max Unit
Supply Voltage to Ground Potential −0.5 +7.0 V
DC Input Voltage (Except REF) −0.5 V
DD
+ 0.5 V
DC Input Voltage (REF) −0.5 7 V
Storage Temperature −65 +150 °C
Maximum Soldering Temperature (10 sec) 260 °C
Junction Temperature 150 °C
Static Discharge Voltage (per MIL−STD−883, Method 3015) >2000 V
Maximum ratings are those values beyond which device damage can occur. Maximum ratings applied to the device are individual stress limit
values (not normal operating conditions) and are not valid simultaneously. If these limits are exceeded, device functional operation is not implied,
damage may occur and reliability may be affected.
Table 4. OPERATING CONDITIONS FOR COMMERCIAL AND INDUSTRIAL TEMPERATURE DEVICES
Parameter Description Min Max Unit
V
DD
Supply Voltage 3.0 3.6 V
T
A
Operating Temperature (Ambient Temperature) Commercial
Industrial
0
−40
70
85
°C
C
L
Load Capacitance, below 100 MHz 30 pF
C
L
Load Capacitance, from 100 MHz to 133 MHz 10 pF
C
IN
Input Capacitance 7 pF
Table 5. ELECTRICAL CHARACTERISTICS FOR COMMERCIAL AND INDUSTRIAL TEMPERATURE DEVICES
Parameter Description Test Conditions Min Max Unit
V
IL
Input LOW Voltage (Note 5) 0.8 V
V
IH
Input HIGH Voltage (Note 5) 2.0 V
I
IL
Input LOW Current V
IN
= 0 V 50.0
A
I
IH
Input HIGH Current V
IN
= V
DD
100.0
A
V
OL
Output LOW Voltage I
OL
= 8 mA (−1)
I
OL
= 12 mA (−1H)
0.4 V
V
OH
Output HIGH Voltage I
OH
= −8 mA (−1)
I
OH
= −12 mA (−1H)
2.4 V
I
DD
Supply Current (Commercial Temp) Unloaded outputs at 66.67 MHz,
Select inputs at V
DD
34 mA
I
DD
Supply Current (Industrial Temp) Unloaded outputs at 100 MHz
66.67 MHz
33 MHz
Select inputs at V
DD
or GND, at Room
Temp
50
34
19
mA
5. REF input has a threshold voltage of V
DD
/2.
NB2309A
http://onsemi.com
5
Table 6. SWITCHING CHARACTERISTICS (Commercial and Industrial) (Note 6)
Parameter Description Test Conditions Min Typ Max Unit
1/t
1
Output Frequency 30 pF load
10 pF load
15
15
100
133.33
MHz
1/t
1
Duty Cycle = (t
2
/ t
1
) * 100 (−1, −1H)
(−1H)
Measured at 1.4 V, F
OUT
= 66.67 MHz
< 50 MHz
40
45
50
50
60
55
%
t
3
Output Rise Time (−1, −1H)
(−1H)
Measured between 0.8 V and 2.0 V 2.5
1.5
ns
t
4
Output Fall Time Measured between 2.0 V and 0.8 V 1.5 ns
t
5
Output−to−Output Skew All outputs equally loaded 250 ps
t
6
Delay, REF Rising Edge to CLKOUT
Rising Edge
Measured at V
DD
/2 0 ±350 ps
t
7
Device−to−Device Skew Measured at V
DD
/2 on the CLKOUT pins of
the device
0 700 ps
t
8
Output Slew Rate Measured between 0.8 V and 2.0 V using
Test Circuit #2
1 V/ns
t
J
Cycle−to−Cycle Jitter Measured at 66.67 MHz, loaded outputs 200 ps
t
LOCK
PLL Lock Time Stable power supply, valid clock presented
on REF pin
1.0 ms
tr
in
REF Input Rise Time Measured between 0.8 V to 2.0 V 1.0 ns
tf
in
REF Input Rise Fall Time Measured between 2.0 V to 0.8 V 1.0 ns
6. All parameters specified with loaded outputs and apply to both PLL−Mode and PLL−Bypass Mode.
NB2309A
http://onsemi.com
6
Zero Delay and Skew Control
All outputs should be uniformly loaded to achieve Zero
Delay between input and output. Since the CLKOUT pin is
the internal feedback to the PLL, its relative loading can
adjust the input−output delay.
For applications requiring zero input−output delay, all
outputs, including CLKOUT, must be equally loaded. Even
if CLKOUT is not used, it must have a capacitive load equal
to that on other outputs, for obtaining zero−input−output
delay.
SWITCHING WAVEFORMS
Figure 3. Duty Cycle Timing
1.4 V 1.4 V 1.4 V
t
1
t
2
Figure 4. All Outputs Rise/Fall Time
t
3
OUTPUT
2.0 V
0.8 V
t
4
2.0 V
0.8 V
3.3 V
0 V
1.4 V
1.4 V
t
5
Figure 5. Output − Output Skew
OUTPUT
OUTPUT
t
6
INPUT
OUTPUT
Figure 6. Input − Output Propagation Delay
V
DD
2
V
DD
2
Figure 7. Device − Device Skew
t
7
CLKOUT, Device 1
V
DD
2
V
DD
2
CLKOUT, Device 2
P1-P3P4-P6P7-P9P10-P10

NB2309AC1DT

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Buy NB2309AC1DT
Manufacturer:
ON Semiconductor
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IC BUFFER CLK 9OUT 3.3V 16-TSSOP
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