VNQ830M-E
16/21
SO-28 Double Island Thermal Data
Figure 28. Double Island PC Board
Table 14. Thermal Calculation According To The Pcb Heatsink Area
R
thA
= Thermal resistance Junction to Ambient with one
chip ON
R
thB
= Thermal resistance Junction to Ambient with both
chips ON and P
dchip1
=P
dchip2
R
thC
= Mutual thermal resistance
Figure 29. R
thj-amb
Vs. PCB Copper Area In
Open Box Free Air Condition
Chip 1 Chip 2 T
jchip1
T
jchip2
Note
ON OFF R
thA
x P
dchip1
+ T
amb
R
thC
x P
dchip1
+ T
amb
OFF ON R
thC
x P
dchip2
+ T
amb
R
thA
x P
dchip2
+ T
amb
ON ON R
thB
x (P
dchip1
+ P
dchip2
) + T
amb
R
thB
x (P
dchip1
+ P
dchip2
) + T
amb
P
dchip1
=P
dchip2
ON ON (R
thA
x P
dchip1
) + R
thC
x P
dchip2
+ T
amb
(R
thA
x P
dchip2
) + R
thC
x P
dchip1
+ T
amb
P
dchip1
P
dchip2
Layout condition of R
th
and Z
th
measurements (PCB FR4 area= 58mm x 58mm, PCB thickness=2mm,
Cu thickness=35µm, Copper areas: 0.5cm
2
, 3cm
2
, 6cm
2
).
10
20
30
40
50
60
70
01234567
PCB Cu heatsink area (cm^2)/island
RTHj_amb
C/W)
R
thA
R
thB
R
thC
Obsolete Product(s) - Obsolete Product(s)
17/21
VNQ830M-E
Figure 30. SO-28 Thermal Impedance Junction Ambient Single Pulse
Figure 31. Thermal fitting model of a double
channel HSD in SO-28
Pulse calculation formula
Table 15. Thermal Parameter
0.01
0.1
1
10
100
1E-04 0.001 0.01 0.1 1 10 100 1000
time(s)
Zth(°C/W)
6 cm^2/island
3 cm^2/island
0,5 cm^2/island
One channel ON
Two channels ON
on same chip
Pd1
C1
R4
C3 C4
R3R1 R6R5R2
C5 C6C2
Pd2
R14
C13 C14
R13
Tj_1
Tj_2
T_amb
Pd3
C7
R10
C9
C10
R9R7
R12R11
R8
C11 C12
C8
Pd4
R16
C15 C16
R15
Tj_3
Tj_4
R17
R18
Area/island (cm
2
) 0.5 6
R1=R7=R13=R15 (°C/W) 0.05
R2=R8=R14=R16 (°C/W) 0.3
R3=R9 (°C/W) 3.4
R4=R10 (°C/W) 11
R5=R11 (°C/W) 15
R6=R12 (°C/W) 30 13
C1=C7=C13=C15 (W.s/°C) 0.001
C2=C8=C14=C16 (W.s/°C) 5.00E-03
C3=C9 (W.s/°C) 1.00E-02
C4=C10 (W.s/°C) 0.2
C5=C11 (W.s/°C) 1.5
C6=C12 (W.s/°C) 5 8
R17=R18 (°C/W) 150
Z
TH
δ
R
TH
δ Z
THtp
1 δ()+=
where
δ t
p
T=
Obsolete Product(s) - Obsolete Product(s)
VNQ830M-E
18/21
PACKAGE MECHANICAL
Table 16. SO-28 Mechanical Data
Figure 32. SO-28 Package Dimensions
Symbol
millimeters
Min Typ Max
A 2.65
a1 0.10 0.30
b 0.35 0.49
b1 0.23 0.32
C 0.50
c1 45° (typ.)
D 17.7 18.1
E 10.00 10.65
e 1.27
e3 16.51
F 7.40 7.60
L 0.40 1.27
S 8° (max.)
Obsolete Product(s) - Obsolete Product(s)

VNQ830M-E

Mfr. #:
Manufacturer:
STMicroelectronics
Description:
IC DRIVER HISIDE QUAD SO-28
Lifecycle:
New from this manufacturer.
Delivery:
DHL FedEx Ups TNT EMS
Payment:
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