date 04/26/2017
page
1 of 4
cui.com
SERIES: HSE-BX-04H │ DESCRIPTION: HEAT SINK
FEATURES
• TO-220 or TO-218 package
• placement pins for secure PCB attachment
• round hole for component attachment
• multiple available cut lengths
MODEL
thermal resistance
1
power
dissipation
1
length
(mm)
@ 75°C ΔT,
nat conv
(°C/W)
@ 1 W,
nat conv
(°C/W)
@ 1 W,
200 LFM
(°C/W)
@ 1 W,
400 LFM
(°C/W)
@ 75°C ΔT,
nat conv
(W)
HSE-B254-04H 25.4 15.96 16.65 4.93 4.13 4.70
HSE-B381-04H 38.1 12.71 12.33 4.44 2.57 5.90
Note: 1. See performance curves for full thermal resistance details.
2. Custom cut to length options available. Thermal data not available on custom lengths.
PERFORMANCE CURVES
Mounting Surface Temperature
Rise Above Ambient (°C)
0
10
20
30
40
50
60
70
80
90
100
012345
6789
Without Airflow
200 LFM
400 LFM
Heatsink Temperature Rise Above
Ambient (ΔT = Ths - Ta) (°C)
Power
(W)
Natural
Conv.
200 LFM 400 LFM
0 0 0 0
1 16.65 4.93 4.13
2 33.54 11.08 8.61
3 49.96 17.20 13.23
4 65.78 23.50 17.80
5 78.65 29.14 21.94
6 92.33 35.03 26.22
7 105.77 41.10 30.69
8 117.14 46.59 35.07
9 127.85 53.10 39.55
10 137.37 59.79 44.08
Ths: “hot spot” temperature measured on the heatsink
Ta: ambient temperature
HSE-B254-04H
For more information, please visit the product page.
