VLSL3012A2, VLSL3024A2
www.vishay.com
Vishay Semiconductors
Rev. 1.3, 05-Dec-11
6
Document Number: 83383
For technical questions, contact: LED@vishay.com
THIS DOCUMENT IS SUBJECT TO CHANGE WITHOUT NOTICE. THE PRODUCTS DESCRIBED HEREIN AND THIS DOCUMENT
ARE SUBJECT TO SPECIFIC DISCLAIMERS, SET FORTH AT www.vishay.com/doc?91000
PCB CHARACTERISTICS
• Metal core PCB with typical Al thickness of 800 μm
• Prepreg thickness typical 127 μm
• Conductive pattern Cu typical 25 μm
• Total board thickness: 1 mm ± 15 %
• Warpage max. 0.75 % of board dimension
• Solder resist on top side
• Shiny white surface
• Galvanic of solder pads pure matte Sn (≥ 0.8 μm),
immersion plated
• Assembled with 12 or 24 high brightness power LEDs.
LED position accuracy ± 0.125 mm from middle axis,
horizontal tilt max. 2°
EMISSION CHARACTERISTIC
Fig. 2 - Rel. Luminous Intensity vs. Angular Displacement
Fig. 3 - Sample Board with Reflectors (for Info only)
BAR CODE PRODUCT LABEL
A. Type of component
B. Manufacturing plant
C. SEL - selection code (bin):
e.g.: code for V
F
class (A, B, C)
D. Batch:
200707 = year 2007, week 07
PH19 = plant code
E. Total quantity
0.4 0.2 00.6
0.9
0.8
0° 10° 20° 30°
40°
50°
60°
70°
80°
0.7
1.0
I
V rel
- Relative Luminous Intensity
ϕ - Angular Displacement
horizontal vertical
22143
A
C
B
D
E
20613
