IRF7353D1TRPBF

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l Co-packaged HEXFET
®
Power MOSFET
and Schottky Diode
l Ideal For Buck Regulator Applications
l N-Channel HEXFET
l Low V
F
Schottky Rectifier
l Generation 5 Technology
l SO-8 Footprint
l Lead-Free
IRF7353D1PbF
FETKY
ä
MOSFET / Schottky Diode
Parameter Maximum Units
R
θJA
Junction-to-Ambient 62.5 °C/W
Thermal Resistance Ratings
Description
V
DSS
= 30V
R
DS(on)
= 0.029
Schottky Vf = 0.39V
The FETKY family of co-packaged MOSFETs and Schottky diodes offers the
designer an innovative, board space saving solution for switching regulator
and power management applications. Generation 5 HEXFET Power
MOSFETs utilize advanced processing techniques to achieve extremely low
on-resistance per silicon area. Combinining this technology with
International Rectifier's low forward drop Schottky rectifiers results in an
extremely efficient device suitable for use in a wide variety of portable
electronics applications.
The SO-8 has been modified through a customized leadframe for
enhanced thermal characteristics. The SO-8 package is designed for vapor
phase, infrared or wave soldering techniques.
SO-8
10/7/04
Notes:
Repetitive rating; pulse width limited by maximum junction temperature (see figure 9)
Starting T
J
= 25°C, L = 10mH, R
G
= 25, I
AS
= 4.0A
I
SD
4.0A, di/dt 74A/µs, V
DD
V
(BR)DSS
, T
J
150°C
Surface mounted on FR-4 board, t 10sec.
Top View
8
1
2
3
4
5
6
7
A
A
S
G
D
D
K
K
Parameter Maximum Units
I
D
@ T
A
= 25°C Continuous Drain Current 6.5 A
I
D
@ T
A
= 70°C 5.2
I
DM
Pulsed Drain Current À 52
P
D
@T
A
= 25°C Power Dissipation 2.0 W
P
D
@T
A
= 70°C 1.3
Linear Derating Factor 16 mW/°C
V
GS
Gate-to-Source Voltage ± 20 V
dv/dt Peak Diode Recovery dv/dt Á -5.0 V/ns
T
J,
T
STG
Junction and Storage Temperature Range -55 to +150 °C
Absolute Maximum Ratings (T
A
= 25°C unless otherwise noted)
PD - 95251A
IRF7353D1PbF
2 www.irf.com
Parameter Min. Typ. Max. Units Conditions
V
(BR)DSS
Drain-to-Source Breakdown Voltage 30 V V
GS
= 0V, I
D
= 250µA
R
DS(on)
Static Drain-to-Source On-Resistance 0.023 0.032 V
GS
= 10V, I
D
= 5.8A
0.032 0.046 V
GS
= 4.5V, I
D
= 4.7A
V
GS(th)
Gate Threshold Voltage 1.0 V V
DS
= V
GS
, I
D
= 250µA
g
fs
Forward Transconductance 14 S V
DS
= 24V, I
D
= 5.8A
I
DSS
Drain-to-Source Leakage Current 1.0 V
DS
= 24V, V
GS
= 0V
——25 V
DS
= 24V, V
GS
= 0V, T
J
= 55°C
I
GSS
Gate-to-Source Forward Leakage 100 V
GS
= 20V
Gate-to-Source Reverse Leakage -100 V
GS
= -20V
Q
g
Total Gate Charge 22 33 I
D
= 5.8A
Q
gs
Gate-to-Source Charge 2.6 3.9 nC V
DS
= 24V
Q
gd
Gate-to-Drain ("Miller") Charge 6.4 9.6 V
GS
= 10V (see figure 8)
t
d(on)
Turn-On Delay Time 8.1 12 V
DD
= 15V
