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power.pulseelectronics.com
P819.C (04/18)
http://www.power.pulseelectronics.com/contact
SMT Power Inductor
High Current Molded Power Inductor - PA4340.XXXANLT Series
1. Actual temperature of the component during system operation (ambient plus tempera-
ture rise) must be within the standard operating range.
2. The saturation current is the current at which the initial inductance drops approxi-
mately 30% at the stated ambient temperature. This current is determined by placing
the component in the specified ambient environment and applying a short duration
pulse current (to eliminate self-heating eect) to the component.
3. The rated current is the DC current required to raise the component temperature by
approximately 40�C. Take note that the components’ performanc varies depending on the
system condition. It is suggested that the component be tested at the system level, to
verify the temperature rise of the component during system operation.
4. The part temperature (ambient+temp rise) should not exceed 155�C under worst case
operating conditions. Circuit design, PCB trace size and thickness, airflow and other cool-
ing provisions all aect the part temperature. Part temperature should be verified in the
end application.
Notes:
PA4340.XXXANLT
Mechanical
D
T
A`
E
XXXANL
D/C
L
G
H
Final Layout
SUGGESTED PAD LAYOUT
Series A A` B C D E T L G H
PA4340.XXXANLT 5.7±0.3 5.2±0.3 5.2±0.2 2.8±0.2 1.0±0.3 2.0±0.2 0~0.15 6.0 2.8 2.5
All Dimensions in mm.
TAPE & REEL INFO
Blank portions
Blank portions Chip cavity
200mm or more 400mm or more
P
W
K
A
0
1
SURFACE MOUNTING TYPE, REEL/TAPE LIST
REEL SIZE (mm) TAPE SIZE (mm) QTY
A G P
1
W K
0
PCS/REEL
PA4340.XXXANLT Ø330 12.4+2/-0 8.0±0.1 12.0±0.3 3.3±0.1 2000
