(2.54 mm) .100"
SSM SERIES
SSM–115–L–SH
SSM–120–S–DV
SSM–116–S–SV
WWW.SAMTEC.COM
Due to technical progress, all designs, specifications and components are subject to change without notice.
–M
= Metal Pick &
Place Pad
(5 positions min.)
–DV only
–P
= Plastic Pick
& Place Pad
(–DV & –SV only)
(6 pos. minimum,
contact Samtec
for availability on
smaller positions)
Mates with:
TSW, MTSW, TST,
TSS, ZST, ZSS, DW,
EW, ZW, TSM, HMTSW,
HTSW, TSSH, BST,
HTSS, TLW, MTLW
1
NO. PINS
PER ROW
PLATING
OPTION
ROW
OPTION
SSM
OTHER
OPTION
02 thru 36
(–SV, – SH, –DH)
02 thru 40
(–DV)
–F
= Gold flash
on contact,
Matte Tin on tail
–L
= 10 µ" (0.25 µm)
Gold on contact,
Matte Tin on tail
–S
= 30 µ" (0.76 µm)
Gold on contact,
Matte Tin on tail
F-217
(5.94) .234
x
(5.72) .225
–BE
= Bottom Entry
(–DV & –SV only)
–LC
= Locking Clip
(–DV & –SV only)
Contact Samtec for
–DH & –SH
–K
= (6.50 mm) .256" DIA
Polyimide film
Pick & Place Pad
(2 positions min.)
–DV & –SV only
–“XXX”
= Polarized Position
(–BE not available)
–TR
= Tape & Reel Packaging
(29 positions max.)
For complete specifications
and recommended PCB layouts
see www.samtec.com?SSM
Insulator Material:
Black Liquid Crystal Polymer
Contact Material:
Phosphor Bronze
Plating:
Au or Sn over
50 µ" (1.27 µm) Ni
Current Rating (SSM/TSW):
5.2 A per pin
(1 pin powered per row)
Voltage Rating:
405 VAC / 572 VDC
Operating Temp Range:
-55 °C to +125 °C with Gold
-55 °C to +105 °C with Tin
Contact Resistance:
10 mΩ
Insertion Depth:
SV/DV is (4.34 mm) .171" to
(7.24 mm) .285" or pass-through
from top; (5.56 mm) .219" plus
board thickness minimum from
bottom; SH/DH is (4.34 mm)
.171" to (6.35 mm) .250"
Normal Force:
125 grams (1.21 N) average
RoHS Compliant:
Ye s
(4.95)
.195
x
(10.03)
.395
(1.27)
.050
SPECIFICATIONS
Note: Some lengths, styles
and options are non-standard,
non-returnable.
TIGER CLAW
™
SURFACE MOUNT SOCKET
ALSO AVAILABLE
(MOQ Required)
• Alignment pin
Contact Samtec.
For complete scope
of recognitions see
www.samtec.com/quality
RECOGNITIONS
– DV
= Double Row Vertical Pin
–SH
= Single Row Horizontal Pin
–SV
= Single Row Vertical Pin
–DH
= Double Row Horizontal Pin
(8.13)
.320
(5.72)
.225
72 02
71
01
(2.54)
.100
.070
(11.18)
.440
(2.54) .100 x No. of Positions
.125
(0.89) .035 SQ TYP
(8.13)
.320
01 36
(0.25)
.010
(1.78)
.070
(11.00)
.433
(2.54) .100 x No. of Positions
(2.54) .100 x No. of Positions
(7.37)
.290
(2.54) .100
(0.51) .020
(5.08)
.200
01
71
02
72
(7.04)
.277
(1.27) .050
(2.54)
.100
(2.54)
.100
.290
(2.54) .100 x No. of Positions
(2.54) .100
(0.51) .020
01
36
(4.42)
.174
SSM
TSM
TSSH
FILE NO: 090871_0_000
PROCESSING
Lead–Free Solderable:
Ye s
–DH Coplanarity:
Less than 28 positions
(0.15 mm) .006" max
More than 27 positions
(0.20 mm) .008" max
–SH, –SV, –DV Coplanarity:
(0.15 mm) .006" max
EXTENDED LIFE
PRODUCT
10 YEAR MFG
WITH 30 µ" GOLD
HIGH MATING
CYCLES
