LS T67K-J1L2-1-Z Datasheet LS T67K-J1L2-1-Z, LS T67K-K1L2-1-Z, LS T67K-J1K2-1-0-2-R33-Z | P10-P12

2014-01-08 10

Version 1.1 LS T67K

Package Outline

9) page 18

Maßzeichnung

9) Seite 18

Approximate Weight: 34 mg

Gewicht: 34 mg

Mark: bevelled edge (Cathode)

Markierung: abgeschrägte Ecke (Kathode)

Corrosion robustness: Test conditions: 40 °C / 90 % rh / 15 ppm H

S / 336 h

= Stricter than IEC 60068-2-43 (H

S) [25°C / 75 % rh

/ 10 ppm H

S / 21 days]

= Regarding relevant gas (H

S) stricter than EN

60068-2-60 (method 4) [25 °C / 75 % rh / 200 ppb

, 200 ppb NO

10 ppb Cl

/ 21 days]

Korrosionsfestigkeit: Test Kondition: 40°C / 90 % rh / 15 ppm H

S / 336 h

= Besser als IEC 60068-2-43 (H

S) [25°C / 75 % rh /

10 ppm H

S / 21 Tage]

= Bezogen auf das Gas (H

S) besser als EN

60068-2-60 (method 4) [25°C / 75 % rh / 200ppb

, 200ppb NO

10ppb Cl

/ 21 Tage]

GPLY6724

0.7 (0.028)

0.9 (0.035)

1.7 (0.067)

2.1 (0.083)

0.12 (0.005)

0.18 (0.007)

0.5 (0.020)

1.1 (0.043)

3.3 (0.130)

3.7 (0.146)

0.4 (0.016)

0.6 (0.024)

2.6 (0.102)

3.0 (0.118)

2.1 (0.083)

2.3 (0.091)

Cathode marking

3.0 (0.118)

3.4 (0.134)

(2.4) (0.095)

0.1 (0.004) (typ.)

4˚±1

Version 1.1 LS T67K

2014-01-08 11

Recommended Solder Pad

9) page 18

Reflow soldering

Empfohlenes Lötpaddesign

9) Seite 18

Reflow-Löten

Recommended Solder Pad

9) page 18

Reflow soldering

Empfohlenes Lötpaddesign

9) Seite 18

Reflow-Löten

OHLPY970

4.5 (0.177)

2.6 (0.102)

1.5 (0.059)

Cu-area > 16 mm

Cu-Fläche > 16 mm

Solder resist

Lötstopplack

4.5 (0.177)

1.5 (0.059)

2.6 (0.102)

Padgeometrie für

improved heat dissipation

verbesserte Wärmeableitung

Paddesign for

OHLPY440

Padgeometrie für

verbesserte Wärmeableitung

improved heat dissipation

Paddesign for

Lötstoplack

Solder resist

0.8 (0.031)

3.7 (0.146)

1.1 (0.043)

2.3 (0.091)

3.3 (0.130)

1.5 (0.059)

11.1 (0.437)

Cu Fläche / 16 mm per pad

Cu-area

3.3 (0.130)

Kathode/

Cathode

Anode

0.7 (0.028)

Fläche darf bei Verwendung von TOPLED

For TOPLED

assembly do not use

elektrisch nicht beschaltet werden.

this area for electrical contact

Fläche darf bei Verwendung von TOPLED

For TOPLED

assembly do not use

elektrisch nicht beschaltet werden.

this area for electrical contact

2014-01-08 12

Version 1.1 LS T67K

Reflow Soldering Profile

Reflow-Lötprofil

Preconditioning: JEDEC Level 2 acc. to JEDEC J-STD-020D.01

OHA04525

100

150

200

250

300

50 100 150 200 250 300

˚C

240 ˚C

217 ˚C

245 ˚C

25 ˚C

OHA04612

Profile Feature

Profil-Charakteristik

Ramp-up rate to preheat*

)

25 °C to 150 °C

2 3 K/s

Time t

Smin

to T

Smax

100 12060

10 20 30

80 100

217

2 3

245 260

3 6

Time

25 °C to T

Time within 5 °C of the specified peak

temperature T

- 5 K

Ramp-down rate*

to 100 °C

All temperatures refer to the center of the package, measured on the top of the component

* slope calculation DT/Dt: Dt max. 5 s; fulfillment for the whole T-range

Ramp-up rate to peak*

)

Smax

to T

Liquidus temperature

Peak temperature

Time above liquidus temperature

Symbol

Unit

Einheit

Pb-Free (SnAgCu) Assembly

Minimum MaximumRecommendation

K/s

°C

480

P1-P3 P4-P6 P7-P9 P10-P12 P13-P15 P16-P18 P19-P19

LS T67K-J1L2-1-Z

Mfr. #:

Buy LS T67K-J1L2-1-Z

Manufacturer:

OSRAM Opto Semiconductors

Description:

Standard LEDs - SMD Super Red, 630nm 18mcd, 2mA

Lifecycle:

New from this manufacturer.

Delivery:

DHL FedEx Ups TNT EMS

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LS T67K-J1L2-1-Z

LS T67K-J1L2-1-Z

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