NLVSV1T244MUTBG

NLSV1T244
www.onsemi.com
4
TOTAL STATIC POWER CONSUMPTION (I
CCA
+ I
CCB
)
−405C to +855C
V
CCB
(V)
4.5 3.3 2.8 1.8 0.9
V
CCA
(V) Min Max Min Max Min Max Min Max Min Max Unit
4.5 2 2 2 2 < 1.5 μA
3.3 2 2 2 2 < 1.5 μA
2.8 < 2 < 1 < 1 < 0.5 < 0.5 μA
1.8 < 1 < 1 < 0.5 < 0.5 < 0.5 μA
0.9 < 0.5 < 0.5 < 0.5 < 0.5 < 0.5 μA
NOTE: Connect ground before applying supply voltage V
CCA
or V
CCB
. This device is designed with the feature that the power−up
sequence of V
CCA
and V
CCB
will not damage the IC.
AC ELECTRICAL CHARACTERISTICS
Symbol Parameter V
CCA
(V)
−405C to +855C
Unit
V
CCB
(V)
4.5 3.3 2.8 1.8 1.2
Min Max Min Max Min Max Min Max Min Max
t
PLH
,
t
PHL
(Note
1)
Propagation
Delay,
A to B
4.5 1.6 1.8 2.0 2.1 2.3
nS
3.3 1.7 1.9 2.1 2.3 2.6
2.8 1.9 2.1 2.3 2.5 2.8
1.8 2.1 2.4 2.5 2.7 3.0
1.2 2.4 2.7 2.8 3.0 3.3
t
PZH
,
t
PZL
(Note
1)
Output
Enable,
O to B
4.5 2.6 3.8 4.0 4.1 4.3
nS
3.3 3.7 3.9 4.1 4.3 4.6
2.5 3.9 4.1 4.3 4.5 4.8
1.8 4.1 4.4 4.5 4.7 5.0
1.2 4.4 4.7 4.8 5.0 5.3
t
PHZ
,
t
PLZ
(Note
1)
Output
Disable,
OE to B
4.5 2.6 3.8 4.0 4.1 4.3
nS
3.3 3.7 3.9 4.1 4.3 4.6
2.5 3.9 4.1 4.3 4.5 4.8
1.8 4.1 4.4 4.5 4.7 5.0
1.2 4.4 4.7 4.8 5.0 5.3
t
OSHL
,
t
OSLH
(Note
1)
Output to
Output
Skew,
Tim
4.5 0.15 0.15 0.15 0.15 0.15
nS
3.3 0.15 0.15 0.15 0.15 0.15
2.5 0.15 0.15 0.15 0.15 0.15
1.8 0.15 0.15 0.15 0.15 0.15
1.2 0.15 0.15 0.15 0.15 0.15
1. Propagation delays defined per Figure 2.
CAPACITANCE
Symbol Parameter Test Conditions Typ (Note 2) Unit
C
IN
Control Pin Input Capacitance V
CCA
= V
CCB
= 3.3 V, V
I
= 0 V or V
CCA/B
3.5 pF
C
I/O
I/O Pin Input Capacitance V
CCA
= V
CCB
= 3.3 V, V
I
= 0 V or V
CCA/B
5.0 pF
C
PD
Power Dissipation Capacitance V
CCA
= V
CCB
= 3.3 V, V
I
= 0 V or V
CCA
, f = 10 MHz 5.0 pF
2. Typical values are at T
A
= +25°C.
3. C
PD
is defined as the value of the IC’s equivalent capacitance from which the operating current can be calculated from:
I
CC(operating)
^ C
PD
x V
CC
x f
IN
where I
CC
= I
CCA
+ I
CCB
.
NLSV1T244
www.onsemi.com
5
Figure 2. AC (Propagation Delay) Test Circuit
DUT
Pulse
Generator
V
CC
C
L
R
L
R
L
V
CCO
x 2
OPEN
GND
Test
Switch
t
PLH
, t
PHL
OPEN
t
PLZ
, t
PZL
V
CCO
x 2
t
PHZ
, t
PZH
GND
C
L
= 15 pF or equivalent (includes probe and jig capacitance)
R
L
= 2 kW or equivalent
Z
OUT
of pulse generator = 50 W
Figure 3. AC (Propagation Delay) Test Circuit Waveforms
Input (A)
Output (B)
OE
n
Vm Vm
Vm
Vm
Vm Vm
Vm
Vm
t
PLH
t
PHL
V
IH
0 V
V
OH
V
OL
V
IH
0 V
V
OH
V
Y
V
OL
V
X
t
PZH
t
PZL
t
PHZ
t
PLZ
0 V
V
CC
Waveform 1 − Propagation Delays
t
R
= t
F
= 2.0 ns, 10% to 90%; f = 1 MHz; t
W
= 500 ns
Waveform 2 − Output Enable and Disable Times
t
R
= t
F
= 2.0 ns, 10% to 90%; f = 1 MHz; t
W
= 500 ns
Output (B)
Output (B)
Symbol
V
CC
3.0 V – 4.5 V 2.3 V − 2.7 V 1.65 V − 1.95 V 1.4 V − 1.6 V 0.9 V − 1.3 V
V
mA
V
CCA
/2 V
CCA
/2 V
CCA
/2 V
CCA
/2 V
CCA
/2
V
mB
V
CCB
/2 V
CCB
/2 V
CCB
/2 V
CCB
/2 V
CCB
/2
V
X
V
OL
x 0.1 V
OL
x 0.1 V
OL
x 0.1 V
OL
x 0.1 V
OL
x 0.1
V
Y
V
OH
x 0.9 V
OH
x 0.9 V
OH
x 0.9 V
OH
x 0.9 V
OH
x 0.9
NLSV1T244
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6
PACKAGE DIMENSIONS
UDFN6 1.2 x 1.0, 0.4P
CASE 517AA
ISSUE D
NOTES:
1. DIMENSIONING AND TOLERANCING PER
ASME Y14.5M, 1994.
2. CONTROLLING DIMENSION: MILLIMETERS.
3. DIMENSION b APPLIES TO PLATED TERMINAL
AND IS MEASURED BETWEEN 0.25 AND
0.30 mm FROM TERMINAL.
4. COPLANARITY APPLIES TO THE EXPOSED
PAD AS WELL AS THE TERMINALS.
A
B
E
D
BOTTOM VIEW
b
e
6X
0.10 B
0.05
AC
C
L5X
NOTE 3
2X
0.10 C
PIN ONE
REFERENCE
TOP VIEW
2X
0.10 C
10X
A
A1
(A3)
0.08 C
0.10 C
C
SEATING
PLANE
SIDE VIEW
L2
1
3
46
DIM MIN MAX
MILLIMETERS
A 0.45 0.55
A1 0.00 0.05
A3 0.127 REF
b 0.15 0.25
D 1.20 BSC
E 1.00 BSC
e 0.40 BSC
L 0.30 0.40
L1 0.00 0.15
MOUNTING FOOTPRINT*
DIMENSIONS: MILLIMETERS
0.22
6X
0.42
6X
1.07
0.40
PITCH
*For additional information on our Pb−Free strategy and soldering
details, please download the ON Semiconductor Soldering and
Mounting Techniques Reference Manual, SOLDERRM/D.
L1
DETAIL A
Bottom View
(Optional)
A1
A3
DETAIL B
Side View
(Optional)
EDGE OF PACKAGE
MOLD CMPD
EXPOSED Cu
L2 0.40 0.50
NLSV1T244/D
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NLVSV1T244MUTBG

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Translation - Voltage Levels 1-BIT UNIDIDRECTIONA
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