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EVAL-ADT7301EBZ

P1-P3P4-P6P7-P9P10-P12P13-P15P16-P17
ADT7301
Rev. B | Page 3 of 16
SPECIFICATIONS
T
A
= T
MIN
to T
MAX
, V
DD
= 2.7 V to 5.25 V, unless otherwise noted. All specifications are for −40°C to +150°C, unless otherwise noted.
Table 1. A Grade Specifications
Parameter Min Typ Max Unit Test Conditions/Comments
TEMPERATURE SENSOR AND ADC V
DD
= 3.3 V (±10%) and 5 V (±5%)
Accuracy
1
±0.5 ±1 °C T
A
= 0°C to 70°C
±2 °C T
A
= −20°C to +85°C
±3 °C T
A
= −40°C to +125°C
±4
2
°C T
A
= −40°C to +150°C
Temperature Resolution 0.03125 °C
Autoconversion Update Rate, t
R
1.5 sec Temperature measurement every 1.5 second
Temperature Conversion Time 1.2 ms
Thermal Time Constant
3
2 sec
SUPPLIES
Supply Voltage 2.7 5.25 V For specified performance
Supply Current
Normal Mode 1.6 2.2 mA V
DD
= 3.3 V, powered up and converting
190 300 µA V
DD
= 3.3 V, powered up and not converting
1.6 2.2 mA V
DD
= 5 V, powered up and converting
280 400 µA V
DD
= 5 V, powered up and not converting
Shutdown Mode 0.2 1 µA V
DD
= 3.3 V, T
A
= 0°C to 70°C
0.4 2 µA V
DD
= 5 V, T
A
= 0°C to 70°C
20 µA V
DD
= 2.7 V to 5.25 V, T
A
= −40°C to +150°C
Power Dissipation
Normal Mode (Average) 631 µW V
DD
= 3.3 V, autoconversion update, t
R
1.41 mW V
DD
= 5 V, autoconversion update, t
R
Shutdown Mode (Average)
4
1 SPS 4.88 µW V
DD
= 3.3 V
7.4 µW V
DD
= 5 V
10 SPS 42.9 µW V
DD
= 3.3 V
65 µW V
DD
= 5 V
100 SPS 423 µW V
DD
= 3.3 V
641 µW V
DD
= 5 V
DIGITAL INPUT
5
Input High Voltage, V
IH
2.5 V
Input Low Voltage, V
IL
0.8 V
Input Current, I
IN
±1 µA V
IN
= 0 V to V
DD
Input Capacitance, C
IN
10 pF All digital inputs
DIGITAL OUTPUT
5
Output High Voltage, V
OH
V
DD
− 0.3 V I
SOURCE
= I
SINK
= 200 µA
Output Low Voltage, V
OL
0.4 V I
OL
= 200 µA
Output Capacitance, C
OUT
50 pF
1
The accuracy specifications for 0°C to 70°C are specified to 3.5-Σ performance.
2
It is not recommended to operate the device at temperatures above 125°C for greater than a total of 5% (5,000 hours) of the lifetime of the device. Any exposure
beyond this limit affects device reliability.
3
The thermal time constant is the time it takes for a temperature delta to change to 63.2% of its final value. For example, if the ADT7301 experiences a thermal shock
from 0°C to 100°C, it would take typically 2 seconds for the ADT7301 to reach 63.2°C.
4
The ADT7301 is taken out of shutdown mode and a temperature conversion is immediately performed after this write operation. When the temperature conversion is
complete, the ADT7301 is put back into shutdown mode.
5
Guaranteed by design and characterization, not production tested.
ADT7301
Rev. B | Page 4 of 16
TIMING CHARACTERISTICS
Guaranteed by design and characterization, not production tested. All input signals are specified with t
R
= t
F
= 5 ns (10% to 90% of V
DD
)
and timed from a voltage level of 1.6 V. T
A
= T
MIN
to T
MAX
, V
DD
= 2.7 V to 5.25 V, unless otherwise noted.
Table 2.
Parameter
1
Limit Unit Comments
t
1
5 ns min
CS
to SCLK setup time
t
2
25 ns min SCLK high pulse width