t
r
Rise Time 8.9 13 I
D
= 1.0A
t
d(off)
Turn-Off Delay Time 26 39 R
G
= 6.0
t
f
Fall Time 17 26 R
D
= 15
C
iss
Input Capacitance 650 V
GS
= 0V
C
oss
Output Capacitance 320 pF V
DS
= 25V
C
rss
Reverse Transfer Capacitance 130 ƒ = 1.0MHz (see figure 7)
MOSFET Electrical Characteristics @ T
J
= 25°C (unless otherwise specified)
µA
nA
ns
Parameter Min. Typ. Max. Units Conditions
I
S
Continuous Source Current (Body Diode) 2.5 A
I
SM
Pulsed Source Current (Body Diode) 30
V
SD
Body Diode Forward Voltage 0.78 1.0 V T
J
= 25°C, I
S
= 1.7A, V
GS
= 0V
t
rr
Reverse Recovery Time (Body Diode) 45 68 ns T
J
= 25°C, I
F
= 1.7A
Q
rr
Reverse Recovery Charge 58 87 nC di/dt = 100A/µs
Â
MOSFET Source-Drain Ratings and Characteristics
Parameter Max. Units. Conditions
I
F(av)
Max. Average Forward Current 2.7 50% Duty Cycle. Rectangular Wave, T
A
= 25°C
1.9 T
A
= 70°C
I
SM
Max. peak one cycle Non-repetitive 120 5µs sine or 3µs Rect. pulse Following any rated
Surge current 11 10ms sine or 6ms Rect. pulse load condition &
with V
RRM
applied
A
A
Schottky Diode Maximum Ratings
Schottky Diode Electrical Specifications
V
mA
Parameter Max. Units Conditions
V
FM
Max. Forward voltage drop 0.50 I
F
= 1.0A, T
J
= 25°C
0.62 I
F
= 2.0A, T
J
= 25°C
0.39 I
F
= 1.0A, T
J
= 125°C
0.57 I
F
= 2.0A, T
J
= 125°C .
I
RM
Max. Reverse Leakage current 0.06 V
R
= 30V T
J
= 25°C
16 T
J
= 125°C
C
t
Max. Junction Capacitance 92 pF V
R
= 5Vdc ( 100kHz to 1 MHz) 25°C
dv/dt Max. Voltage Rate of Charge 3600 V/ µs Rated V
R
See Fig. 14
IRF7353D1PbF
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Fig 3. Typical Transfer Characteristics
Fig 2. Typical Output Characteristics
Fig 1. Typical Output Characteristics
Fig 4. Normalized On-Resistance
Vs. Temperature
Power Mosfet Characteristics
1
10
100
0.1 1 10
20µs PULSE WIDTH
T = 25°C
A
J
DS
V , Drain-to-Source Voltage (V)
3.0V
VGS
TOP 15V
10V
7.0V
5.5V
4.5V
4.0V
3.5V
BOTTOM 3.0V
D
I , Drain-to-Source Current (A)
1
10
100
0.1 1 10
A
DS
V , Drain-to-Source Voltage (V)
D
I , Drain-to-Source Current (A)
20µs PULSE WIDTH
T = 150°C
J
3.0V
VGS
TOP 15V
10V
7.0V
5.5V
4.5V
4.0V
3.5V
BOTTOM 3.0V
1
10
100
3.0 3.5 4.0 4.5 5.0
T = 25°C
T = 150°C
J
J
GS
V , Gate-to-Source Voltage (V)
D
I , Drain-to-Source Current (A)
A
V = 10V
20µs PULSE WIDTH
DS
-60 -40 -20 0 20 40 60 80 100 120 140 160
0.0
0.5
1.0
1.5
2.0
T , Junction Temperature ( C)
R , Drain-to-Source On Resistance
(Normalized)
J
DS(on)
°
V =
I =
GS
D
10V
5.8A

IRF7353D1TRPBF

Mfr. #:
Manufacturer:
Infineon / IR
Description:
MOSFET MOSFT w/Schttky 30V 6.5A 32mOhm 22nC
Lifecycle:
New from this manufacturer.
Delivery:
DHL FedEx Ups TNT EMS
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