LT3434
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Figure 9. Power Good
V
OUT
500mV/DIV
PG
100k TO V
IN
V
CT
500mV/DIV
V
SHDN
2V/DIV
TIME (10ms/DIV)
3434 F09
V
IN
PG
PGFB
LT3434
PG at 80% V
OUT
with 100ms Delay
0.27µF
C
OUT
C
OUT
200k
V
OUT
= 3.3V
153k
12k
100k
FB
C
T
V
IN
PG
PGFB
LT3434
V
OUT
Disconnect at 80% V
OUT
with 100ms Delay
0.27µF
200k
V
OUT
= 3.3V
153k
12k
100k
FB
C
T
V
IN
PG
PGFB
LT3434
PG at V
IN
> 4V with 100ms Delay
0.27µF
V
OUT
= 3.3V
200k
511k
200k
100k
165k
FB
C
T
V
IN
PG
PGFB
LT3434
V
OUT
Disconnect 3.3V Logic Signal
with 100µs Delay
270pF
200k
V
OUT
= 12V
3434 F10
866k
100k
FB
C
T
C
OUT
C
OUT
Figure 10. Power Good Circuits
threshold during normal operation, the C
T
pin will be
discharged and PG inactive, resulting in a non Power Good
cycle when SHDN is taken above its threshold. Figure 9
shows the power good operation with PGFB connected to
FB and the capacitance on C
T
= 0.1µF. The PGFB pin has
a limited amount of driver capability and is susceptible to
noise during start-up and Burst Mode operation. If erratic
operation occurs during these conditions a small filter
capacitor from the PGFB pin to ground will ensure proper
operation. Figure 10 shows several different configura-
tions for the LT3434 Power Good circuitry.
LAYOUT CONSIDERATIONS
As with all high frequency switchers, when considering
layout, care must be taken in order to achieve optimal
electrical, thermal and noise performance. For maximum
efficiency switch rise and fall times are typically in the
nanosecond range. To prevent noise both radiated and
conducted the high speed switching current path, shown
in Figure 11, must be kept as short as possible. This is
implemented in the suggested layout of Figure 12. Short-
ening this path will also reduce the parasitic trace induc-
tance of approximately 25nH/inch. At switch off, this
parasitic inductance produces a flyback spike across the
LT3434
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APPLICATIO S I FOR ATIO
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LT3434 switch. When operating at higher currents and
input voltages, with poor layout, this spike can generate
voltages across the LT3434 that may exceed its absolute
maximum rating. A ground plane should always be used
under the switcher circuitry to prevent interplane coupling
and overall noise.
The V
C
and FB components should be kept as far away as
possible from the switch and boost nodes. The LT3434
pinout has been designed to aid in this. The ground for
these components should be separated from the switch
current path. Failure to do so will result in poor stability or
subharmonic like oscillation.
Board layout also has a significant effect on thermal
resistance. Pin 8 and the exposed die pad, Pin 17, are a
continuous copper plate that runs under the LT3434 die.
This is the best thermal path for heat out of the package.
Reducing the thermal resistance from Pin 8 and exposed
pad onto the board will reduce die temperature and in-
crease the power capability of the LT3434. This is achieved
by providing as much copper area as possible around the
exposed pad. Adding multiple solder filled feedthroughs
under and around this pad to an internal ground plane will
also help. Similar treatment to the catch diode and coil
terminations will reduce any additional heating effects.
THERMAL CALCULATIONS
Power dissipation in the LT3434 chip comes from four
sources: switch DC loss, switch AC loss, boost circuit
current, and input quiescent current. The following formu-
las show how to calculate each of these losses. These
formulas assume continuous mode operation, so they
should not be used for calculating efficiency at light load
currents.
