AP7335
300mA, LOW QUIESCENT CURRENT, FAST TRANSIENT
LOW DROPOUT LINEAR REGULATOR
AP7335
Document number: DS32259 Rev. 3 - 2
4 of 16
www.diodes.com
December 2011
© Diodes Incorporated
NEW PRODUCT
Electrical Characteristics
(T
A
= 25
o
C, V
IN
= V
OUT
+1V, C
IN
= 1μF, C
OUT
= 1μF, V
EN
= 2V, unless otherwise stated)
Symbol Parameter Test Conditions Min Typ. Max Unit
V
REF
ADJ Reference Voltage (Adjustable version)
I
OUT
= 0mA
0.8 V
I
ADJ
ADJ Leakage (Adjustable version) 0.1 1 μA
V
OUT
Output Voltage Accuracy
T
A
= -40
o
C to 85
o
C,
I
OUT
= 10% of I
OUT-Max
-2 2 %
ΔV
OUT
/
ΔV
IN
/V
Line Regulation
V
IN
= (V
OUT
+1V) to V
IN-Max
,
V
EN
= V
IN
, I
OUT
= 1mA
0.02 0.20 %/V
ΔV
OUT
/
V
OUT
Load Regulation
V
IN
= (V
OUT
+1V) to V
IN-Max
,
I
OUT
= 1mA to 300mA
-0.6 0.6 %
V
Dropout
Dropout Voltage (Note 3)
V
OUT
< 2.5V, I
OUT
= 300mA
170 300
mV
V
OUT
≥ 2.5V, I
OUT
= 300mA
150 200
I
Q
Input Quiescent Current
V
EN
= V
IN
, I
OUT
= 0mA
35 80 μA
I
SHDN
Input Shutdown Current
V
EN
= 0V, I
OUT
= 0mA
0.1 1
μA
I
LEAK
Input Leakage Current
V
EN
= 0V, OUT grounded
0.1 1
μA
t
ST
Start-up Time
V
EN
= 0V to 2.0V in 1μs,
I
OUT
= 300mA
220 μs
PSRR PSRR (Note 4)
V
IN
= [V
OUT
+1V]V
DC
+ 0.5V
ppAC
,
f = 1kHz, I
OUT
= 50mA
65 dB
I
SHORT
Short-circuit Current
V
IN
= V
IN-Min
to V
IN-Max
,
V
OUT
< 0.2V (fixed) or
25% of V
OUT
(ADJ version)
140 mA
I
LIMIT
Current limit
V
IN
= V
IN-Min
to V
IN-Max
,
V
OUT
/R
OUT
= 1.2A
400 600 mA
V
IL
EN Input Logic Low Voltage
V
IN
= V
IN-Min
to V
IN-Max
0.4 V
V
IH
EN Input Logic High Voltage
V
IN
= V
IN-Min
to V
IN-Max
1.4 V
I
EN
EN Input Current
V
IN
= 0V or V
IN-Max
-1 1 μA
T
SHDN
Thermal shutdown threshold 145 °C
T
HYS
Thermal shutdown hysteresis 15 °C
θ
JA
Thermal Resistance Junction-to-Ambient
SOT25 (Note 5) 187
o
C/W
DFN2020-6 (Note 5) 251
Notes: 3. Dropout voltage is the voltage difference between the input and the output at which the output voltage drops 2% below its nominal value. This
parameter only applies to input voltages above minimum V
IN
= 2.0V.
4. At V
IN
< 2.3V, the PSRR performance may be reduced.
5. Test condition for all packages: Device mounted on FR-4 substrate PC board, 1oz copper, with minimum recommended pad layout.
