NCP2823 Series
http://onsemi.com
3
PIN FUNCTION DESCRIPTION
Pin
Pin
Name
Type Description
A1 INP INPUT Positive Differential Input
C1 INN INPUT Negative Differential Input
B2 PVDD POWER
Power Supply: This pin is the power supply of the device. A 4.7 mF ceramic capacitor or larger must
bypass this input to the ground. This capacitor should be placed as close a possible to this input.
B1 AVDD POWER Analog Power Supply: This pin must be connected to PVDD.
C3 VOUTP OUTPUT Positive output Special care must be observed at layout level. See the Layout recommendations.
A3 VOUTN OUTPUT Negative output: Special care must be observed at layout level. See the Layout recommendations.
C2 EN INPUT Enable: When a High logic is applied to this pin, the device is activated
B3 PGND POWER Power Ground: This pin is the power ground and carries the high switching current. A high quality
ground must be provided to avoid any noise spikes/uncontrolled operation. Care must be observed to
avoid high−density current flow in a limited PCB copper track.
A2 AGND POWER Analog Ground: This pin is the analog ground of the device and must be connected to GND plane.
MAXIMUM RATINGS
Rating Symbol Value Unit
AVDD, PVDD Pins: Power Supply Voltage (Note 2) V
P
−0.3 to +6.0 V
INP/N ,Pins: Input (Note 2) V
INP/N
−0.3 to +V
DD
V
Digital Input/Output: EN Pin:
Input Voltage
Input Current
V
DG
I
DG
−0.3 to V
DD
+0.3
1
V
mA
Human Body Model (HBM) ESD Rating are (Note 3) ESD HBM 2000 V
Machine Model (MM) ESD Rating are (Note 3) ESD MM 200 V
WCSP 1.5 x 1.5 mm package (Notes 6 and 7)
Thermal Resistance Junction−to−Case
R
q
JC
90 °C/W
Operating Ambient Temperature Range T
A
−40 to +85 °C
Operating Junction Temperature Range T
J
−40 to +125 °C
Maximum Junction Temperature (Note 6) T
JMAX
+150 °C
Storage Temperature Range T
STG
−65 to +150 °C
Moisture Sensitivity (Note 5) MSL Level 1
Stresses exceeding Maximum Ratings may damage the device. Maximum Ratings are stress ratings only. Functional operation above the
Recommended Operating Conditions is not implied. Extended exposure to stresses above the Recommended Operating Conditions may affect
device reliability.
1. Maximum electrical ratings are defined as those values beyond which damage to the device may occur at T
A
= 25°C.
2. According to JEDEC standard JESD22−A108B.
3. This device series contains ESD protection and passes the following tests:
Human Body Model (HBM) +/−2.0 kV per JEDEC standard: JESD22−A114 for all pins.
Machine Model (MM) +/−200 V per JEDEC standard: JESD22−A115 for all pins.
4. Latch up Current Maximum Rating: $100 mA per JEDEC standard: JESD78 class II.
5. Moisture Sensitivity Level (MSL): 1 per IPC/JEDEC standard: J−STD−020A.
6. The thermal shutdown set to 150°C (typical) avoids irreversible damage on the device due to power dissipation.
7. The R
q
CA
is dependent on the PCB heat dissipation. The maximum power dissipation (PD) is dependent on the min input voltage, the max
output current and external components selected.
R
qCA
+
125 * T
A
P
D
* R
qJC