Switch loss:
P
RI V
V
tIVf
SW
SW OUT OUT
IN
EFF OUT IN
=
()( )
+
()( )()()
2
12/
Boost current loss:
P
VI
V
BOOST
OUT OUT
IN
=
()( )
2
40/
Quiescent current loss:
P
Q
= V
IN
(0.0026) + V
OUT
(0.001)
R
SW
= switch resistance (0.15 when hot )
t
EFF
= effective switch current/voltage overlap time
(t
r
+ t
f
+ t
IR
+ t
IF
)
t
r
= (V
IN
/1.2)ns
t
f
= (V
IN
/1.7)ns
t
IR
= t
IF
= (I
OUT
/0.2)ns
f = switch frequency
Figure 12. Suggested Layout
Figure 11. High Speed Switching Path
NC
R2
C2
C5
R1
R3
C4
SW
V
IN
V
IN
SW
BOOST
C
T
GND
16
15
14
13
12
11
10
9
1
2
3
4
5
6
7
8
PGOOD
SHDN
SYNC
PGFB
FB
V
C
BIAS
C
SS
3434 F12
C3
GND
GND
D1
L1
V
OUT
C1
C2 D2
MINIMIZE
D1-C3
LOOP
V
IN
KELVIN SENSE
FEEDBACK
TRACE AND
KEEP SEPARATE
FROM BIAS TRACE
CONNECT PIN 8 GND TO THE
PIN 17 EXPOSED PAD GND
PLACE VIA's UNDER EXPOSED
PAD TO A BOTTOM PLANE TO
ENHANCE THERMAL
CONDUCTIVITY
LT3434
C2 C1
3434 F11
D1
L1
V
IN
LT3434
V
OUT
V
IN
SW
42
HIGH
FREQUENCY
CIRCULATION
PATH
+
LOAD
LT3434
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Example: with V
IN
= 40V, V
OUT
= 5V and I
OUT
= 2A:
Pee
SW
=
( )()()
+
()
()
()( )
015 2 5
40
77 9 1 2 2 40 200
2
.
–/
33
008 062 07
5240
40
003
2
()
+=
=
()
()
=
...
/
.P
P
BOOST
Q
==
()
+
()
=40 0 0026 5 0 001 0 109...
Total power dissipation is:
P
TOT
= 0.7 + 0.03 + 0.109 = 0.84
Thermal resistance for the LT3434 package is influenced
by the presence of internal or backside planes. With a full
plane under the FE16 package, thermal resistance will be
about 45°C/W. No plane will increase resistance to about
150°C/W. To calculate die temperature, use the proper
thermal resistance number for the desired package and
add in worst-case ambient temperature:
T
J
= T
A
+ Q
JA
(P
TOT
)
With the FE16 package (Q
JA
= 45°C/W) at an ambient
temperature of 70°C:
T
J
= 70 + 45(0.84) = 108°C
Input Voltage vs Operating Frequency Considerations
The absolute maximum input supply voltage for the LT3434
is specified at 60V. This is based solely on internal semi-
conductor junction breakdown effects. Due to internal
power dissipation the actual maximum V
IN
achievable in a
particular application may be less than this.
A detailed theoretical basis for estimating internal power
loss is given in the section Thermal Considerations. Note
that AC switching loss is proportional to both operating
frequency and output current. The majority of AC switch-
ing loss is also proportional to the square of input voltage.
For example, while the combination of V
IN
= 40V, V
OUT
=
5V at 2A and f
OSC
= 200kHz may be easily achievable,
simultaneously raising V
IN
to 60V and f
OSC
to 700kHz is
not possible. Nevertheless, input voltage transients up to
60V can usually be accommodated, assuming the result-
ing increase in internal dissipation is of insufficient time
duration to raise die temperature significantly.
A second consideration is controllability. A potential limi-
tation occurs with a high step-down ratio of V
IN
to V
OUT
,
as this requires a correspondingly narrow minimum switch
on time. An approximate expression for this (assuming
continuous mode operation) is given as follows:
t
ON(MIN)
= V
OUT
+ V
F
/V
IN
(f
OSC
)
where:
V
IN
= input voltage
V
OUT
= output voltage
V
F
= Schottky diode forward drop
f
OSC
= switching frequency
A potential controllability problem arises if the LT3434 is
called upon to produce an on time shorter than its typical
value of 250ns. Feedback loop action will lower then
reduce the V
C
control voltage to the point where some sort
of cycle-skipping or Burst Mode behavior is exhibited.
In summary:
1. Be aware that the simultaneous requirements of high
V
IN
, high I
OUT
and high f
OSC
may not be achievable in
practice due to internal dissipation. The Thermal Con-
siderations section offers a basis to estimate internal
power. In questionable cases a prototype supply should
be built and exercised to verify acceptable operation.
2. The simultaneous requirements of high V
IN
, low V
OUT
and high f
OSC
can result in an unacceptably short
minimum switch on time. Cycle skipping and/or Burst
Mode behavior will result although correct output volt-
age is usually maintained.
FREQUENCY COMPENSATION
Before starting on the theoretical analysis of frequency
response the following should be remembered—the worse
the board layout, the more difficult the circuit will be to
stabilize. This is true of almost all high frequency analog
circuits. Read the Layout Considerations section first.
Common layout errors that appear as stability problems
are distant placement of input decoupling capacitor and/or

LT3434EFE#PBF

Mfr. #:
Manufacturer:
Analog Devices / Linear Technology
Description:
Switching Voltage Regulators 3A, 200kHz Step-dwn Converter w/ 100uA
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