SI7625DN-T1-GE3

Vishay Siliconix
Si7625DN
New Product
Document Number: 65737
S10-0638-Rev. A, 22-Mar-10
www.vishay.com
1
P-Channel 30 V (D-S) MOSFET
FEATURES
Halogen-free According to IEC 61249-2-21
Definition
•TrenchFET
®
Power MOSFET
100% R
g
Tested
100% UIS Tested
Compliant to RoHS Directive 2002/95/EC
APPLICATIONS
Notebook Adapter Switch
Notebook Load Switch
PRODUCT SUMMARY
V
DS
(V) R
DS(on)
(Ω)I
D
(A) Q
g
(Typ.)
- 30
0.007 at V
GS
= - 10 V
- 35
d
39.5 nC
0.011 at V
GS
= - 4.5 V
- 35
d
Notes:
a. Surface mounted on 1" x 1" FR4 board.
b. t = 10 s.
c. Maximum under steady state conditions is 81 °C/W.
d. Package limited.
e. See solder profile (www.vishay.com/doc?73257
). The PowerPAK 1212-8 is a leadless package. The end of the lead terminal is exposed copper
(not plated) as a result of the singulation process in manufacturing. A solder fillet at the exposed copper tip cannot be guaranteed and is not
required to ensure adequate bottom side solder interconnection.
f. Rework conditions: manual soldering with a soldering iron is not recommended for leadless components.
ABSOLUTE MAXIMUM RATINGS T
A
= 25 °C, unless otherwise noted
Parameter Symbol Limit Unit
Drain-Source Voltage
V
DS
- 30
V
Gate-Source Voltage
V
GS
± 20
Continuous Drain Current (T
J
= 150 °C)
T
C
= 25 °C
I
D
- 35
d
A
T
C
= 70 °C
- 35
d
T
A
= 25 °C
- 17.3
a, b
T
A
= 70 °C
- 13.8
a, b
Pulsed Drain Current
I
DM
- 80
Continuous Source-Drain Diode Current
T
C
= 25 °C
I
S
- 35
d
T
A
= 25 °C
- 3.0
a, b
Avalanche Current
L = 0.1 mH
I
AS
- 20
Single-Pulse Avalanche Energy
E
AS
20 mJ
Maximum Power Dissipation
T
C
= 25 °C
P
D
52
W
T
C
= 70 °C 33
T
A
= 25 °C
3.7
a, b
T
A
= 70 °C
2.4
a, b
Operating Junction and Storage Temperature Range
T
J
, T
stg
- 55 to 150
°C
Soldering Recommendations (Peak Temperature)
e, f
260
THERMAL RESISTANCE RATINGS
Parameter Symbol Typical Maximum Unit
Maximum Junction-to-Ambient
a, c
t 10 s
R
thJA
26 33
°C/W
Maximum Junction-to-Case
Steady State
R
thJC
1.9 2.4
S
G
D
P-Channel MOSFET
1
2
3
4
5
6
7
8
S
S
S
G
D
D
D
D
3.30 mm 3.30 mm
PowerPAK
®
1212-8
Bottom View
Ordering Information: Si7625DN-T1-GE3 (Lead (Pb)-free and Halogen-free)
www.vishay.com
2
Document Number: 65737
S10-0638-Rev. A, 22-Mar-10
Vishay Siliconix
Si7625DN
New Product
Notes:
a. Pulse test; pulse width 300 µs, duty cycle 2 %.
b. Guaranteed by design, not subject to production testing.
Stresses beyond those listed under “Absolute Maximum Ratings” may cause permanent damage to the device. These are stress ratings only, and functional operation
of the device at these or any other conditions beyond those indicated in the operational sections of the specifications is not implied. Exposure to absolute maximum
rating conditions for extended periods may affect device reliability.
SPECIFICATIONS T
J
= 25 °C, unless otherwise noted
Parameter Symbol Test Conditions Min. Typ. Max. Unit
Static
Drain-Source Breakdown Voltage
V
DS
V
GS
= 0 V, I
D
= - 250 µA
- 30 V
V
DS
Temperature Coefficient ΔV
DS
/T
J
I
D
= - 250 µA
- 23
mV/°C
V
GS(th)
