SpecNo.JELF243A-0053R-01 P3/8
MURATA MFG.CO., LTD
Reference
Only
No. Item Specification Test Method
7.4 Solderability The wetting area of the electrode
shall be at least 90% covered with
new solder coating.
Flux: Ethanol solution of rosin,25(wt)%
(Immersed for 5s to 10s)
Solder: Sn-3.0Ag-0.5Cu
Pre-Heating: 80 to 120°C / 10 to 30seconds.
Solder Temperature: 245±3°C
Immersion Time: 3±1 s
7.5 Resistance to
Soldering Heat
Appearance: No damage
Inductance Change: within ±5%
Flux: Ethanol solution of rosin,25(wt)%
(Immersed for 5s to 10s)
Solder: Sn-3.0Ag-0.5Cu
Pre-Heating: 150±10°C / 1 to 2 minutes
Solder Temperature: 270±5°C
Immersion Time: 10±1 s
Then measured after exposure in the room condition
for 24±2 hours.
8.Environmental Performance (It shall be soldered on the substrate.)
No. Item Specification Test Method
8.1 Heat Resistance Appearance:No damage
Inductance Change: within ± 5%
DC Resistance Change:
within ± 5%
Temperature: 85±2°C
Time: 1000± hours
Then measured after exposure in the room condition
for 24±2 hours.
8.2 Cold Resistance Temperature: -40±2°C
Time: 1000± hours
Then measured after exposure in the room condition
for 24±2 hours.
8.3 Humidity Temperature: 40±2°C
Humidity: 90~95%(RH)
Time: 1000± hours
Then measured after exposure in the room condition
for 24±2 hours.
8.4 Temperature
Cycle
1 cycle:
1 step: -40±2°C / 30±3 minutes
2 step:Ordinary temp. / 10 to 15 minutes
3 step:+85±2°C / 30±3 min
4 step: Ordinary temp. / 10 to 15 minutes
Total of 10 cycles
Then measured after exposure in the room condition
for 24±2 hours.
9. Specification of Packaging
9.1 Appearance and Dimensions of plastic tape
Dimension of the Cavity is measured at the bottom side.
48
0
48
0
48
0
2.3±0.1
1.5
1.9±0.1
4.0±0.1
2.0±0.05
4.0±0.1
+0.1
-0
1.75±0.1
3.5±0.05
8.0±0.2
1.05±0.1
0.25
Direction of feed
(in mm)
※
Lead-in/out wire
※
The packing directions of the chip coil
in taping are unified with the in/out
positions of the lead wire.
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