Document Number: 20008 For technical questions, contact: thickfilmchip@vishay.com
www.vishay.com
Revision: 18-Nov-10 123
D/CRCW
Lead (Pb)-Bearing Thick Film, Rectangular Chip Resistors
Vishay
TEST PROCEDURES AND REQUIREMENTS
EN
60115-1
CLAUSE
IEC
60082-2
TEST
METHOD
TEST
PROCEDURE
REQUIREMENTS PERMISSIBLE
CHANGE (ΔR)
STABILITY CLASS 1
OR BETTER
STABILITY CLASS 2
OR BETTER
Stability for product types:
1 Ω to 10 MΩ 1 Ω to 10 MΩ
D/CRCW
4.5 - Resistance - ± 1 % ± 5 %
4.7 - Voltage proof U = 1.4 · U
ins;
60 s No flashover or breakdown
4.13 - Short time overload
U = 2.5 x ≤ 2 x U
max.
;
duration: Acc. to style
± (0.25 % R + 0.05 Ω) ± (0.5 % R + 0.05 Ω)
4.17.2 58 (Td) Solderability
Solder bath method; Sn60Pb40;
non-activated flux;
(235 ± 5) °C, (2 ± 0.2) s
Good tinning (≥ 95 %
covered);
no visible damage
4.8.4.2 - Temperature coefficient
(20/- 55/20) °C and
(20/125/20) °C
± 100 ppm/K ± 200 ppm/K
4.32 21 (Uu
3)
Shear (adhesion)
RR 1608 and smaller: 9 N
RR 2012 and larger: 45 N
No visible damage
4.33 21 (Uu
1)
Substrate bending Depth 2 mm; 3 times
No visible damage,
no open circuit in bent position
± (0.25 % R + 0.05 Ω)
4.19 14 (Na) Rapid change of temperature
30 min. at - 55 °C;
30 min. at 125°C
5 cycles
1000 cycles
± (0.25 % R + 0.05 Ω)
± (1 % R + 0.05 Ω)
± (0.5 % R + 0.05 Ω)
± (1 % R + 0.05 Ω)
4.23 - Climatic sequence: -
± (1 % R + 0.05 Ω)± (2 % R + 0.1 Ω)
4.23.2 2 (Ba) Dry heat 125 °C; 16 h
4.23.3 30 (Db) Damp heat, cyclic
55 °C; ≥ 90 % RH;
24 h; 1 cycle
4.23.4 1 (Aa) Cold - 55 °C; 2 h
4.23.5 13 (M) Low air pressure 1 kPa; (25 ± 10) °C; 1 h
4.23.6 30 (Db) Damp heat, cyclic
55 °C; ≥ 90 % RH;
24 h; 5 cycles
4.23.7 - DC load U =
4.25.1 - Endurance at 70 °C
U = √(P
70
x R) ≤ U
max.
1.5 h on; 0.5 h off;
70 °C; 1000 h
70 °C; 8000 h
± (1 % R + 0.05 Ω)
± (2 % R + 0.1 Ω)
± (2 % R + 0.1 Ω)
± (4 % R + 0.1 Ω)
4.18.2 58 (Td) Resistance to soldering heat
Solder bath method
(260 ± 5) °C; (10 ± 1) s
± (0.25 % R + 0.05 Ω) ± (0.5 % R + 0.05 Ω)
4.35 - Flamability, needle flame test
IEC 60695-11-5;
10 s
No burning after 30 s
4.24 78 (Cab) Damp heat, steady state
(40 ± 2) °C;
(93 ± 3) % RH; 56 days
± (1 % R + 0.05 Ω)
4.25.3 -
Endurance at upper
category temperature
155 °C; 1000 h ± (1 % R + 0.05 Ω)± (2 % R + 0.1 Ω)
4.40 -
Electrostatic discharge
(human body model)
IEC 61340-3-1;
3 pos. + 3 neg. discharges;
ESD test voltage acc. to size
± (1 % R + 0.05 Ω)
4.29 45 (XA) Component solvent resistance
Isopropyl alcohol;
50 °C; method 2
No visible damage
4.30 45 (XA) Solvent resistance of marking
Isopropyl alcohol;
50 °C; method 1, toothbrush
Marking legible,
no visible damage
