Absolute Maximum Ratings
5
Absolute Maximum Ratings
Note: Stresses above those listed in “ABSOLUTE MAXIMUM RATINGS”, may cause permanent
damage to the device. This is a stress only rating and operation of the device at these or any
other conditions above those indicated in the operational sections of this specification is not
implied.
Parameter
Min Max Units
5VREG,VCC to GND & BST to SW voltage -0.3 6.5
V
VIN to GND Voltage - 25
V
S1 to GND -2 30 V
D1 to S1, D2 to S2 - 30 V
All other pins -0.3 VCC+0.3, or 6.5
V
Storage Temperature Range -65 150
°C
Operating Junction Temperature Range -40 125 °C
Peak Reflow Temperature (40 seconds) 260 (+0, -5) °C
ESD Susceptibility 2
kV
Power Dissipation Internally Limited by OTP
Thermal Properties
Thermal Resistance Typ Units
θ
JA
30 °C/W
θ
JC
2.5 °C/W
Note: The θ
JA
numbers assume no forced airflow. Junction Temperature is calculated using T
J
= T
A
+ (PD x θ
JA
). In
particular, θ
JA
is a function of the PCB construction. The stated number above is for a four-layer board in
accordance with JESD-51 (JEDEC).
Electrical Characteristics
Unless otherwise specified, these specifications apply over VIN = 12V, and T
A
= 0 to 70°C.
Following are the bypass capacitors: C
VIN
= 1µF, C
5VREG
= 4.7µF, and all X5R ceramic capacitors.
Typical values refer to T
A
= 25°C. Low duty cycle pulse testing is used which keeps junction and
case temperatures equal to the ambient temperature.
Symbol Parameter Test Condition Min Typ Max Units
Reference Voltage
VREF Ref Voltage 0.8 V
Ref Voltage line regulation VIN= 9V to 22V 0.4 %
5VREG Voltage range 4.75 5 5.25 V
5VREG Line Regulation VIN= 9V to 22V 10 mV
5VREG Max Current 50 mA