Temperature Coefficient ΔV
GS(th)
/T
J
5.0
Gate-Source Threshold Voltage
V
GS(th)
V
DS
= V
GS
, I
D
= - 250 µA
- 1.0 - 2.5 V
Gate-Source Leakage
I
GSS
V
DS
= 0 V, V
GS
= ± 20 V
± 100 nA
Zero Gate Voltage Drain Current
I
DSS
V
DS
= - 30 V, V
GS
= 0 V
- 1
µA
V
DS
= - 30 V, V
GS
= 0 V, T
J
= 55 °C
- 5
On-State Drain Current
a
I
D(on)
V
DS
- 10 V, V
GS
= - 10 V - 30 A
Drain-Source On-State Resistance
a
R
DS(on)
V
GS
= - 10 V, I
D
= - 15 A
0.0056 0.007
Ω
V
GS
= - 4.5 V, I
D
= - 10 A
0.0088 0.011
Forward Transconductance
a
g
fs
V
DS
= - 10 V, I
D
= - 15 A
47 S
Dynamic
b
Input Capacitance
C
iss
V
DS
= - 15 V, V
GS
= 0 V, f = 1 MHz
4427
pFOutput Capacitance
C
oss
452
Reverse Transfer Capacitance
C
rss
430
Total Gate Charge
Q
g
V
DS
= - 15 V, V
GS
= - 10 V, I
D
= - 10 A
84.5 126
nC
V
DS
= - 15 V, V
GS
= - 4.5 V, I
D
= - 10 A
39.5 60
Gate-Source Charge
Q
gs
11
Gate-Drain Charge
Q
gd
13.5
Gate Resistance
R
g
f = 1 MHz 0.4 1.8 3.6 Ω
Tur n - O n D e l ay Time
t
d(on)
V
DD
= - 15 V, R
L
= 1.5 Ω
I
D
- 10 A, V
GEN
= - 10 V, R
g
= 1 Ω
15 30
ns
Rise Time
t
r
13 26
Turn-Off DelayTime
t
d(off)
55 100
Fall Time
t
f
10 20
Tur n - O n D e l ay Time
t
d(on)
V
DD
= - 15 V, R
L
= 1.5 Ω
I
D
- 10 A, V
GEN
= - 4.5 V, R
g
= 1 Ω
55 100
Rise Time
t
r
42 80
Turn-Off DelayTime
t
d(off)
52 100
Fall Time
t
f
17 34
Drain-Source Body Diode Characteristics
Continous Source-Drain Diode Current I
S
T
C
= 25 °C - 35
A
Pulse Diode Forward Current I
SM
- 80
Body Diode Voltage V
SD
I
S
= - 3 A, V
GS
= 0 V - 0.74 - 1.2 V
Body Diode Reverse Recovery Time t
rr
I
F
= - 10 A, dI/dt = 100 A/µs, T
J
= 25 °C
14 24 ns
Body Diode Reverse Recovery Charge Q
rr
48nC
Reverse Recovery Fall Time t
a
8
ns
Reverse Recovery Rise Time t
b
6
Document Number: 65737
S10-0638-Rev. A, 22-Mar-10
www.vishay.com
3
Vishay Siliconix
Si7625DN
New Product
TYPICAL CHARACTERISTICS 25 °C, unless otherwise noted
Output Characteristics
On-Resistance vs. Drain Current
Gate Charge
0
16
32
48
64
80
0.0 0.5 1.0 1.5 2.0 2.5
V
DS
- Drain-to-Source Voltage (V)
- Drain Current (A)I
D
V
GS
=10Vthru4V
V
GS
=3V
0.002
0.004
0.006
0.008
0.010
0.012
0 1632486480
R
DS(on)
- On-Resistance (Ω)
I
D
- Drain Current (A)
V
GS
=4.5V
V
GS
=10V
0
2
4
6
8
10
0 1836547290
I
D
=10A
- Gate-to-Source Voltage (V)
Q
g
- Total Gate Charge (nC)
V
GS
V
DS
=20V
V
DS
=10V
V
DS
=15V
Transfer Characteristics
Capacitance
On-Resistance vs. Junction Temperature
0
2
4
6
8
10
012345
V
GS
- Gate-to-Source Voltage (V)
- Drain Current (A)I
D
T
C
= 25 °C
T
C
= - 55 °C
T
C
= 125 °C
C
rss
0
1200
2400
3600
4800
6000
0 6 12 18 24 30
C
iss
V
DS
- Drain-to-Source Voltage (V)
C - Capacitance (pF)
C
oss
0.6
0.8
1.0
1.2
1.4
1.6
- 50 - 25 0 25 50 75 100 125 150
T
J
- Junction Temperature (°C)
(Normalized)
R
DS(on)
- On-Resistance
V
GS
=10V
V
GS
=4.5V
I
D
=15A

SI7625DN-T1-GE3

Mfr. #:
Manufacturer:
Vishay / Siliconix
Description:
MOSFET -30V Vds 20V Vgs PowerPAK 1212-8
Lifecycle:
New from this manufacturer.
Delivery:
DHL FedEx Ups TNT EMS
Payment:
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