DS15005 Rev. E-2 1 of 2 RS3A/B - RS3M/B
RS3A/B - RS3M/B
3.0A SURFACE MOUNT FAST RECOVERY RECTIFIER
Features
AB, BB, DB, GB, JB, KB, MB Suffix Designates SMB Package
A, B, D, G, J, K, M Suffix Designates SMC Package
SMB SMC
Dim Min Max Min Max
A
3.30 3.94 5.59 6.22
B
4.06 4.57 6.60 7.11
C
1.96 2.21 2.75 3.18
D
0.15 0.31 0.15 0.31
E
5.00 5.59 7.75 8.13
G
0.10 0.20 0.10 0.20
H
0.76 1.52 0.76 1.52
J
2.00 2.62 2.00 2.62
All Dimensions in mm
A
B
C
D
G
H
E
J
Maximum Ratings and Electrical Characteristics
@ T
A
= 25°C unless otherwise specified
·
Glass Passivated Die Construction
·
Fast Recovery Time for High Efficiency
·
Low Forward Voltage Drop and High Current
Capability
·
Surge Overload Rating to 100A Peak
·
Ideally Suited for Automatic Assembly
·
Plastic Material: UL Flammability
Classification Rating 94V-0
Mechanical Data
·
Case: Molded Plastic
·
Terminals: Solder Plated Terminal -
Solderable per MIL-STD-202, Method 208
·
Polarity: Cathode Band or Cathode Notch
·
Marking: Type Number
· SMB Weight: 0.09 grams (approx.)
· SMC Weight: 0.20 grams (approx.)
Single phase, half wave, 60Hz, resistive or inductive load.
For capacitive load, derate current by 20%.
Characteristic Symbol
RS3
A/AB
RS3
B/BB
RS3
D/DB
RS3
G/GB
RS3
J/JB
RS3
K/KB
RS3
M/MB
Unit
Peak Repetitive Reverse Voltage
Working Peak Reverse Voltage
DC Blocking Voltage
V
RRM
V
RWM
V
R
50 100 200 400 600 800 1000 V
RMS Reverse Voltage
V
R(RMS)
35 70 140 280 420 560 700 V
Average Rectified Output Current @ T
T
= 75°C
I
O
3.0 A
Non-Repetitive Peak Forward Surge Current
8.3ms Single half sine-wave Superimposed on Rated Load
(JEDEC Method)
I
FSM
100 A
Forward Voltage @ I
F
= 3.0A
V
FM
1.3 V
Peak Reverse Current @ T
A
= 25°C
at Rated DC Blocking Voltage @ TA = 125°C
I
RM
5.0
250
mA
Maximum Recovery Time (Note 3)
t
rr
150 250 500 ns
Typical Junction Capacitance (Note 2)
C
j
50 pF
Typical Thermal Resistance Junction to Terminal (Note 1)
R
qJT
25 K/W
Operating and Storage Temperature Range
T
j,
T
STG
-65 to +150 °C
Notes: 1. Thermal resistance: junction to terminal, unit mounted on PC board with 5.0 mm
2
(0.013 mm thick) copper pad as heat sink.
2. Measured at 1.0MHz and applied reverse voltage of 4.0V DC.
3. Reverse recovery test conditions: I
F
= 0.5A, I
R
= 1.0A, I
rr
= 0.25A. See figure 5.
