2N6027, 2N6028
http://onsemi.com
2
MAXIMUM RATINGS (T
J
= 25°C unless otherwise noted)
Rating
Symbol Value Unit
Power Dissipation*
Derate Above 25°C
P
F
1/q
JA
300
4.0
mW
mW/°C
DC Forward Anode Current*
Derate Above 25°C
I
T
150
2.67
mA
mA/°C
DC Gate Current* I
G
"50 mA
Repetitive Peak Forward Current
100
ms Pulse Width, 1% Duty Cycle
20
ms Pulse Width, 1% Duty Cycle*
I
TRM
1.0
2.0
A
Non−Repetitive Peak Forward Current
10
ms Pulse Width
I
TSM
5.0 A
Gate to Cathode Forward Voltage* V
GKF
40 V
Gate to Cathode Reverse Voltage* V
GKR
*5.0 V
Gate to Anode Reverse Voltage* V
GAR
40 V
Anode to Cathode Voltage* (Note 1) V
AK
±40 V
Capacitive Discharge Energy (Note 2) E 250
mJ
Power Dissipation (Note 3) P
D
300 mW
Operating Temperature T
OPR
−50 to +100 °C
Junction Temperature T
J
−50 to +125 °C
Storage Temperature Range T
stg
−55 to +150 °C
Stresses exceeding Maximum Ratings may damage the device. Maximum Ratings are stress ratings only. Functional operation above the
Recommended Operating Conditions is not implied. Extended exposure to stresses above the Recommended Operating Conditions may affect
device reliability.
*Indicates JEDEC Registered Data
1. Anode positive, R
GA
= 1000 W
Anode negative, R
GA
= open
2. E = 0.5 CV
2
capacitor discharge energy limiting resistor and repetition.
3. Derate current and power above 25°C.
THERMAL CHARACTERISTICS
Characteristic Symbol Max Unit
Thermal Resistance, Junction−to−Case
R
q
JC
75 °C/W
Thermal Resistance, Junction−to−Ambient
R
q
JA
200 °C/W
Maximum Lead Temperature for Soldering Purposes
(t1/16″ from case, 10 seconds maximum)
T
L
260 °C