t
3
25 ns min SCLK low pulse width
t
4
2
35 ns max Data access time after SCLK falling edge
t
5
20 ns min Data setup time prior to SCLK rising edge
t
6
5 ns min Data hold time after SCLK rising edge
t
7
5 ns min
CS
to SCLK hold time
t
8
2
40 ns max
CS
to DOUT high Impedance
1
See Figure 14 for the SPI timing diagram.
2
Measured with the load circuit of Figure 2.
1.6V
200µA
200µA I
OH
I
OL
02884-0-002
TO
OUTPUT
PIN
C
L
50pF
Figure 2. Load Circuit for Data Access Time and Bus Relinquish Time
ADT7301
Rev. B | Page 5 of 16
ABSOLUTE MAXIMUM RATINGS
Table 3.
Parameter Rating
V
DD
to GND −0.3 V to +7 V
Digital Input Voltage to GND −0.3 V to V
DD
+ 0.3 V
Digital Output Voltage to GND −0.3 V to V
DD
+ 0.3 V
Operating Temperature Range
1
−40°C to +150°C
Storage Temperature Range −65°C to +150°C
Junction Temperature 150°C
6-Lead SOT-23 (RJ-6)
Power Dissipation
2
W
MAX
= (T
J
max − T
A
3
)/θ
JA
Thermal Impedance
θ
JA
, Junction-to-Ambient
(Still Air)
190.4°C/W
8-Lead MSOP (RM-8)
Power Dissipation
2
W
MAX
= (T
J
max − T
A
3
)/θ
JA
Thermal Impedance
4
θ
JA
, Junction-to-Ambient
(Still Air)
205.9°C/W
θ
JC
, Junction-to-Case 43.74°C/W
IR Reflow Soldering
Peak Temperature 220°C (0°C/5°C)
Time at Peak Temperature 10 sec to 20 sec
Ramp-Up Rate 3°C/s max
Ramp-Down Rate −6°C/s max
Time 25°C to Peak Temperature 6 minutes max
IR Reflow Soldering—Pb-Free Package
Peak Temperature 260°C (0°C)
Time at Peak Temperature 20 sec to 40 sec
Ramp-Up Rate 3°C/s max
Ramp-Down Rate −6°C/s max
Time 25°C to Peak Temperature 8 minutes max
1
It is not recommended to operate the ADT7301 at temperatures above
125°C for greater than a total of 5% (5,000 hours) of the lifetime of the
device. Any exposure beyond this limit affects device reliability.
2
Values relate to the package being used on a standard 2-layer PCB. Refer
to Figure 3 for a plot of maximum power dissipation vs. ambient
temperature (T
A
).
3
T
A
= ambient temperature.
4
Junction-to-case resistance is applicable to components featuring a
preferential flow direction, for example, components mounted on a heat
sink. Junction-to-ambient resistance is more useful for air-cooled,
PCB-mounted components.
Stresses above those listed under Absolute Maximum Ratings
may cause permanent damage to the device. This is a stress
rating only; functional operation of the device at these or any
other conditions above those indicated in the operational
section of this specification is not implied. Exposure to absolute
maximum rating conditions for extended periods may affect
device reliability.
02884-003
TEMPERATURE (°C)
–40
150
140
130
120
110
100
90
80
70
60
50
40
30
20
10
0
–10
–20
–30
MAXIMUM POWER DISSIPATION (W)
1.2
1.0
0.8
0.6
0.4
0.2
0
SOT-23
MSOP
Figure 3. Plot of Maximum Power Dissipation vs. Temperature
ESD CAUTION
P1-P3P4-P6P7-P9P10-P12P13-P15P16-P17

EVAL-ADT7301EBZ

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Manufacturer:
Analog Devices Inc.
Description:
Temperature Sensor Development Tools EVAL BRD ADT7301
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