ADA4320-1
Rev. A | Page 6 of 16
ABSOLUTE MAXIMUM RATINGS
MAXIMUM POWER DISSIPATION
Table 4.
Parameter Rating
Supply Voltage 5.5 V
Maximum Power Dissipation 1.65 W
Storage Temperature Range −65°C to +125°C
Operating Temperature Range −40°C to +85°C
Lead Temperature (Soldering, 10 sec) 300°C
Junction Temperature 150°C
The maximum safe power dissipation in the ADA4320-1 package
is limited by the associated rise in junction temperature (T
J
) on
the die. At approximately 150°C, which is the glass transition
temperature, the plastic changes its properties. Even temporarily
exceeding this temperature limit can change the stresses that
the package exerts on the die, permanently shifting the parametric
performance of the ADA4320-1. Exceeding a junction temperature
of 150°C for an extended time can result in changes in the silicon
devices, potentially causing failure.
Stresses above those listed under Absolute Maximum Ratings
may cause permanent damage to the device. This is a stress
rating only; functional operation of the device at these or any
other conditions above those indicated in the operational
section of this specification is not implied. Exposure to absolute
maximum rating conditions for extended periods may affect
device reliability.
Airflow increases heat dissipation, effectively reducing θ
JA
. In
addition, more metal directly in contact with the package leads
from metal traces, through-holes, ground, and power planes,
reduces the θ
JA
. The exposed paddle on the underside of the
package must be soldered to a pad on the PCB surface that is
thermally connected to a copper plane to achieve the specified θ
JA
.
THERMAL RESISTANCE
θ
JA
is specified for the device soldered to a high thermal
conductivity 4-layer (2s2p) circuit board, as described in
EIA/JESD 51-7.
ESD CAUTION
Table 5. Thermal Resistance
Package Type θ
JA
θ
JC
Unit
24-lead LFCSP 31.2 5.7 °C/W
