MAX1886
High-Current VCOM Drive Buffer
2 _______________________________________________________________________________________
ABSOLUTE MAXIMUM RATINGS
Stresses beyond those listed under “Absolute Maximum Ratings” may cause permanent damage to the device. These are stress ratings only, and functional
operation of the device at these or any other conditions beyond those indicated in the operational sections of the specifications is not implied. Exposure to
absolute maximum rating conditions for extended periods may affect device reliability.
Note 1: The MAX1886 is 100% production tested at T
A
= +25°C. Specifications over temperature are guaranteed by design.
V
CC
to GND............................................................-0.3V to +14V
FB-, FB+, OUT to GND...............................-0.3V to (V
CC
+ 0.3V)
Continuous Power Dissipation (T
A
= +70°C)
5-Pin Thin SOT23 (derate 7.1mW°C above +70°C).....727mW
Operating Temperature Range ...........................-40°C to +85°C
Junction Temperature......................................................+150°C
Storage Temperature Range .............................-65°C to +150°C
ELECTRICAL CHARACTERISTICS
(V
CC
= 10V, FB- = OUT, V
FB+
= 5V, C
OUT
= 0.47µF, T
A
= -40°C to +85°C, unless otherwise noted. Typical values are at T
A
= +25°C.)
(Note 1)
PARAMETER SYMBOL CONDITIONS MIN TYP MAX UNITS
V
CC
Input Supply Range V
CC
4.5 13 V
V
CC
Supply Current I
CC
450 900 µA
Input Offset Voltage V
OS
V
FB+
= +5V, no load -5 5 mV
Input Bias Current I
BIAS
-100 100 nA
Input Offset Current I
OS
+1.2V < V
CM
< +8.8V
-100 100 nA
Common-Mode Input Range V
CM |
V
OS|
< 10mV over CMR 1.2
V
CC
-
1.2V
V
Power-Supply Rejection Ratio PSRR +4.5V < V
CC
< +13V, V
FB+
= +2.25V 70
Common-Mode Rejection Ratio CMRR +1.2V < V
CM
< +8.8V 70
dB
Gain-Bandwidth Product GBW Small signal 1/6πC
L
Hz
Small signal (±1mV overdrive) 0.3
Transconductance g
m
Large signal (±30mV overdrive) 10
S
T
A
= -40°C to +85°C ±175 ±550
Output Current Drive I
OUT
±100mV overdrive,
V
OUT
= 3V or 7V
T
A
= 0°C to +85°C ±250
mA
Thermal Shutdown 170 °C
Thermal Shutdown Hysteresis 15 °C
SUPPLY
VOLTAGE
REFERENCE
VOLTAGE
0.47
0.47
R
L
C
L
V
X
1
5
2
3
4
MAX1886
Figure 1. Load Transient Test Circuit
This device is constructed using a unique set of packaging techniques that impose a limit on the thermal profile the device can be exposed to during
board level solder attach and rework. Maxim recommends the use of the solder profiles recommended in the industry-standard specification, JEDEC
020A, paragraph 7.6, Table 3 for IR/VPR and convection reflow processes. Preheating, per this standard, is required. Hand or wave soldering is not
recommended.
