7/13
TDA7266D
d Dissipating Copper Area:
Dissipated Power:
The max dissipated power happens for a THD near 1% and is given by the formula:
This gives for: Vcc = 9.5V, Rl = 8
,Iq = 50mA a dissipated power of Pd = 5W.
Thermal Protection:
The thermal protection threshold is placed at a junction temperature of 150°C.
Package Thermal Characteristics:
The thermal resistance Junction to Ambient obtainable with a GND copper Area of 3x3 cm and with 16 via
holes (see picture) is about 15°C/W. This means that with the above mentioned max dissipated Power (Pd=5W)
we can expect a 75°C, this gives a safety margin before the thermal protection intervention in the consumer
environments where a 50°C ambient is specified as maximum
The Thermal constraints determine the max supply voltage that can be used for the different Load Impedances,
this in order to avoid the thermal Protection Intervention.
The max. dissipated power must be not in excess of 5W , this at turns gives the following operating supply volt-
ages:
e Filter Capacitors Positioning:
The two Ceramic capacitors C2/C7 (100nF) must be placed as close as possible
respectively to the two Vcc pins ( 6 - 15) in order to avoid the possibiltiy of oscillations arising on the
output Audio signals.
Package Informations:
You can find a complete description for the PowerSO package into the APPLICATION NOTE AN668 available
on web.
Here we want to focalize the attention only on the the Dissipating elements and ground layer.
Load (Ohm) Supply Voltage (V)
4 6.5
6 8.5
8 9.5
16 14
P
dmax W()
2
V
CC
2
π
2Rl
2
------
-------------- I
q
V
CC
+=
TDA7266D
8/13
Considering the dissipated power involved in the TDA7266D application that is in the range of 5W, as explained
in a previous section, we suggest via holes ( see fig. 4).
Using via holes a more direct thermal path is obtained from the slug to the ground layer.The number of vias is
chosen accordingly to the desired performance (in our demonstration board we use 15 vias).
In fig.4 is shown as an example the footprint to be used to create the vias.
Figure 4.
The above metioned mounting solution is enough to dissipate the power involved
In the most part of the application using the TDA7266D.
If necessary a further improvement in the Rth J-Ambient can be obtained as shown in fig.5 where the
PowerSO20 is soldered onto a via hole structure with a metal plate glued on the opposite side of the board.
Figure 5. Mounting on epoxy FR4 using via Holes for heat transfer and external metal plate
9/13
TDA7266D
Figure 6. Distortion vs Frequency
Figure 7. Gain vs Frequency
Figure 8. Mute Attenuation vs Vpin.8
Figure 9. Stand-By attenuation vs Vpin 9
Figure 10.
Quiescent Current vs Supply Voltage
Figure 11. Total Power Dissipation & Efficiency
vs Pout
0.010
0.1
1
10
100 1k 10k 20k
THD(%)
Vcc = 9.5 V
Rl = 8 ohm
Pout = 100mW
Pout = 2W
frequency (Hz)
-5.000
-4.000
-3.000
-2.000
-1.000
0.0
1.0000
2.0000
3.0000
4.0000
5.0000
10 100 1k 10k 100k
Level(dBr)
Vcc = 9.5V
Rl = 8 ohm
Pout = 1W
frequency (Hz)
11.522.533.544.55
0
10
-10
-20
-30
-40
-50
-60
-70
-80
-90
-100
Attenuation (dB)
Vpin.6(V)
0 0.2 0.4 0.6 0.8 1 1.2 1.4 1.6 1.8 2 2.2 2.4
0
10
-10
-20
-30
-40
-50
-60
-70
-80
-90
-100
-110
-120
Attenuation (dB)
Vpin.7 (V)
3456789101112
30
35
40
45
50
55
60
65
70
Iq (mA)
Vsupply(V)
0
1
2345
0
1
2
3
4
5
6
10
20
30
40
50
60
70
Pd(W)
Eff(%)
2 X Pout (W)
Vcc= 9.5V
Rl = 8 ohm
f=1KHZ
2 Channels
0
1
2345
0
1
2
3
4
5
6
10
20
30
40
50
60
70
Pd(W)
Eff(%)
2 X Pout (W)
Vcc= 9.5V
Rl = 8 ohm
f=1KHZ
2 Channels

TDA7266D

Mfr. #:
Manufacturer:
STMicroelectronics
Description:
Audio Amplifiers DUAL BRDGE AMPLIFIER
Lifecycle:
New from this manufacturer.
Delivery:
DHL FedEx Ups TNT EMS
Payment:
T/T Paypal Visa MoneyGram Western Union

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