8
FN6142.4
March 15, 2007
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ISL59112
Small Outline Transistor Plastic Packages (SC70-6)
D
e1
E
C
L
e
b
C
L
A2
A
A1
C
L
0.20 (0.008)
M
0.10 (0.004) C
C
-C-
SEATING
PLANE
12 3
456
E1
C
L
C
VIEW C
VIEW C
L
R1
R
4X 1
4X 1
GAUGE PLANE
L1
SEATING
L2
C
PLANE
c
BASE METAL
WITH
c1
b1
PLATING
b
P6.049A
6 LEAD SMALL OUTLINE TRANSISTOR PLASTIC PACKAGE
SYMBOL
INCHES MILLIMETERS
NOTESMIN MAX MIN MAX
A 0.031 0.039 0.80 1.00 -
A1 0.001 0.004 0.025 0.10 -
A2 0.034 0.036 0.85 0.90 -
b 0.006 0.012 0.15 0.30 -
b1 0.006 0.010 0.15 0.25 -
c 0.004 0.008 0.10 0.20 6
c1 0.004 0.006 0.10 0.15 6
D 0.073 0.085 1.85 2.15 3
E 0.084 BSC 2.1 BSC -
E1 0.045 0.053 1.15 1.35 3
e 0.0256 Ref 0.65 Ref -
e1 0.0512 Ref 1.30 Ref -
L 0.010 0.018 0.26 0.46 4
L1 0.016 Ref. 0.400 Ref. -
L2 0.006 BSC 0.15 BSC -
N6 65
R 0.004 - 0.10 - -
0° 8° 0° 8° -
Rev. 0 7/05
NOTES:
1. Dimensioning and tolerance per ASME Y14.5M-1994.
2. Package conforms to EIAJ SC70 and JEDEC MO203AB.
3. Dimensions D and E1 are exclusive of mold flash, protrusions,
or gate burrs.
4. Footlength L measured at reference to gauge plane.
5. “N” is the number of terminal positions.
6. These Dimensions apply to the flat section of the lead between
0.08mm and 0.15mm from the lead tip.
7. Controlling dimension: MILLIMETER. Converted inch dimen-
sions are for reference only
