GS9077 Data Sheet
44619 - 0 May 2007 10 of 14
5. Application Information
5.1 PCB Layout
Special attention must be paid to component layout when designing serial digital
interfaces for SDTV.
An FR-4 dielectric can be used, however, controlled impedance transmission lines
are required for PCB traces longer than approximately 1cm. Note the following
PCB artwork features used to optimize performance:
The PCB trace width for SD rate signals is closely matched to SMT
component width to minimize reflections due to changes in trace impedance.
The PCB ground plane is removed under the GS9077 output components to
minimize parasitic capacitance.
The PCB ground plane is removed under the GS9077 R
SET
pin and resistor to
minimize parasitic capacitance.
Input and output BNC connectors are surface mounted in-line to eliminate a
transmission line stub caused by a BNC mounting via high speed traces which
are curved to minimize impedance variations due to change of PCB trace
width.
5.2 Typical Application Circuit
Figure 5-1: Typical Application Circuit
GS9077
1
2
3
4
12
11
9
DDI
DDI
VEE
RSET
SDO
SDO
VCC
10n
75
5.6n
4.7u
BNC
VCC
75
5.6n
10n 75
4.7u
49.9
750
10n
49.9
4.7u
75
BNC
VCC
4.7u
VCC
* TYPICAL VALUE: VARIES WITH LAYOUT
DIFFERENTIAL
DATA INPUT
*
*
NOTE: All resistors in Ohms, capacitors in Farads,
and inductors in Henrys, unless otherwise noted.
DISABLE
6
DISABLE
GS9077 Data Sheet
44619 - 0 May 2007 11 of 14
6. Package & Ordering Information
6.1 Package Dimensions
4.00+/-0.05
B
4.00+/-0.05
2X
2X
0.15
0.15
C
C
0.10
C
16X
0.08
C
SEATING PLANE
0.85+/-0.05
0.00-0.05
0.65/2
0.65
DETAIL B
SCALE:NTS
DATUM A OR B
TERMINAL TIP
0.20 REF
DATUM B
0.65
16X
0.35+/-0.05
0.10
0.05
C
A
B
C
DATUM A
2.76+/-0.10
0.40+/-0.05
2.76+/-0.10
DETAIL B
CENTER TAB
PIN 1 AREA
A
C
GS9077 Data Sheet
44619 - 0 May 2007 12 of 14
6.2 Recommended PCB Footprint
The Center Pad should be connected to the most negative power supply plane
(VEE) by a minimum of 5 vias.
NOTE: Suggested dimensions only. Final dimensions should conform to customer
design rules and process optimizations.
6.3 Packaging Data
0.35
0.55
2.76
3.70
2.76
3
.70
NOTE: All dimension
s
are in millimeters.
0.65
CENTER PAD
Parameter Value
Package Type 4mm x 4mm 16-pin QFN
Package Drawing Reference JEDEC M0220
Moisture Sensitivity Level 3
Junction to Case Thermal Resistance, θ
j-c
31.0°C/W
Junction to Air Thermal Resistance, θ
j-a
(at zero airflow) 43.8°C/W
Psi, Ψ 11.0°C/W
Pb-free and RoHS compliant Yes

GS9077-CNE3

Mfr. #:
Manufacturer:
Semtech
Description:
Video ICs QFN-16 pin
Lifecycle:
New from this manufacturer.
Delivery:
DHL FedEx Ups TNT EMS
Payment:
T/T Paypal Visa MoneyGram Western Union

Products related to this Datasheet