ADG419
Rev. B | Page 5 of 16
ABSOLUTE MAXIMUM RATINGS
T
A
= 25°C unless otherwise noted.
Table 3.
Parameter Rating
V
DD
to V
SS
44 V
V
DD
to GND −0.3 V to +25 V
V
SS
to GND +0.3 V to −25 V
V
L
to GND −0.3 V to V
DD
+ 0.3 V
Analog, Digital Inputs
1
V
SS
− 2 V to V
DD
+ 2 V
or 30 mA, whichever
occurs first
Continuous Current, S or D 30 mA
Peak Current, S or D (Pulsed at 1 ms,
10% Duty-Cycle Maximum)
100 mA
Operating Temperature Range
Industrial (B Version) −40°C to +125°C
Extended (T Version) −55°C to +125°C
Storage Temperature Range −65°C to +150°C
Junction Temperature 150°C
CERDIP Package, Power Dissipation 600 mW
θ
JA
, Thermal Impedance 110°C/W
Lead Temperature, Soldering (10 sec) 300°C
PDIP Package, Power Dissipation 400 mW
θ
JA
, Thermal Impedance 100°C/W
Lead Temperature, Soldering (10 sec) 260°C
SOIC Package, Power Dissipation 400 mW
θ
JA
, Thermal Impedance 155°C/W
MSOP Package, Power Dissipation 315 mW
θ
JA
, Thermal Impedance 205°C/W
Lead Temperature, Soldering
Vapor Phase (60 sec) 215°C
Infrared (15 sec) 220°C
1
Overvoltages at IN, S or D is clamped by internal diodes. Limit current to the
maximum ratings given.
Stresses above those listed under Absolute Maximum Ratings
may cause permanent damage to the device. This is a stress
rating only; functional operation of the device at these or any
other conditions above those indicated in the operational
section of this specification is not implied. Exposure to absolute
maximum rating conditions for extended periods may affect
device reliability.
ESD CAUTION