GW5BTC30K00 Datasheet GW5BTC30K00 | P13-P15

DG-099005B

7. Precautions

① Storage conditions

Please follow the conditions below.

・Before opened: Temperature 5 ～ 30 ℃, Relative humidity less than 60 %.

(Before opened LED should be used within a year)

・After opened: Temperature 5 ～ 30 ℃, Relative humidity less than 60 %.

(Please apply soldering within 1 week)

・After opened LED should be kept in an aluminum moisture proof bag with a moisture

absorbent material (silica gel).

・Avoid exposing to air with corrosive gas.

If exposed, electrode surface would be damaged, which may affect soldering.

② Usage conditions

This product is not designed for the use under any of the following conditions.

Please confirm performance and reliability well enough if you use under any of the following conditions;

・In a place with a lot of moisture, dew condensation, briny air, and corrosive gas.

(Cl, H

S, NH

, SO

, NO

etc.)

・Under the direct sunlight, outdoor exposure, and in a dusty place.

・In water, oil, medical fluid, and organic solvent.

③ Heat radiation

If forward current (I

) is applied to single-state module at any current, there is a risk of damaging LED

or emitting smoke.

Equip with specified heat radiator, and avoid heat stuffed inside the module.

④ Installation

Material of board is alumina ceramic. If installed inappropriately, trouble of no radiation may occur due to

board crack or overheat. Please take particular notice for installation.

Refer to the following cautions on installation.

・ Apply thermolysis adhesive, adhesive sheet or peculiar connector when mounted on heat radiator.

In case of applying adhesive or adhesive sheet only, check the effectiveness and reliability before fixing.

If LED comes off from heat radiator, unusual temperature rise entails hazardous phenomena including

device deterioration, coming off of solder at leads, and emitting smoke.

・ When LED device is mechanically fixed or locked, Please take into consideration regarding the method of

attachment due to fail from stress.

・ Avoid convexly uneven boards.

Convex board is subject to substrate cracking or debasement of heat release.

・ It is recommended to apply adhesive or adhesive sheet with high thermal conductivity

for radiation of heat effectively.

・ Please take care about the influence of color change of adhesive or adhesive sheet in initial and long term

period, which may affect light output or color due to change of reflectance from backside.

Model No. Page

GW5BTC30K00 10 of 12

DG-099005B

・ Do not touch resin part including white resin part on the surface of LED.

No light emission may occur due to damage of resin or cutting wire of LEDs by outer force.

When using tweezers, please handle by ceramic substrate part and avoid touching resin part.

For mounting, please handle by side part of ceramic or the specified area shown below.

⑤ Connecting method

In case of solder connecting method, follow the conditions mentioned below.

・Use Soldering iron with thermo controller (tip temperature 380 ℃), within 5 seconds per one place.

・Secure the solderwettability on whole solder pad and leads.

・During the soldering process, put the ceramic board on materials whose conductivity is poor enough

not to radiate heat of soldering.

・Warm up (with using a heated plate) the substrate is recommended before soldering.

( preheat condition: 100 ℃ ～ 150 ℃, within 60 sec )

・Avoid touching a part of resin with soldering iron.

・This product is not designed for reflow and flow soldering.

・Avoid such lead arrangement as applying stress to solder-applied area.

・Please do not detach solder and make re-solder.

・Please solder evenly on each electrodes.

・Please prevent flux from touching to resin.

⑥ Static electricity

This product is subject to static electricity, so take measures to cope with it.

Install circuit protection device to drive circuit, if necessary.

⑦ Drive method

・Any reverse voltage cannot be applied to LEDs when they are in operation or not.

Design a circuit so that any flow of reverse or forward voltage can not be applied to LEDs

when they are out of operation.

・Module is composed of LEDs connected in both series and parallel.

Constant voltage power supply runs off more than specified current amount due to lowered V

caused by temperature rise.

Constant current power supply is recommended to drive.

⑧ Cleaning

Avoid cleaning, since silicone resin is eroded by cleaning.

⑨ Color-tone variation

Chromaticity of this product is monitored by integrating sphere right after the operation.

Chromaticity varies depending on measuring method, light spread condition, or ambient temperature.

Please verify your actual conditions before use.

Model No. Page

GW5BTC30K00 11 of 12

Handling area

DG-099005B

⑩ Safety

･Looking directly at LEDs for a long time may result in hurt your eyes.

･In case that excess current (over ratings) are supplied to the device, hazardous phenomena including

abnormal heat generation, emitting smoke, or catching fire can be caused.

Take appropriate measures to excess current and voltage.

・In case of solder connecting method, there is a possibility of fatigue failure by heat.

Please fix the leads in such case to protect from short circuit or leakage of electricity caused by contact.

・Please confirm the safety standards or regulations of application devices.

・Please careful not to injure your hand by edge of ceramic substrate.

⑪ Other cautions

Guarantee covers the compliance to the quality standards mentioned in the Specifications,

however it does not cover the compatibility with application of the end-use, including assembly

and usage environment.

In case any quality problems occurred in the application of end-use, details will be separately discussed

and determined between the parties hereto.

Model No. Page

GW5BTC30K00 12 of 12

P1-P3 P4-P6 P7-P9 P10-P12 P13-P15 P16-P16

GW5BTC30K00

Mfr. #:

Buy GW5BTC30K00

Manufacturer:

Sharp Microelectronics

Description:

LED MOD 3.6W MINI ZENIGATA 3000K

Lifecycle:

New from this manufacturer.

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