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LAA710S

P1-P3P4-P6P7-P7
I
NTEGRATED
C
IRCUITS
D
IVISION
www.ixysic.com
4
R03
LAA710
*The Performance data shown in the graphs above is typical of device performance. For guaranteed parameters not indicated in the written specifications, please contact our application
department.
PERFORMANCE DATA @25ºC (Unless Otherwise Noted)*
Typical Turn-On Time
vs. Temperature
(I
L
=1A
DC
)
Temperature (ºC)
I
F
=20mA
Turn-On Time (ms)
-40
1.4
1.2
1.0
0.8
0.6
0.4
0.2
0
-20 0 20 40 60 80 100
I
F
=10mA
Typical Turn-Off Time
vs. Temperature
(I
F
=10mA, I
L
=1A
DC
)
Temperature (ºC)
Turn-Off Time (ms)
-40
0.14
0.12
0.10
0.08
0.06
0.04
0.02
0
-20 0 20 40 60 80 100
Typical On-Resistance vs. Temperature
(I
F
=10mA, I
L
=1A
DC
)
Temperature (ºC)
On-Resistance (:)
-40
0.45
0.40
0.35
0.30
0.25
0.20
0.15
0.10
0.05
0
-20 0 20 40 60 80 100
Typical I
F
for Switch Operation
vs. Temperature
(I
L
=1A
DC
)
Temperature (ºC)
LED Current (mA)
-40
5.0
4.5
4.0
3.5
3.0
2.5
2.0
1.5
1.0
0.5
0
-20 0 20 40 60 80 100
Typical I
F
for Switch Dropout
vs. Temperature
(I
L
=1A
DC
)
Temperature (ºC)
LED Current (mA)
-40
5.0
4.5
4.0
3.5
3.0
2.5
2.0
1.5
1.0
0.5
0
-20 0 20 40 60 80 100
Typical Load Current vs. Load Voltage
(I
F
=10mA)
Load Voltage (V)
Load Current (mA)
1000
800
600
400
200
0
-200
-400
-600
-800
-1000
-0.3 -0.2 -0.1 0.1 0.2
0
0.3
Typical Blocking Voltage
vs. Temperature
Temperature (ºC)
Blocking Voltage (V
P
)
-40
81
80
79
78
77
76
75
74
73
-20 0 20 40 60 80 100
Typical Leakage vs. Temperature
Measured across Pins 5 & 6, 7 & 8
Temperature (ºC)
Leakage (PA)
-40
0.007
0.006
0.005
0.004
0.003
0.002
0.001
0
-20 0 20 40 60 80 100
Energy Rating Curve
Time
Load Current (A)
8
7
6
5
4
3
2
1
0
10Ps 1ms 100ms 10s100Ps 10ms 1s 100s
Maximum Load Current
vs. Temperature
Temperature (ºC)
Load Current (mA)
1800
1600
1400
1200
1000
800
600
400
-40 -20 0 20 40 60 80 120100
I
F
=
20mA
I
F
=
10mA
I
F
=
5mA
I
NTEGRATED
C
IRCUITS
D
IVISION
LAA710
www.ixysic.com
5
R03
Manufacturing Information
Moisture Sensitivity
All plastic encapsulated semiconductor packages are susceptible to moisture ingression. IXYS Integrated
Circuits Division classified all of its plastic encapsulated devices for moisture sensitivity according to
the latest version of the joint industry standard, IPC/JEDEC J-STD-020, in force at the time of product
evaluation. We test all of our products to the maximum conditions set forth in the standard, and guarantee proper
operation of our devices when handled according to the limitations and information in that standard as well as to any
limitations set forth in the information or standards referenced below.
Failure to adhere to the warnings or limitations as established by the listed specifications could result in reduced
product performance, reduction of operable life, and/or reduction of overall reliability.
This product carries a Moisture Sensitivity Level (MSL) rating as shown below, and should be handled according
to the requirements of the latest version of the joint industry standard IPC/JEDEC J-STD-033.
Device Moisture Sensitivity Level (MSL) Rating
LAA710 / LAA710S MSL 1
ESD Sensitivity
This product is ESD Sensitive, and should be handled according to the industry standard JESD-625.
Reflow Profile
This product has a maximum body temperature and time rating as shown below. All other guidelines of J-STD-020
must be observed.
Device Maximum Temperature x Time
LAA710 / LAA710S 250ºC for 30 seconds
Board Wash
IXYS Integrated Circuits Division recommends the use of no-clean flux formulations. However, board washing to
remove flux residue is acceptable. Since IXYS Integrated Circuits Division employs the use of silicone coating as
an optical waveguide in many of its optically isolated products, the use of a short drying bake could be necessary
if a wash is used after solder reflow processes. Chlorine- or Fluorine-based solvents or fluxes should not be used.
Cleaning methods that employ ultrasonic energy should not be used.
e
3
Pb
I
NTEGRATED
C
IRCUITS
D
IVISION
www.ixysic.com
6
R03
LAA710
MECHANICAL DIMENSIONS
LAA710S
LAA710STR Tape & Reel
Dimensions
mm
(inches)
PCB Land Pattern
2.540 ± 0.127
(0.100 ± 0.005)
9.652 ± 0.381
(0.380 ± 0.015)
6.350 ± 0.127
(0.250 ± 0.005)
9.525 ± 0.254
(0.375 ± 0.010)
0.457 ± 0.076
(0.018 ± 0.003)
0.813 ± 0.102
(0.032 ± 0.004)
4.445 ± 0.127
(0.175 ± 0.005)
7.620 ± 0.254
(0.300 ± 0.010)
0.635 ± 0.127
(0.025 ± 0.005)
0.254 ± 0.0127
(0.010 ± 0.0005)
2.54
(0.10)
8.90
(0.3503)
1.65
(0.0649)
0.65
(0.0255)
3.302 ± 0.051
(0.130 ± 0.002)
Pin 1
Dimensions
mm
(inches)
User Direction of Feed
NOTES:
1. Dimensions carry tolerances of EIA Standard 481-2
2. Tape complies with all “Notes” for constant dimensions listed on page 5 of EIA-481-2
Embossment
Embossed Carrier
Top Cover
Tape Thickness
0.102 MAX.
(0.004 MAX.)
330.2 DIA.
(13.00 DIA.)
K
1
=4.20
(0.165)
0
K =4.90
(0.193)
P=12.00
(0.472)
W=16.00
(0.63)
Bo=10.30
(0.406)
Ao=10.30
(0.406)
P1-P3P4-P6P7-P7

LAA710S

Mfr. #:
Buy LAA710S
Manufacturer:
IXYS Integrated Circuits
Description:
Solid State Relays - PCB Mount 60V 1000mA Dual Single-Pole
Lifecycle:
New from this manufacturer.
Delivery:
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